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PMG45UN,115 PMG45UN,115 NXP USA Inc. PMG45UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 3A SOT363
Produkt ist nicht verfügbar
PMV65UN,215 PMV65UN,215 NXP USA Inc. PMV65UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 2.2A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.2A (Ta)
Rds On (Max) @ Id, Vgs: 76mOhm @ 2A, 4.5V
Power Dissipation (Max): 310mW (Ta), 2.17W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.9 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 183 pF @ 10 V
Produkt ist nicht verfügbar
PMV90EN,215 PMV90EN,215 NXP USA Inc. PMV90EN.pdf Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Produkt ist nicht verfügbar
SA616BS,115 SA616BS,115 NXP USA Inc. SA616.pdf Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: With Amplifier
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
SL2ICS5401EW/V7,00 NXP USA Inc. SL113730.pdf Description: IC I-CODE SLI SMART LABEL DIE
Produkt ist nicht verfügbar
SL3S1013FTB0,115 SL3S1013FTB0,115 NXP USA Inc. SL3S1003_1013.pdf Description: RFID TAG R/W 840-960MHZ INLAY
Packaging: Tape & Reel (TR)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Inlay
Frequency: 840MHz ~ 960MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: EPC
Writable Memory: 256b (EPC)
Part Status: Active
Produkt ist nicht verfügbar
SSL1523AP/N2,112 NXP USA Inc. SSL1523A.pdf Description: IC LED DVR SMPS CTLR 8DIP
Produkt ist nicht verfügbar
SSL2109T/1,118 SSL2109T/1,118 NXP USA Inc. SSL2109T.pdf Description: IC LED DRIVER OFFL SWITCHER 8SO
Produkt ist nicht verfügbar
SSL3252UK/C2,515 NXP USA Inc. SSL3252.pdf Description: IC LED DVR PHOTO FLASH UNCASED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
TDA19977AHV/15C184 NXP USA Inc. TDA19977A,B.pdf Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
TDA19977AHV15C184, NXP USA Inc. TDA19977A,B.pdf Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
TDA19977AHV15C184: NXP USA Inc. TDA19977A,B.pdf Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
TDA8020HL/C2,151 NXP USA Inc. TDA8020HL.pdf Description: IC SMART CARD INTERFACE 32LQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8024AT/C1,112 NXP USA Inc. TDA8024.pdf Description: IC SMART CARD INTERFACE 28SOIC
Packaging: Tube
Produkt ist nicht verfügbar
TDA8029HL/C207,151 TDA8029HL/C207,151 NXP USA Inc. TDA8029.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
TEA1703TS/N1,115 TEA1703TS/N1,115 NXP USA Inc. TEA1703TS.pdf Description: IC CTLR SMPS STANDBY 6TSOP
Produkt ist nicht verfügbar
TEA1723BT/N1,118 NXP USA Inc. TEA1723BT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.17 EUR
5000+ 1.12 EUR
12500+ 1.08 EUR
Mindestbestellmenge: 2500
TEA1723FT/N1,118 NXP USA Inc. TEA1723FT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.15 EUR
5000+ 1.09 EUR
Mindestbestellmenge: 2500
TEA1733CP/N1,112 TEA1733CP/N1,112 NXP USA Inc. TEA1733CP.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
TEA1733CT/N1,118 TEA1733CT/N1,118 NXP USA Inc. TEA1733CT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
TJA1022T,118 TJA1022T,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.57 EUR
Mindestbestellmenge: 2500
TJA1022TK,118 TJA1022TK,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
Produkt ist nicht verfügbar
TJA1027T/20,118 TJA1027T/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.86 EUR
Mindestbestellmenge: 2500
TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
TLVH431AQDBVR,115 TLVH431AQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT 18V 1% 5TSOP
Produkt ist nicht verfügbar
TLVH431DMQDBZR,215 TLVH431DMQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±0.75%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
TLVH431DQDBVR,115 TLVH431DQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Packaging: Tape & Reel (TR)
Tolerance: ±0.75%
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
TLVH431DQDBZR,215 TLVH431DQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±0.75%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
UBA2081P/1,112 NXP USA Inc. UBA2080(A),2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
UBA2081T/1,518 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
UBA2213AP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
UBA2213BP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
UBA2213BT/N1,518 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
X3G-OH048,005 NXP USA Inc. X3G_T_OH047_048.pdf Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
CBTL06DP213EE,118 CBTL06DP213EE,118 NXP USA Inc. CBTL06DP213.pdf Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe
On-State Resistance (Max): 14Ohm (Typ)
-3db Bandwidth: 11.1GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Active
Number of Channels: 6
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+2.39 EUR
6000+ 2.3 EUR
Mindestbestellmenge: 3000
SC16IS741IPW,118 SC16IS741IPW,118 NXP USA Inc. SC16IS741.pdf Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TDA8595SD/N2S,112 NXP USA Inc. TDA8595.pdf Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8596TH/N1S,118 NXP USA Inc. Description: IC AUDIO AMP BTL 4X45W 36HSOP
Produkt ist nicht verfügbar
TDF8541JS/N2,512 TDF8541JS/N2,512 NXP USA Inc. 75017062.pdf Description: IC AMP CLSS AB QUAD 64W 27DBSMSP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1716T/1,518 TEA1716T/1,518 NXP USA Inc. Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
JENNET-IP-EK040 JENNET-IP-EK040 NXP USA Inc. JENNET-IP-EK040_PB.pdf Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
LPC11U34FBD48/311, LPC11U34FBD48/311, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 40KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.38 EUR
10+ 8.1 EUR
80+ 6.64 EUR
Mindestbestellmenge: 2
LPC11U34FHN33/311, LPC11U34FHN33/311, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 40KB FLASH 32HVQFN
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
LPC11U35FBD48/401, LPC11U35FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
LPC11U35FBD64/401, LPC11U35FBD64/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC11U35FHI33/501, LPC11U35FHI33/501, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.95 EUR
10+ 9.34 EUR
80+ 7.65 EUR
490+ 7.49 EUR
Mindestbestellmenge: 2
LPC11U36FBD48/401, LPC11U36FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.88 EUR
10+ 9.33 EUR
80+ 7.73 EUR
Mindestbestellmenge: 2
LPC11U37FBD48/401, LPC11U37FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
LPC1315FBD48,551 LPC1315FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1750 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.83 EUR
10+ 9.24 EUR
80+ 7.57 EUR
500+ 7.41 EUR
1000+ 6.25 EUR
Mindestbestellmenge: 2
LPC1316FBD48,551 LPC1316FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.4 EUR
10+ 6.59 EUR
80+ 5.46 EUR
Mindestbestellmenge: 3
LPC1317FBD48,551 LPC1317FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 349 Stücke:
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LPC1345FBD48,151 LPC1345FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC1347FBD48,151 LPC1347FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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2+15.4 EUR
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LPC1317FBD64,551 LPC1317FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC1347FBD64,551 LPC1347FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 207 Stücke:
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LPC1316FHN33,551 LPC1316FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
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3+7.99 EUR
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LPC1317FHN33,551 LPC1317FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
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2+12.32 EUR
10+ 9.68 EUR
80+ 8.02 EUR
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LPC1347FHN33,551 LPC1347FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 226 Stücke:
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2+14.87 EUR
10+ 11.68 EUR
80+ 9.67 EUR
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TWR-K60D100M TWR-K60D100M NXP USA Inc. TWR-K60D100MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
Produkt ist nicht verfügbar
LPC4357FET256,551 LPC4357FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PMG45UN,115 PMG45UN_Rev_Nov_2012.pdf
PMG45UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 3A SOT363
Produkt ist nicht verfügbar
PMV65UN,215 PMV65UN_Rev_Nov_2012.pdf
PMV65UN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 2.2A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.2A (Ta)
Rds On (Max) @ Id, Vgs: 76mOhm @ 2A, 4.5V
Power Dissipation (Max): 310mW (Ta), 2.17W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.9 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 183 pF @ 10 V
Produkt ist nicht verfügbar
PMV90EN,215 PMV90EN.pdf
PMV90EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Produkt ist nicht verfügbar
SA616BS,115 SA616.pdf
SA616BS,115
Hersteller: NXP USA Inc.
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: With Amplifier
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
SL2ICS5401EW/V7,00 SL113730.pdf
Hersteller: NXP USA Inc.
Description: IC I-CODE SLI SMART LABEL DIE
Produkt ist nicht verfügbar
SL3S1013FTB0,115 SL3S1003_1013.pdf
SL3S1013FTB0,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 840-960MHZ INLAY
Packaging: Tape & Reel (TR)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Inlay
Frequency: 840MHz ~ 960MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: EPC
Writable Memory: 256b (EPC)
Part Status: Active
Produkt ist nicht verfügbar
SSL1523AP/N2,112 SSL1523A.pdf
Hersteller: NXP USA Inc.
Description: IC LED DVR SMPS CTLR 8DIP
Produkt ist nicht verfügbar
SSL2109T/1,118 SSL2109T.pdf
SSL2109T/1,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Produkt ist nicht verfügbar
SSL3252UK/C2,515 SSL3252.pdf
Hersteller: NXP USA Inc.
Description: IC LED DVR PHOTO FLASH UNCASED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
TDA19977AHV/15C184 TDA19977A,B.pdf
Hersteller: NXP USA Inc.
Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
TDA19977AHV15C184, TDA19977A,B.pdf
Hersteller: NXP USA Inc.
Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
TDA19977AHV15C184: TDA19977A,B.pdf
Hersteller: NXP USA Inc.
Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
TDA8020HL/C2,151 TDA8020HL.pdf
Hersteller: NXP USA Inc.
Description: IC SMART CARD INTERFACE 32LQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8024AT/C1,112 TDA8024.pdf
Hersteller: NXP USA Inc.
Description: IC SMART CARD INTERFACE 28SOIC
Packaging: Tube
Produkt ist nicht verfügbar
TDA8029HL/C207,151 TDA8029.pdf
TDA8029HL/C207,151
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
TEA1703TS/N1,115 TEA1703TS.pdf
TEA1703TS/N1,115
Hersteller: NXP USA Inc.
Description: IC CTLR SMPS STANDBY 6TSOP
Produkt ist nicht verfügbar
TEA1723BT/N1,118 TEA1723BT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+1.17 EUR
5000+ 1.12 EUR
12500+ 1.08 EUR
Mindestbestellmenge: 2500
TEA1723FT/N1,118 TEA1723FT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+1.15 EUR
5000+ 1.09 EUR
Mindestbestellmenge: 2500
TEA1733CP/N1,112 TEA1733CP.pdf
TEA1733CP/N1,112
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
TEA1733CT/N1,118 TEA1733CT.pdf
TEA1733CT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
TJA1022T,118 TJA1022.pdf
TJA1022T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+1.57 EUR
Mindestbestellmenge: 2500
TJA1022TK,118 TJA1022.pdf
TJA1022TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
Produkt ist nicht verfügbar
TJA1027T/20,118 TJA1027.pdf
TJA1027T/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+0.86 EUR
Mindestbestellmenge: 2500
TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
TLVH431AQDBVR,115 TLVH431_Family.pdf
TLVH431AQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT 18V 1% 5TSOP
Produkt ist nicht verfügbar
TLVH431DMQDBZR,215 TLVH431_Family.pdf
TLVH431DMQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±0.75%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
TLVH431DQDBVR,115 TLVH431_Family.pdf
TLVH431DQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Packaging: Tape & Reel (TR)
Tolerance: ±0.75%
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
TLVH431DQDBZR,215 TLVH431_Family.pdf
TLVH431DQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±0.75%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
UBA2081P/1,112 UBA2080(A),2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
UBA2081T/1,518 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
UBA2213AP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
UBA2213BP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
UBA2213BT/N1,518
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
X3G-OH048,005 X3G_T_OH047_048.pdf
Hersteller: NXP USA Inc.
Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
CBTL06DP213EE,118 CBTL06DP213.pdf
CBTL06DP213EE,118
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe
On-State Resistance (Max): 14Ohm (Typ)
-3db Bandwidth: 11.1GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Active
Number of Channels: 6
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3000+2.39 EUR
6000+ 2.3 EUR
Mindestbestellmenge: 3000
SC16IS741IPW,118 SC16IS741.pdf
SC16IS741IPW,118
Hersteller: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TDA8595SD/N2S,112 TDA8595.pdf
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8596TH/N1S,118
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W 36HSOP
Produkt ist nicht verfügbar
TDF8541JS/N2,512 75017062.pdf
TDF8541JS/N2,512
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 64W 27DBSMSP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1716T/1,518
TEA1716T/1,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
JENNET-IP-EK040 JENNET-IP-EK040_PB.pdf
JENNET-IP-EK040
Hersteller: NXP USA Inc.
Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
LPC11U34FBD48/311, LPC11U3X.pdf
LPC11U34FBD48/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.38 EUR
10+ 8.1 EUR
80+ 6.64 EUR
Mindestbestellmenge: 2
LPC11U34FHN33/311, LPC11U3X.pdf
LPC11U34FHN33/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
LPC11U35FBD48/401, LPC11U3X.pdf
LPC11U35FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
LPC11U35FBD64/401, LPC11U3X.pdf
LPC11U35FBD64/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC11U35FHI33/501, LPC11U3X.pdf
LPC11U35FHI33/501,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.95 EUR
10+ 9.34 EUR
80+ 7.65 EUR
490+ 7.49 EUR
Mindestbestellmenge: 2
LPC11U36FBD48/401, LPC11U3X.pdf
LPC11U36FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.88 EUR
10+ 9.33 EUR
80+ 7.73 EUR
Mindestbestellmenge: 2
LPC11U37FBD48/401, LPC11U3X.pdf
LPC11U37FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
LPC1315FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1315FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.83 EUR
10+ 9.24 EUR
80+ 7.57 EUR
500+ 7.41 EUR
1000+ 6.25 EUR
Mindestbestellmenge: 2
LPC1316FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1316FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.4 EUR
10+ 6.59 EUR
80+ 5.46 EUR
Mindestbestellmenge: 3
LPC1317FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 349 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+8.94 EUR
10+ 7.02 EUR
80+ 5.81 EUR
Mindestbestellmenge: 2
LPC1345FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1345FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 173 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.43 EUR
10+ 10.54 EUR
80+ 8.73 EUR
Mindestbestellmenge: 2
LPC1347FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1347FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.4 EUR
10+ 12.09 EUR
80+ 10.01 EUR
Mindestbestellmenge: 2
LPC1317FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.29 EUR
10+ 10.44 EUR
Mindestbestellmenge: 2
LPC1347FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1347FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.8 EUR
10+ 12.42 EUR
160+ 10.28 EUR
Mindestbestellmenge: 2
LPC1316FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1316FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.99 EUR
10+ 6.28 EUR
80+ 5.2 EUR
Mindestbestellmenge: 3
LPC1317FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1317FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.32 EUR
10+ 9.68 EUR
80+ 8.02 EUR
Mindestbestellmenge: 2
LPC1347FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1347FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 226 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.87 EUR
10+ 11.68 EUR
80+ 9.67 EUR
Mindestbestellmenge: 2
TWR-K60D100M TWR-K60D100MQSG.pdf
TWR-K60D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
Produkt ist nicht verfügbar
LPC4357FET256,551 LPC435X_3X_2X_1X.pdf
LPC4357FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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