Produkte > INFINEON TECHNOLOGIES > Alle Produkte des Herstellers INFINEON TECHNOLOGIES (140108) > Seite 440 nach 2336
Foto | Bezeichnung | Hersteller | Beschreibung |
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FF225R65T3E3P2BPSA1 | Infineon Technologies |
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: 125°C (TJ) Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A NTC Thermistor: No Supplier Device Package: AG-XHP3K65 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 225 A Voltage - Collector Emitter Breakdown (Max): 5900 V Power - Max: 1000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V |
Produkt ist nicht verfügbar |
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FF225R65T3E3P3BPMA1 | Infineon Technologies |
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: 125°C (TJ) Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A NTC Thermistor: No Supplier Device Package: AG-XHP3K65 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 225 A Voltage - Collector Emitter Breakdown (Max): 5900 V Power - Max: 1000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V |
Produkt ist nicht verfügbar |
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FF225R65T3E3P4BPMA1 | Infineon Technologies |
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: 125°C (TJ) Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A NTC Thermistor: No Supplier Device Package: AG-XHP3K65 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 225 A Voltage - Collector Emitter Breakdown (Max): 5900 V Power - Max: 1000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V |
Produkt ist nicht verfügbar |
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FF225R65T3E3P5BPMA1 | Infineon Technologies |
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: 125°C (TJ) Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A NTC Thermistor: No Supplier Device Package: AG-XHP3K65 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 225 A Voltage - Collector Emitter Breakdown (Max): 5900 V Power - Max: 1000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V |
Produkt ist nicht verfügbar |
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FF225R65T3E3P6BPMA1 | Infineon Technologies |
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: 125°C (TJ) Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A NTC Thermistor: No Supplier Device Package: AG-XHP3K65 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 225 A Voltage - Collector Emitter Breakdown (Max): 5900 V Power - Max: 1000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V |
Produkt ist nicht verfügbar |
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FF450R33T3E3B5P3BPMA1 | Infineon Technologies |
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K3 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.75V @ 15V, 450A NTC Thermistor: No Supplier Device Package: AG-XHP3K33 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 450 A Voltage - Collector Emitter Breakdown (Max): 3300 V Power - Max: 1000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 84 nF @ 25 V |
Produkt ist nicht verfügbar |
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SAK-XC822MT-1FRA AA | Infineon Technologies |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 24MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: XC800 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V Connectivity: I²C, SSC, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: PG-TSSOP-16-1 Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XMC1100T016F0008AAXUMA1 | Infineon Technologies | Description: IC MCU 32BIT 8KB FLASH 16TSSOP |
Produkt ist nicht verfügbar |
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XMC1202T016X0032AAXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 11x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT Supplier Device Package: PG-TSSOP-16-8 Part Status: Obsolete Number of I/O: 11 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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IAUZ40N10S5L120ATMA1 | Infineon Technologies |
Description: MOSFET_(75V 120V( PG-TSDSON-8 Packaging: Tape & Reel (TR) Package / Case: 8-PowerTDFN Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 46A (Tj) Rds On (Max) @ Id, Vgs: 12mOhm @ 20A, 10V Power Dissipation (Max): 62W (Tc) Vgs(th) (Max) @ Id: 2.2V @ 27µA Supplier Device Package: PG-TSDSON-8-33 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 22.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1589 pF @ 50 V |
Produkt ist nicht verfügbar |
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IM512L6AXKMA1 | Infineon Technologies |
Description: CIPOS MINI COOLMOS Packaging: Bulk Package / Case: 24-PowerDIP Module (1.028", 26.10mm) Mounting Type: Through Hole Function: Driver Current - Output: 10A Interface: PWM Operating Temperature: -40°C ~ 125°C Output Configuration: Half Bridge (2) Voltage - Supply: 14V ~ 18.5V Applications: General Purpose Technology: Power MOSFET Supplier Device Package: 24-DIP Motor Type - Stepper: Multiphase Part Status: Last Time Buy |
auf Bestellung 1165 Stücke: Lieferzeit 10-14 Tag (e) |
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IM512L6AXKMA1 | Infineon Technologies |
Description: CIPOS MINI COOLMOS Packaging: Tube Package / Case: 24-PowerDIP Module (1.028", 26.10mm) Mounting Type: Through Hole Function: Driver Current - Output: 10A Interface: PWM Operating Temperature: -40°C ~ 125°C Output Configuration: Half Bridge (2) Voltage - Supply: 14V ~ 18.5V Applications: General Purpose Technology: Power MOSFET Supplier Device Package: 24-DIP Motor Type - Stepper: Multiphase Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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S26KL128SDABHA020 | Infineon Technologies |
Description: IC FLASH 128MBIT HYPERBUS 24FBGA Packaging: Tray Package / Case: 24-VBGA Mounting Type: Surface Mount Memory Size: 128Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 100 MHz Memory Format: FLASH Supplier Device Package: 24-FBGA (6x8) Grade: Automotive Memory Interface: HyperBus Access Time: 96 ns Memory Organization: 16M x 8 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S26KL128SDABHN020 | Infineon Technologies | Description: IC FLASH 128MBIT PAR 24FBGA |
auf Bestellung 678 Stücke: Lieferzeit 10-14 Tag (e) |
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S26KL128SDABHN020 | Infineon Technologies | Description: IC FLASH 128MBIT PAR 24FBGA |
Produkt ist nicht verfügbar |
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S26KL256SDABHB020 | Infineon Technologies | Description: IC FLASH 256MBIT PAR 24FBGA |
auf Bestellung 678 Stücke: Lieferzeit 10-14 Tag (e) |
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S26KL512SDABHI020 | Infineon Technologies |
Description: IC FLASH 512MBIT PAR 24FBGA Packaging: Tray Package / Case: 24-VBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 100 MHz Memory Format: FLASH Supplier Device Package: 24-FBGA (6x8) Part Status: Active Memory Interface: Parallel Access Time: 96 ns Memory Organization: 64M x 8 DigiKey Programmable: Not Verified |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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S26KL512SDABHI030 | Infineon Technologies |
Description: IC FLASH 512MBIT PAR 24FBGA Packaging: Tray Package / Case: 24-VBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 100 MHz Memory Format: FLASH Supplier Device Package: 24-FBGA (6x8) Part Status: Active Memory Interface: Parallel Access Time: 96 ns Memory Organization: 64M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TLE9845QXXUMA1 | Infineon Technologies | Description: EMBEDDED POWER |
Produkt ist nicht verfügbar |
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TLE9845QXXUMA1 | Infineon Technologies | Description: EMBEDDED POWER |
auf Bestellung 230 Stücke: Lieferzeit 10-14 Tag (e) |
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FS75R12KE3B9BPSA1 | Infineon Technologies |
Description: LOW POWER ECONO AG-ECONO2B-311 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: AG-ECONO2B Part Status: Active Current - Collector (Ic) (Max): 105 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 350 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 5.3 nF @ 25 V |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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FS75R12KE3BPSA1 | Infineon Technologies |
Description: LOW POWER ECONO AG-ECONO2B-311 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: AG-ECONO2B Part Status: Active Current - Collector (Ic) (Max): 105 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 350 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 5.3 nF @ 25 V |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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BCR205WH6327 | Infineon Technologies |
Description: DC-DC LED DRIVER AND CONTROL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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S29GL512S11DHA020 | Infineon Technologies |
Description: IC FLASH 512MBIT PARALLEL 64FBGA Packaging: Bulk Package / Case: 64-LBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 64-FBGA (9x9) Part Status: Active Write Cycle Time - Word, Page: 60ns Memory Interface: Parallel Access Time: 110 ns Memory Organization: 32M x 16 DigiKey Programmable: Not Verified |
auf Bestellung 6386 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4500-F144F1024AB | Infineon Technologies |
Description: 32-BIT MCU XMC4000 ARM CORTEX-M4 Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 160K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 28x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LED, POR, PWM, WDT Supplier Device Package: PG-LQFP-144-24 Part Status: Active Number of I/O: 91 |
Produkt ist nicht verfügbar |
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XMC4500F144K1024ABXQMA1 | Infineon Technologies | Description: 32-BIT INDUSTRIAL MICROCONTROLLE |
Produkt ist nicht verfügbar |
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IAUA180N08S5N026AUMA1 | Infineon Technologies |
Description: MOSFET_(75V 120V( PG-HSOF-5 Packaging: Tape & Reel (TR) Package / Case: 5-PowerSFN Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 180A (Tj) Rds On (Max) @ Id, Vgs: 2.6mOhm @ 90A, 10V Power Dissipation (Max): 179W (Tc) Vgs(th) (Max) @ Id: 3.8V @ 100µA Supplier Device Package: PG-HSOF-5-4 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 80 V Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5980 pF @ 40 V |
Produkt ist nicht verfügbar |
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CYV15G0104TRB-BGXC | Infineon Technologies |
Description: IC SERDES HOTLINK 256LBGA Packaging: Bulk Package / Case: 256-BGA Exposed Pad Output Type: PECL Mounting Type: Surface Mount Number of Outputs: 1/10 Function: Serializer/Deserializer Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.15V ~ 3.45V Data Rate: 1.485Gbps Input Type: PECL Number of Inputs: 10/1 Supplier Device Package: 256-L2BGA (27x27) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IRSM515-025PATRAUMA1 | Infineon Technologies |
Description: IC HALF BRIDGE DRIVER 1.5A SOP23 Packaging: Tape & Reel (TR) Features: Bootstrap Circuit Package / Case: 23-PowerSMD Module Mounting Type: Surface Mount Interface: Logic, PWM Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (3) Voltage - Supply: 13.5V ~ 16.5V Rds On (Typ): 3Ohm LS, 3Ohm HS Applications: AC Motors Current - Output / Channel: 1.5A Technology: MOSFET (Metal Oxide) Voltage - Load: 400V (Max) Supplier Device Package: PG-DIP-23-901/SOP 29x12F Fault Protection: UVLO Load Type: Inductive Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
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FF1000R17IE4DB2S4BOSA2 | Infineon Technologies | Description: IGBT MOD 1700V 1390A AGPRIME3-1 |
auf Bestellung 173 Stücke: Lieferzeit 10-14 Tag (e) |
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FF1000R17IE4DPB2BOSA1 | Infineon Technologies | Description: PP, IHM I, XHP 1,7KV |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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FF1000R17IE4S2BOSA1 | Infineon Technologies | Description: FF1000R17 - IGBT MODULE |
auf Bestellung 87 Stücke: Lieferzeit 10-14 Tag (e) |
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FF100R12MT4 | Infineon Technologies | Description: IGBT MODULE |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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OUTOFSHAFTFOR3D2GOTOBO1 | Infineon Technologies |
Description: OUT OF SHAFT FOR 3D 2 GO Packaging: Box For Use With/Related Products: Sensor2Go Accessory Type: Mounting Kit |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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IPP080N03L G | Infineon Technologies |
Description: MOSFET N-CH 30V 50A TO220-3 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 50A (Tc) Rds On (Max) @ Id, Vgs: 8mOhm @ 30A, 10V Power Dissipation (Max): 47W (Tc) Vgs(th) (Max) @ Id: 2.2V @ 250µA Supplier Device Package: PG-TO220-3-1 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 18 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 15 V |
Produkt ist nicht verfügbar |
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TT21401-44LQI28T | Infineon Technologies |
Description: IC MCU 32BIT 44QFN Packaging: Tape & Reel (TR) Package / Case: 44-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 500kHz Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I²C, SPI Supplier Device Package: 44-QFN (5x5) Part Status: Obsolete Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TT21401-44LQI33T | Infineon Technologies |
Description: IC MCU 32BIT 44QFN Packaging: Tape & Reel (TR) Package / Case: 44-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 500kHz Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I²C, SPI Supplier Device Package: 44-QFN (5x5) Part Status: Obsolete Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TT21401-44LQI35T | Infineon Technologies |
Description: IC MCU 32BIT 44QFN Packaging: Tape & Reel (TR) Package / Case: 44-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 500kHz Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I²C, SPI Supplier Device Package: 44-QFN (5x5) Part Status: Obsolete Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TT21401-48LQI36T | Infineon Technologies |
Description: IC MCU 32BIT 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 500kHz Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I²C, SPI Supplier Device Package: 48-QFN (6x6) Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TT21401-56LQI40T | Infineon Technologies |
Description: IC MCU 32BIT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 500kHz Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I²C, SPI Supplier Device Package: 56-QFN (6x6) Part Status: Obsolete Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MA12070P1XUMA1 | Infineon Technologies |
Description: AUDIO IC PG-VQFN-64 Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 4V ~ 26V Max Output Power x Channels @ Load: 30W x 2 @ 8Ohm Supplier Device Package: 64-QFN-EP (9x9) Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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IPD60R1K0CEAUMA1 | Infineon Technologies |
Description: MOSFET N-CH 600V 6.8A 61W TO252 Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.8A (Tc) Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V Power Dissipation (Max): 61W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 130µA Supplier Device Package: PG-TO252-3-344 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 600 V Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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IPD60R800CEAUMA1 | Infineon Technologies |
Description: CONSUMER Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 8.4A (Tc) Rds On (Max) @ Id, Vgs: 800mOhm @ 2A, 10V Power Dissipation (Max): 74W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 170µA Supplier Device Package: PG-TO252-3-344 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 600 V Gate Charge (Qg) (Max) @ Vgs: 17.2 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 373 pF @ 100 V |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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IPP45N06S409AKSA2 | Infineon Technologies |
Description: MOSFET N-CH 60V 45A TO220-3 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 45A (Tc) Rds On (Max) @ Id, Vgs: 9.4mOhm @ 45A, 10V Power Dissipation (Max): 71W (Tc) Vgs(th) (Max) @ Id: 4V @ 34µA Supplier Device Package: PG-TO220-3-1 Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 47 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3785 pF @ 25 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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DDB6U180N16RRB37BPSA1 | Infineon Technologies |
Description: LOW POWER ECONO AG-ECONO2B-411 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Single Chopper Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A NTC Thermistor: Yes Supplier Device Package: AG-ECONO2B IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 100 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 20 mW Current - Collector Cutoff (Max): 1 mA Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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DDB6U180N16RRB11BPSA2 | Infineon Technologies |
Description: LOW POWER ECONO AG-ECONO2B-411 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Single Chopper Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 100A NTC Thermistor: No Supplier Device Package: AG-ECONO2B IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 140 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 515 W Current - Collector Cutoff (Max): 1 mA Input Capacitance (Cies) @ Vce: 6.3 nF @ 25 V |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC1302T038X0064ABXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 64KB FLASH 38TSSOP Packaging: Tape & Reel (TR) Package / Case: 38-TFSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT Supplier Device Package: PG-TSSOP-38-9 Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC14S2Q040X0064AAXUMA1 | Infineon Technologies |
Description: 32-BIT INDUSTRIAL MICROCONTROLLE Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 14894 Stücke: Lieferzeit 10-14 Tag (e) |
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FS650R08A4P2BPSA1 | Infineon Technologies |
Description: HYBRID PACK 1 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 375A NTC Thermistor: Yes Supplier Device Package: AG-HYBDC6I-1 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 375 A Voltage - Collector Emitter Breakdown (Max): 750 V Power - Max: 20 mW Current - Collector Cutoff (Max): 1 mA Input Capacitance (Cies) @ Vce: 65 nF @ 50 V |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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FF600R12IP4PBPSA1 | Infineon Technologies |
Description: PP IHM I XHP 1 7KV AG-PRIME2-411 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: 2 Independent Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 600A NTC Thermistor: Yes Supplier Device Package: AG-PRIME2 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 600 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 20 mW Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 37 nF @ 25 V |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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IRLR3915 | Infineon Technologies | Description: IRLR3915 |
auf Bestellung 88 Stücke: Lieferzeit 10-14 Tag (e) |
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IPW60R0706P | Infineon Technologies |
Description: 600V COOLMOS N-CHANNEL POWER MOS Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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FP150R12N3T7B16BPSA1 | Infineon Technologies |
Description: LOW POWER ECONO AG-ECONO3B-711 Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Three Phase Bridge Rectifier Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 175°C (TJ) NTC Thermistor: Yes Supplier Device Package: AG-ECONO3 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 150 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 20 mW Current - Collector Cutoff (Max): 12 µA Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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FS500R17OE4DB81BPSA1 | Infineon Technologies |
Description: MEDIUM POWER ECONO Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 500A NTC Thermistor: Yes Supplier Device Package: AG-ECONOPP IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 500 A Voltage - Collector Emitter Breakdown (Max): 1700 V Power - Max: 20 mW Current - Collector Cutoff (Max): 3 mA Input Capacitance (Cies) @ Vce: 40 nF @ 25 V |
Produkt ist nicht verfügbar |
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BC846UE6727HTSA1 | Infineon Technologies |
Description: BC846 - GENERAL PURPOSE TRANSIST Packaging: Bulk Part Status: Active Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Transistor Type: 2 NPN (Dual) Operating Temperature: 150°C (TJ) Power - Max: 250mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 65V Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Frequency - Transition: 250MHz Supplier Device Package: PG-SC74-6 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 622496 Stücke: Lieferzeit 10-14 Tag (e) |
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BGAV1A10E6327XTSA1 | Infineon Technologies |
Description: IC RF AMP LTE 3.4GHZ-3.8GHZ 10AT Packaging: Bulk Package / Case: 10-UFQFN Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: LTE Voltage - Supply: 1.8V Gain: 3.3dB ~ 17.4dB Current - Supply: 4mA Noise Figure: 1.3dB ~ 3.2dB Test Frequency: 3.5GHz Part Status: Not For New Designs |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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S25FL032P0XNFV013M | Infineon Technologies |
Description: IC FLASH 32MBIT SPI/QUAD 8USON Packaging: Tray Package / Case: 8-UDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 32Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-USON (5x6) Part Status: Obsolete Write Cycle Time - Word, Page: 5µs, 3ms Memory Interface: SPI - Quad I/O Memory Organization: 4M x 8 |
Produkt ist nicht verfügbar |
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S25FL032P0XNFV003M | Infineon Technologies |
Description: IC FLASH 32MBIT SPI/QUAD 8WSON Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 32Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Part Status: Obsolete Write Cycle Time - Word, Page: 5µs, 3ms Memory Interface: SPI - Quad I/O Memory Organization: 4M x 8 |
Produkt ist nicht verfügbar |
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IR3820AMTRPBF | Infineon Technologies |
Description: IC REG BUCK ADJ 14A PQFN Packaging: Cut Tape (CT) Package / Case: 15-PowerVQFN Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 14A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 300kHz Voltage - Input (Max): 21V Topology: Buck Supplier Device Package: PQFN (5x6) Synchronous Rectifier: Yes Voltage - Output (Max): 12V Voltage - Input (Min): 2.5V Voltage - Output (Min/Fixed): 0.6V Part Status: Obsolete |
auf Bestellung 882 Stücke: Lieferzeit 10-14 Tag (e) |
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BSZ146N10LS5ATMA1 | Infineon Technologies |
Description: MOSFET N-CH 100V 40A TSDSON Packaging: Cut Tape (CT) Package / Case: 8-PowerTDFN Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 40A (Tc) Rds On (Max) @ Id, Vgs: 14.6mOhm @ 20A, 10V Power Dissipation (Max): 52W (Tc) Vgs(th) (Max) @ Id: 2.3V @ 23µA Supplier Device Package: PG-TSDSON-8-FL Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 3.2 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 50 V |
auf Bestellung 17194 Stücke: Lieferzeit 10-14 Tag (e) |
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FF225R65T3E3P2BPSA1 |
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Produkt ist nicht verfügbar
FF225R65T3E3P3BPMA1 |
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Produkt ist nicht verfügbar
FF225R65T3E3P4BPMA1 |
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Produkt ist nicht verfügbar
FF225R65T3E3P5BPMA1 |
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Produkt ist nicht verfügbar
FF225R65T3E3P6BPMA1 |
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K6
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.4V @ 15V, 225A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K65
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 5900 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 65.6 nF @ 25 V
Produkt ist nicht verfügbar
FF450R33T3E3B5P3BPMA1 |
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K3
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.75V @ 15V, 450A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K33
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 84 nF @ 25 V
Description: IHV IHM T XHP 3 3-6 5K AG-XHP3K3
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.75V @ 15V, 450A
NTC Thermistor: No
Supplier Device Package: AG-XHP3K33
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 1000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 84 nF @ 25 V
Produkt ist nicht verfügbar
SAK-XC822MT-1FRA AA |
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Connectivity: I²C, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-1
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Connectivity: I²C, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-1
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XMC1100T016F0008AAXUMA1 |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Produkt ist nicht verfügbar
XMC1202T016X0032AAXUMA1 |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 11x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Part Status: Obsolete
Number of I/O: 11
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 11x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Part Status: Obsolete
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
IAUZ40N10S5L120ATMA1 |
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-TSDSON-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tj)
Rds On (Max) @ Id, Vgs: 12mOhm @ 20A, 10V
Power Dissipation (Max): 62W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 27µA
Supplier Device Package: PG-TSDSON-8-33
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 22.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1589 pF @ 50 V
Description: MOSFET_(75V 120V( PG-TSDSON-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tj)
Rds On (Max) @ Id, Vgs: 12mOhm @ 20A, 10V
Power Dissipation (Max): 62W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 27µA
Supplier Device Package: PG-TSDSON-8-33
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 22.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1589 pF @ 50 V
Produkt ist nicht verfügbar
IM512L6AXKMA1 |
Hersteller: Infineon Technologies
Description: CIPOS MINI COOLMOS
Packaging: Bulk
Package / Case: 24-PowerDIP Module (1.028", 26.10mm)
Mounting Type: Through Hole
Function: Driver
Current - Output: 10A
Interface: PWM
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge (2)
Voltage - Supply: 14V ~ 18.5V
Applications: General Purpose
Technology: Power MOSFET
Supplier Device Package: 24-DIP
Motor Type - Stepper: Multiphase
Part Status: Last Time Buy
Description: CIPOS MINI COOLMOS
Packaging: Bulk
Package / Case: 24-PowerDIP Module (1.028", 26.10mm)
Mounting Type: Through Hole
Function: Driver
Current - Output: 10A
Interface: PWM
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge (2)
Voltage - Supply: 14V ~ 18.5V
Applications: General Purpose
Technology: Power MOSFET
Supplier Device Package: 24-DIP
Motor Type - Stepper: Multiphase
Part Status: Last Time Buy
auf Bestellung 1165 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
36+ | 13.73 EUR |
IM512L6AXKMA1 |
Hersteller: Infineon Technologies
Description: CIPOS MINI COOLMOS
Packaging: Tube
Package / Case: 24-PowerDIP Module (1.028", 26.10mm)
Mounting Type: Through Hole
Function: Driver
Current - Output: 10A
Interface: PWM
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge (2)
Voltage - Supply: 14V ~ 18.5V
Applications: General Purpose
Technology: Power MOSFET
Supplier Device Package: 24-DIP
Motor Type - Stepper: Multiphase
Part Status: Last Time Buy
Description: CIPOS MINI COOLMOS
Packaging: Tube
Package / Case: 24-PowerDIP Module (1.028", 26.10mm)
Mounting Type: Through Hole
Function: Driver
Current - Output: 10A
Interface: PWM
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge (2)
Voltage - Supply: 14V ~ 18.5V
Applications: General Purpose
Technology: Power MOSFET
Supplier Device Package: 24-DIP
Motor Type - Stepper: Multiphase
Part Status: Last Time Buy
Produkt ist nicht verfügbar
S26KL128SDABHA020 |
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT HYPERBUS 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 100 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Grade: Automotive
Memory Interface: HyperBus
Access Time: 96 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FLASH 128MBIT HYPERBUS 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 100 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Grade: Automotive
Memory Interface: HyperBus
Access Time: 96 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S26KL128SDABHN020 |
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PAR 24FBGA
Description: IC FLASH 128MBIT PAR 24FBGA
auf Bestellung 678 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
53+ | 9.54 EUR |
S26KL128SDABHN020 |
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PAR 24FBGA
Description: IC FLASH 128MBIT PAR 24FBGA
Produkt ist nicht verfügbar
S26KL256SDABHB020 |
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PAR 24FBGA
Description: IC FLASH 256MBIT PAR 24FBGA
auf Bestellung 678 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
41+ | 12.21 EUR |
S26KL512SDABHI020 |
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PAR 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 100 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Part Status: Active
Memory Interface: Parallel
Access Time: 96 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 512MBIT PAR 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 100 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Part Status: Active
Memory Interface: Parallel
Access Time: 96 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.19 EUR |
S26KL512SDABHI030 |
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PAR 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 100 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Part Status: Active
Memory Interface: Parallel
Access Time: 96 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 512MBIT PAR 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 100 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Part Status: Active
Memory Interface: Parallel
Access Time: 96 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TLE9845QXXUMA1 |
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Description: EMBEDDED POWER
Produkt ist nicht verfügbar
TLE9845QXXUMA1 |
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Description: EMBEDDED POWER
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)FS75R12KE3B9BPSA1 |
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2B-311
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 105 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 350 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 5.3 nF @ 25 V
Description: LOW POWER ECONO AG-ECONO2B-311
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 105 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 350 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 5.3 nF @ 25 V
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 210.6 EUR |
FS75R12KE3BPSA1 |
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2B-311
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 105 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 350 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 5.3 nF @ 25 V
Description: LOW POWER ECONO AG-ECONO2B-311
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 105 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 350 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 5.3 nF @ 25 V
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 210.6 EUR |
15+ | 200.88 EUR |
BCR205WH6327 |
Hersteller: Infineon Technologies
Description: DC-DC LED DRIVER AND CONTROL
Packaging: Bulk
Part Status: Active
Description: DC-DC LED DRIVER AND CONTROL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
S29GL512S11DHA020 |
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Bulk
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Bulk
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
auf Bestellung 6386 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
31+ | 17.56 EUR |
XMC4500-F144F1024AB |
Hersteller: Infineon Technologies
Description: 32-BIT MCU XMC4000 ARM CORTEX-M4
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 91
Description: 32-BIT MCU XMC4000 ARM CORTEX-M4
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 91
Produkt ist nicht verfügbar
XMC4500F144K1024ABXQMA1 |
Hersteller: Infineon Technologies
Description: 32-BIT INDUSTRIAL MICROCONTROLLE
Description: 32-BIT INDUSTRIAL MICROCONTROLLE
Produkt ist nicht verfügbar
IAUA180N08S5N026AUMA1 |
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-HSOF-5
Packaging: Tape & Reel (TR)
Package / Case: 5-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tj)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 90A, 10V
Power Dissipation (Max): 179W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 100µA
Supplier Device Package: PG-HSOF-5-4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5980 pF @ 40 V
Description: MOSFET_(75V 120V( PG-HSOF-5
Packaging: Tape & Reel (TR)
Package / Case: 5-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tj)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 90A, 10V
Power Dissipation (Max): 179W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 100µA
Supplier Device Package: PG-HSOF-5-4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5980 pF @ 40 V
Produkt ist nicht verfügbar
CYV15G0104TRB-BGXC |
Hersteller: Infineon Technologies
Description: IC SERDES HOTLINK 256LBGA
Packaging: Bulk
Package / Case: 256-BGA Exposed Pad
Output Type: PECL
Mounting Type: Surface Mount
Number of Outputs: 1/10
Function: Serializer/Deserializer
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.15V ~ 3.45V
Data Rate: 1.485Gbps
Input Type: PECL
Number of Inputs: 10/1
Supplier Device Package: 256-L2BGA (27x27)
Grade: Automotive
Qualification: AEC-Q100
Description: IC SERDES HOTLINK 256LBGA
Packaging: Bulk
Package / Case: 256-BGA Exposed Pad
Output Type: PECL
Mounting Type: Surface Mount
Number of Outputs: 1/10
Function: Serializer/Deserializer
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.15V ~ 3.45V
Data Rate: 1.485Gbps
Input Type: PECL
Number of Inputs: 10/1
Supplier Device Package: 256-L2BGA (27x27)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 227.16 EUR |
IRSM515-025PATRAUMA1 |
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 1.5A SOP23
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Interface: Logic, PWM
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 13.5V ~ 16.5V
Rds On (Typ): 3Ohm LS, 3Ohm HS
Applications: AC Motors
Current - Output / Channel: 1.5A
Technology: MOSFET (Metal Oxide)
Voltage - Load: 400V (Max)
Supplier Device Package: PG-DIP-23-901/SOP 29x12F
Fault Protection: UVLO
Load Type: Inductive
Part Status: Discontinued at Digi-Key
Description: IC HALF BRIDGE DRIVER 1.5A SOP23
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Interface: Logic, PWM
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 13.5V ~ 16.5V
Rds On (Typ): 3Ohm LS, 3Ohm HS
Applications: AC Motors
Current - Output / Channel: 1.5A
Technology: MOSFET (Metal Oxide)
Voltage - Load: 400V (Max)
Supplier Device Package: PG-DIP-23-901/SOP 29x12F
Fault Protection: UVLO
Load Type: Inductive
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
FF1000R17IE4DB2S4BOSA2 |
Hersteller: Infineon Technologies
Description: IGBT MOD 1700V 1390A AGPRIME3-1
Description: IGBT MOD 1700V 1390A AGPRIME3-1
auf Bestellung 173 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1106.37 EUR |
FF1000R17IE4DPB2BOSA1 |
Hersteller: Infineon Technologies
Description: PP, IHM I, XHP 1,7KV
Description: PP, IHM I, XHP 1,7KV
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)FF1000R17IE4S2BOSA1 |
Hersteller: Infineon Technologies
Description: FF1000R17 - IGBT MODULE
Description: FF1000R17 - IGBT MODULE
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)FF100R12MT4 |
Hersteller: Infineon Technologies
Description: IGBT MODULE
Description: IGBT MODULE
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)OUTOFSHAFTFOR3D2GOTOBO1 |
Hersteller: Infineon Technologies
Description: OUT OF SHAFT FOR 3D 2 GO
Packaging: Box
For Use With/Related Products: Sensor2Go
Accessory Type: Mounting Kit
Description: OUT OF SHAFT FOR 3D 2 GO
Packaging: Box
For Use With/Related Products: Sensor2Go
Accessory Type: Mounting Kit
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 45.16 EUR |
IPP080N03L G |
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 50A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 30A, 10V
Power Dissipation (Max): 47W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Supplier Device Package: PG-TO220-3-1
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 15 V
Description: MOSFET N-CH 30V 50A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 30A, 10V
Power Dissipation (Max): 47W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Supplier Device Package: PG-TO220-3-1
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 15 V
Produkt ist nicht verfügbar
TT21401-44LQI28T |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 44-QFN (5x5)
Part Status: Obsolete
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 44-QFN (5x5)
Part Status: Obsolete
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TT21401-44LQI33T |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 44-QFN (5x5)
Part Status: Obsolete
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 44-QFN (5x5)
Part Status: Obsolete
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TT21401-44LQI35T |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 44-QFN (5x5)
Part Status: Obsolete
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 44-QFN (5x5)
Part Status: Obsolete
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TT21401-48LQI36T |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 48-QFN (6x6)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 48-QFN (6x6)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TT21401-56LQI40T |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 56-QFN (6x6)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 500kHz
Core Processor: ARM® Cortex®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, SPI
Supplier Device Package: 56-QFN (6x6)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MA12070P1XUMA1 |
Hersteller: Infineon Technologies
Description: AUDIO IC PG-VQFN-64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 26V
Max Output Power x Channels @ Load: 30W x 2 @ 8Ohm
Supplier Device Package: 64-QFN-EP (9x9)
Part Status: Not For New Designs
Description: AUDIO IC PG-VQFN-64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 26V
Max Output Power x Channels @ Load: 30W x 2 @ 8Ohm
Supplier Device Package: 64-QFN-EP (9x9)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
IPD60R1K0CEAUMA1 |
Hersteller: Infineon Technologies
Description: MOSFET N-CH 600V 6.8A 61W TO252
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Tc)
Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V
Power Dissipation (Max): 61W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Supplier Device Package: PG-TO252-3-344
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
Description: MOSFET N-CH 600V 6.8A 61W TO252
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Tc)
Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V
Power Dissipation (Max): 61W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Supplier Device Package: PG-TO252-3-344
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 0.47 EUR |
5000+ | 0.45 EUR |
IPD60R800CEAUMA1 |
Hersteller: Infineon Technologies
Description: CONSUMER
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.4A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 2A, 10V
Power Dissipation (Max): 74W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 170µA
Supplier Device Package: PG-TO252-3-344
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 373 pF @ 100 V
Description: CONSUMER
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.4A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 2A, 10V
Power Dissipation (Max): 74W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 170µA
Supplier Device Package: PG-TO252-3-344
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 373 pF @ 100 V
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 0.55 EUR |
IPP45N06S409AKSA2 |
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 45A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
Rds On (Max) @ Id, Vgs: 9.4mOhm @ 45A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 34µA
Supplier Device Package: PG-TO220-3-1
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 47 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3785 pF @ 25 V
Qualification: AEC-Q101
Description: MOSFET N-CH 60V 45A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
Rds On (Max) @ Id, Vgs: 9.4mOhm @ 45A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 34µA
Supplier Device Package: PG-TO220-3-1
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 47 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3785 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
DDB6U180N16RRB37BPSA1 |
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2B-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 100 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Description: LOW POWER ECONO AG-ECONO2B-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 100 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 230.54 EUR |
DDB6U180N16RRB11BPSA2 |
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2B-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 515 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 6.3 nF @ 25 V
Description: LOW POWER ECONO AG-ECONO2B-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 515 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 6.3 nF @ 25 V
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 191.93 EUR |
XMC1302T038X0064ABXUMA1 |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 2.27 EUR |
6000+ | 2.22 EUR |
XMC14S2Q040X0064AAXUMA1 |
Hersteller: Infineon Technologies
Description: 32-BIT INDUSTRIAL MICROCONTROLLE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: 32-BIT INDUSTRIAL MICROCONTROLLE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 14894 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
30+ | 16.46 EUR |
FS650R08A4P2BPSA1 |
Hersteller: Infineon Technologies
Description: HYBRID PACK 1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 375A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBDC6I-1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 375 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 65 nF @ 50 V
Description: HYBRID PACK 1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 375A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBDC6I-1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 375 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 65 nF @ 50 V
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 680.29 EUR |
16+ | 654.73 EUR |
FF600R12IP4PBPSA1 |
Hersteller: Infineon Technologies
Description: PP IHM I XHP 1 7KV AG-PRIME2-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 600A
NTC Thermistor: Yes
Supplier Device Package: AG-PRIME2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 37 nF @ 25 V
Description: PP IHM I XHP 1 7KV AG-PRIME2-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 600A
NTC Thermistor: Yes
Supplier Device Package: AG-PRIME2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 37 nF @ 25 V
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 624.71 EUR |
IRLR3915 |
Hersteller: Infineon Technologies
Description: IRLR3915
Description: IRLR3915
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)IPW60R0706P |
Hersteller: Infineon Technologies
Description: 600V COOLMOS N-CHANNEL POWER MOS
Packaging: Bulk
Part Status: Active
Description: 600V COOLMOS N-CHANNEL POWER MOS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
FP150R12N3T7B16BPSA1 |
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO3B-711
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 150 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 12 µA
Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V
Description: LOW POWER ECONO AG-ECONO3B-711
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 150 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 12 µA
Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 246.36 EUR |
FS500R17OE4DB81BPSA1 |
Hersteller: Infineon Technologies
Description: MEDIUM POWER ECONO
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 500A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONOPP
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 500 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 40 nF @ 25 V
Description: MEDIUM POWER ECONO
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 500A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONOPP
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 500 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 40 nF @ 25 V
Produkt ist nicht verfügbar
BC846UE6727HTSA1 |
Hersteller: Infineon Technologies
Description: BC846 - GENERAL PURPOSE TRANSIST
Packaging: Bulk
Part Status: Active
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 65V
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SC74-6
Grade: Automotive
Qualification: AEC-Q101
Description: BC846 - GENERAL PURPOSE TRANSIST
Packaging: Bulk
Part Status: Active
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 65V
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SC74-6
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 622496 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5392+ | 0.097 EUR |
BGAV1A10E6327XTSA1 |
Hersteller: Infineon Technologies
Description: IC RF AMP LTE 3.4GHZ-3.8GHZ 10AT
Packaging: Bulk
Package / Case: 10-UFQFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.8V
Gain: 3.3dB ~ 17.4dB
Current - Supply: 4mA
Noise Figure: 1.3dB ~ 3.2dB
Test Frequency: 3.5GHz
Part Status: Not For New Designs
Description: IC RF AMP LTE 3.4GHZ-3.8GHZ 10AT
Packaging: Bulk
Package / Case: 10-UFQFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.8V
Gain: 3.3dB ~ 17.4dB
Current - Supply: 4mA
Noise Figure: 1.3dB ~ 3.2dB
Test Frequency: 3.5GHz
Part Status: Not For New Designs
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
717+ | 0.69 EUR |
S25FL032P0XNFV013M |
Hersteller: Infineon Technologies
Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tray
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (5x6)
Part Status: Obsolete
Write Cycle Time - Word, Page: 5µs, 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tray
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (5x6)
Part Status: Obsolete
Write Cycle Time - Word, Page: 5µs, 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
S25FL032P0XNFV003M |
Hersteller: Infineon Technologies
Description: IC FLASH 32MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Obsolete
Write Cycle Time - Word, Page: 5µs, 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
Description: IC FLASH 32MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Obsolete
Write Cycle Time - Word, Page: 5µs, 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
IR3820AMTRPBF |
Hersteller: Infineon Technologies
Description: IC REG BUCK ADJ 14A PQFN
Packaging: Cut Tape (CT)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 14A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 300kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Description: IC REG BUCK ADJ 14A PQFN
Packaging: Cut Tape (CT)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 14A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 300kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
auf Bestellung 882 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.58 EUR |
10+ | 4.69 EUR |
25+ | 4.4 EUR |
100+ | 3.93 EUR |
250+ | 3.66 EUR |
500+ | 3.47 EUR |
BSZ146N10LS5ATMA1 |
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 40A TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 14.6mOhm @ 20A, 10V
Power Dissipation (Max): 52W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 23µA
Supplier Device Package: PG-TSDSON-8-FL
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 3.2 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 50 V
Description: MOSFET N-CH 100V 40A TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 14.6mOhm @ 20A, 10V
Power Dissipation (Max): 52W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 23µA
Supplier Device Package: PG-TSDSON-8-FL
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 3.2 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 50 V
auf Bestellung 17194 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.19 EUR |
10+ | 2.03 EUR |
100+ | 1.37 EUR |
500+ | 1.1 EUR |
1000+ | 1 EUR |
2000+ | 0.93 EUR |