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74LVCH245ABX,115 74LVCH245ABX,115 NXP USA Inc. PHGLS28879-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 20DHXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-DHXQFN (4.5x2.5)
auf Bestellung 78786 Stücke:
Lieferzeit 10-14 Tag (e)
1211+0.41 EUR
Mindestbestellmenge: 1211
74CBTLV3125DS,118 74CBTLV3125DS,118 NXP USA Inc. PHGLS23833-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74CBTLV3125DS - BUS
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 225269 Stücke:
Lieferzeit 10-14 Tag (e)
1106+0.44 EUR
Mindestbestellmenge: 1106
MKM35Z512VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.52 EUR
10+ 17.14 EUR
25+ 16.75 EUR
50+ 16.66 EUR
100+ 14.67 EUR
250+ 13.94 EUR
MC68LC302CAF20CT MC68LC302CAF20CT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 20MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
P3S0210BQAZ NXP USA Inc. P3S0210BQ.pdf Description: IC
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
Produkt ist nicht verfügbar
S9S08LG32J0CLK S9S08LG32J0CLK NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BCV61B,215 BCV61B,215 NXP USA Inc. PHGLS20878-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BCV61B - SMALL SIGN
Packaging: Bulk
Voltage - Rated: 30V
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 100mA
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual) Current Mirror
Applications: Current Mirror
Supplier Device Package: SOT-143B
auf Bestellung 4050 Stücke:
Lieferzeit 10-14 Tag (e)
4050+0.13 EUR
Mindestbestellmenge: 4050
PEMI4QFN/LM,132 PEMI4QFN/LM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
2959+0.16 EUR
Mindestbestellmenge: 2959
74HC30PW,112 74HC30PW,112 NXP USA Inc. PHGL-S-A0001295603-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 1CH 8-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 8
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
auf Bestellung 26640 Stücke:
Lieferzeit 10-14 Tag (e)
2125+0.23 EUR
Mindestbestellmenge: 2125
SPC5645BK0VLT1 SPC5645BK0VLT1 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PMG370XN,115 PMG370XN,115 NXP USA Inc. Description: MOSFET N-CH 30V 960MA 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 960mA (Ta)
Rds On (Max) @ Id, Vgs: 440mOhm @ 200mA, 4.5V
Power Dissipation (Max): 690mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-TSSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.65 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 37 pF @ 25 V
auf Bestellung 111000 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
FRDM-22XSDBEVB NXP USA Inc. Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
LFBDMPGMR NXP USA Inc. Description: BDM FLASH PROGRAMMER FOR HCS08,
Packaging: Bulk
For Use With/Related Products: HC12, HCS08, HCS12, HCS12X
Type: Programmer
Contents: Board(s), Cable(s), Power Supply, Accessories
Produkt ist nicht verfügbar
MPL3150A2ST1 MPL3150A2ST1 NXP USA Inc. Description: IC BAR SENSOR 150KPA HORIZON 8TS
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
Produkt ist nicht verfügbar
SPC5200CVR400B SPC5200CVR400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
SPC5200CVR400BR2 SPC5200CVR400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
NXH3675UK/A1Z NXP USA Inc. NXH3675A4FS.pdf Description: NXH3675UK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NHS3100THADADKUL NXP USA Inc. Description: NHS3100 THERAPY ADK
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MFS8601BMBA0ESR2 MFS8601BMBA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MFS8601BMBA0ES MFS8601BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
BGU8823/AY NXP USA Inc. Description: BGU8823
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19dB
Current - Supply: 57mA
Noise Figure: 2.9dB
P1dB: 37.2dBm
Test Frequency: 2.3GHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
BGU8822/AY NXP USA Inc. Description: BGU8822
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 22.2dB
Current - Supply: 57mA
Noise Figure: 2.3dB
P1dB: 36.3dBm
Test Frequency: 1.7GHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
BGU8821/AY NXP USA Inc. Description: BGU8821
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 24.4dB
Current - Supply: 57mA
Noise Figure: 1.7dB
P1dB: 35.2dB
Test Frequency: 700MHz ~ 850MHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
LPC11E11FHN33/101, LPC11E11FHN33/101, NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PSMN4R3-30PL,127 PSMN4R3-30PL,127 NXP USA Inc. PSMN4R3-30PL.pdf Description: MOSFET N-CH 30V 100A TO220AB
Packaging: Bulk
auf Bestellung 20395 Stücke:
Lieferzeit 10-14 Tag (e)
391+1.27 EUR
Mindestbestellmenge: 391
PSMN1R6-30PL,127 PSMN1R6-30PL,127 NXP USA Inc. PSMN1R6-30PL.pdf Description: MOSFET N-CH 30V 100A TO220AB
Packaging: Tube
auf Bestellung 12621 Stücke:
Lieferzeit 10-14 Tag (e)
258+1.91 EUR
Mindestbestellmenge: 258
74LVC169PW,112 74LVC169PW,112 NXP USA Inc. 74LVC169.pdf Description: IC BINARY COUNTER 4-BIT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2.7 V ~ 3.6 V
Count Rate: 150 MHz
Number of Bits per Element: 4
auf Bestellung 2684 Stücke:
Lieferzeit 10-14 Tag (e)
1268+0.39 EUR
Mindestbestellmenge: 1268
MCF51JE256VML NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32B 256KB FLASH 104MAPBGA
Packaging: Box
Package / Case: 104-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 104-MAPBGA (10x10)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9440HE-Q100Z NXP USA Inc. Description: HALF BRIDGE W/ OPT DRIVER ACE-Q1
Packaging: Tape & Reel (TR)
Package / Case: 18-PowerUFQFN
Mounting Type: Surface Mount
Supplier Device Package: 18-HUQFN (2.6x2.6)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
74AHC3G14GD,125 74AHC3G14GD,125 NXP USA Inc. PHGLS28134-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 2.2V ~ 3.85V
Input Logic Level - Low: 0.9V ~ 1.65V
Max Propagation Delay @ V, Max CL: 10.6ns @ 5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 62835 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
74AHCT3G14GD,125 74AHCT3G14GD,125 NXP USA Inc. 74AHC_AHCT3G14.pdf Description: IC INV SCHMITT TRIGGER 8-XSON
Packaging: Bulk
auf Bestellung 44980 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
74HCT3G14GD,125 74HCT3G14GD,125 NXP USA Inc. PHGLS29087-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 51398 Stücke:
Lieferzeit 10-14 Tag (e)
1665+0.3 EUR
Mindestbestellmenge: 1665
74AUP3G14GSX 74AUP3G14GSX NXP USA Inc. 74AUP3G14.pdf Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2268+0.21 EUR
Mindestbestellmenge: 2268
74LVC1G99GD,125 74LVC1G99GD,125 NXP USA Inc. PHGLS27065-1.pdf?t.download=true&u=5oefqw Description: FUNC, 4 INPUT, CMOS, PDSO8
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 4
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Number of Circuits: 1
auf Bestellung 119321 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
LFTAA1C NXP USA Inc. Description: 8 PIN 0.8MM DFN TARGET ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DFN
Produkt ist nicht verfügbar
LFJ76DBGWSA NXP USA Inc. Description: QORIVVA MPC5676 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5676
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
TJA1027T/20/2Z TJA1027T/20/2Z NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
74HCT4046AN,112 74HCT4046AN,112 NXP USA Inc. Description: IC PHASE LOCK LOOP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Ratio - Input:Output: 2:3
Differential - Input:Output: No/No
Supplier Device Package: 16-DIP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 4972 Stücke:
Lieferzeit 10-14 Tag (e)
392+1.27 EUR
Mindestbestellmenge: 392
BZX84-C3V6,235 BZX84-C3V6,235 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
auf Bestellung 70000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
Mindestbestellmenge: 13172
SAF4000EL/102Z225Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/102Z225K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
MC56F81768LMLH NXP USA Inc. MC56F81XXXL.pdf Description: IC
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
74LVC08ADB,118 74LVC08ADB,118 NXP USA Inc. 74LVC08A.pdf Description: IC GATE AND 4CH 2-INP 14-SSOP
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
1750+0.28 EUR
Mindestbestellmenge: 1750
BTA204-800C,127 NXP USA Inc. bta204-800c.pdf Description: TRIAC 800V 4A TO220AB
Packaging: Bulk
auf Bestellung 12268 Stücke:
Lieferzeit 10-14 Tag (e)
1111+0.44 EUR
Mindestbestellmenge: 1111
PMN28UN,135 PMN28UN,135 NXP USA Inc. PHGLS18124-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 12V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 2A, 4.5V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 700mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 10.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 740 pF @ 10 V
auf Bestellung 16992 Stücke:
Lieferzeit 10-14 Tag (e)
1665+0.3 EUR
Mindestbestellmenge: 1665
PMEG6010ESBYL PMEG6010ESBYL NXP USA Inc. PMEG6010ESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
7088+0.066 EUR
Mindestbestellmenge: 7088
TEA1792ATS/1Z TEA1792ATS/1Z NXP USA Inc. TEA1792ATS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
TEA1792TS/1Z TEA1792TS/1Z NXP USA Inc. TEA1792TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
BAS28,235 BAS28,235 NXP USA Inc. PHGLS22063-1.pdf?t.download=true&u=5oefqw Description: DIODE ARRAY GP 75V 215MA SOT143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: SOT-143B
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
auf Bestellung 746710 Stücke:
Lieferzeit 10-14 Tag (e)
8768+0.049 EUR
Mindestbestellmenge: 8768
74HCT4060DB,118 74HCT4060DB,118 NXP USA Inc. PHGL-S-A0001477848-1.pdf?t.download=true&u=5oefqw Description: IC BINARY COUNTER 14-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
959+0.51 EUR
Mindestbestellmenge: 959
74HCT74D,652 74HCT74D,652 NXP USA Inc. 74HC_HCT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 55410 Stücke:
Lieferzeit 10-14 Tag (e)
2929+0.16 EUR
Mindestbestellmenge: 2929
NCF3320EHN/0SY NXP USA Inc. Description: NCF3320EHN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, RS 232
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18092, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MPC5554MVR80 NXP USA Inc. MPC5554.pdf Description: IC
Packaging: Bulk
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Produkt ist nicht verfügbar
MPC5554MZP112 MPC5554MZP112 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LFVBBOM54W1A NXP USA Inc. Description: QORIVVA MPC5554 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5554
Accessory Type: Base Board
Produkt ist nicht verfügbar
MC33FS8530A1KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA9600DPZ PCA9600DPZ NXP USA Inc. Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
PBSS5320D,125 PBSS5320D,125 NXP USA Inc. PBSS5320D.pdf Description: TRANS PNP 20V 3A LO-SAT 6TSOP
Packaging: Bulk
auf Bestellung 675000 Stücke:
Lieferzeit 10-14 Tag (e)
4163+0.12 EUR
Mindestbestellmenge: 4163
PBSS5320X,135 PBSS5320X,135 NXP USA Inc. PBSS5320X.pdf Description: TRANS PNP 20V 3A SOT89
Packaging: Bulk
auf Bestellung 306021 Stücke:
Lieferzeit 10-14 Tag (e)
4024+0.12 EUR
Mindestbestellmenge: 4024
S9S12G128AMLHR S9S12G128AMLHR NXP USA Inc. S12GFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
1500+8.61 EUR
Mindestbestellmenge: 1500
74LVCH245ABX,115 PHGLS28879-1.pdf?t.download=true&u=5oefqw
74LVCH245ABX,115
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20DHXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-DHXQFN (4.5x2.5)
auf Bestellung 78786 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1211+0.41 EUR
Mindestbestellmenge: 1211
74CBTLV3125DS,118 PHGLS23833-1.pdf?t.download=true&u=5oefqw
74CBTLV3125DS,118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74CBTLV3125DS - BUS
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 225269 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1106+0.44 EUR
Mindestbestellmenge: 1106
MKM35Z512VLQ7R KM35P144M75SF0.pdf
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.52 EUR
10+ 17.14 EUR
25+ 16.75 EUR
50+ 16.66 EUR
100+ 14.67 EUR
250+ 13.94 EUR
MC68LC302CAF20CT MC68LC302.pdf
MC68LC302CAF20CT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
P3S0210BQAZ P3S0210BQ.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
Produkt ist nicht verfügbar
S9S08LG32J0CLK MC9S08LG32.pdf
S9S08LG32J0CLK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BCV61B,215 PHGLS20878-1.pdf?t.download=true&u=5oefqw
BCV61B,215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCV61B - SMALL SIGN
Packaging: Bulk
Voltage - Rated: 30V
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 100mA
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual) Current Mirror
Applications: Current Mirror
Supplier Device Package: SOT-143B
auf Bestellung 4050 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4050+0.13 EUR
Mindestbestellmenge: 4050
PEMI4QFN/LM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/LM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2959+0.16 EUR
Mindestbestellmenge: 2959
74HC30PW,112 PHGL-S-A0001295603-1.pdf?t.download=true&u=5oefqw
74HC30PW,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 8-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 8
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
auf Bestellung 26640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2125+0.23 EUR
Mindestbestellmenge: 2125
SPC5645BK0VLT1
SPC5645BK0VLT1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PMG370XN,115
PMG370XN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 960MA 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 960mA (Ta)
Rds On (Max) @ Id, Vgs: 440mOhm @ 200mA, 4.5V
Power Dissipation (Max): 690mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-TSSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.65 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 37 pF @ 25 V
auf Bestellung 111000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3328+0.15 EUR
Mindestbestellmenge: 3328
FRDM-22XSDBEVB
Hersteller: NXP USA Inc.
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
LFBDMPGMR
Hersteller: NXP USA Inc.
Description: BDM FLASH PROGRAMMER FOR HCS08,
Packaging: Bulk
For Use With/Related Products: HC12, HCS08, HCS12, HCS12X
Type: Programmer
Contents: Board(s), Cable(s), Power Supply, Accessories
Produkt ist nicht verfügbar
MPL3150A2ST1
MPL3150A2ST1
Hersteller: NXP USA Inc.
Description: IC BAR SENSOR 150KPA HORIZON 8TS
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
Produkt ist nicht verfügbar
SPC5200CVR400B MPC5200BDS.pdf
SPC5200CVR400B
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
SPC5200CVR400BR2 MPC5200BDS.pdf
SPC5200CVR400BR2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
NXH3675UK/A1Z NXH3675A4FS.pdf
Hersteller: NXP USA Inc.
Description: NXH3675UK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NHS3100THADADKUL
Hersteller: NXP USA Inc.
Description: NHS3100 THERAPY ADK
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MFS8601BMBA0ESR2 FS8600_SDS.pdf
MFS8601BMBA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MFS8601BMBA0ES
MFS8601BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
BGU8823/AY
Hersteller: NXP USA Inc.
Description: BGU8823
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19dB
Current - Supply: 57mA
Noise Figure: 2.9dB
P1dB: 37.2dBm
Test Frequency: 2.3GHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
BGU8822/AY
Hersteller: NXP USA Inc.
Description: BGU8822
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 22.2dB
Current - Supply: 57mA
Noise Figure: 2.3dB
P1dB: 36.3dBm
Test Frequency: 1.7GHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
BGU8821/AY
Hersteller: NXP USA Inc.
Description: BGU8821
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 24.4dB
Current - Supply: 57mA
Noise Figure: 1.7dB
P1dB: 35.2dB
Test Frequency: 700MHz ~ 850MHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
LPC11E11FHN33/101, LPC11E1X.pdf
LPC11E11FHN33/101,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PSMN4R3-30PL,127 PSMN4R3-30PL.pdf
PSMN4R3-30PL,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A TO220AB
Packaging: Bulk
auf Bestellung 20395 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
391+1.27 EUR
Mindestbestellmenge: 391
PSMN1R6-30PL,127 PSMN1R6-30PL.pdf
PSMN1R6-30PL,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A TO220AB
Packaging: Tube
auf Bestellung 12621 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
258+1.91 EUR
Mindestbestellmenge: 258
74LVC169PW,112 74LVC169.pdf
74LVC169PW,112
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2.7 V ~ 3.6 V
Count Rate: 150 MHz
Number of Bits per Element: 4
auf Bestellung 2684 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1268+0.39 EUR
Mindestbestellmenge: 1268
MCF51JE256VML MCF51JE256.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 104MAPBGA
Packaging: Box
Package / Case: 104-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 104-MAPBGA (10x10)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9440HE-Q100Z
Hersteller: NXP USA Inc.
Description: HALF BRIDGE W/ OPT DRIVER ACE-Q1
Packaging: Tape & Reel (TR)
Package / Case: 18-PowerUFQFN
Mounting Type: Surface Mount
Supplier Device Package: 18-HUQFN (2.6x2.6)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
74AHC3G14GD,125 PHGLS28134-1.pdf?t.download=true&u=5oefqw
74AHC3G14GD,125
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 2.2V ~ 3.85V
Input Logic Level - Low: 0.9V ~ 1.65V
Max Propagation Delay @ V, Max CL: 10.6ns @ 5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 62835 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2049+0.25 EUR
Mindestbestellmenge: 2049
74AHCT3G14GD,125 74AHC_AHCT3G14.pdf
74AHCT3G14GD,125
Hersteller: NXP USA Inc.
Description: IC INV SCHMITT TRIGGER 8-XSON
Packaging: Bulk
auf Bestellung 44980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2049+0.25 EUR
Mindestbestellmenge: 2049
74HCT3G14GD,125 PHGLS29087-1.pdf?t.download=true&u=5oefqw
74HCT3G14GD,125
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 51398 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1665+0.3 EUR
Mindestbestellmenge: 1665
74AUP3G14GSX 74AUP3G14.pdf
74AUP3G14GSX
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
auf Bestellung 5000 Stücke:
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Anzahl Preis ohne MwSt
2268+0.21 EUR
Mindestbestellmenge: 2268
74LVC1G99GD,125 PHGLS27065-1.pdf?t.download=true&u=5oefqw
74LVC1G99GD,125
Hersteller: NXP USA Inc.
Description: FUNC, 4 INPUT, CMOS, PDSO8
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 4
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Number of Circuits: 1
auf Bestellung 119321 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2049+0.25 EUR
Mindestbestellmenge: 2049
LFTAA1C
Hersteller: NXP USA Inc.
Description: 8 PIN 0.8MM DFN TARGET ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DFN
Produkt ist nicht verfügbar
LFJ76DBGWSA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5676
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
TJA1027T/20/2Z TJA1027.pdf
TJA1027T/20/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
74HCT4046AN,112
74HCT4046AN,112
Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Ratio - Input:Output: 2:3
Differential - Input:Output: No/No
Supplier Device Package: 16-DIP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 4972 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
392+1.27 EUR
Mindestbestellmenge: 392
BZX84-C3V6,235 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V6,235
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
auf Bestellung 70000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
SAF4000EL/102Z225Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/102Z225K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
MC56F81768LMLH MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
74LVC08ADB,118 74LVC08A.pdf
74LVC08ADB,118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14-SSOP
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1750+0.28 EUR
Mindestbestellmenge: 1750
BTA204-800C,127 bta204-800c.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 800V 4A TO220AB
Packaging: Bulk
auf Bestellung 12268 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1111+0.44 EUR
Mindestbestellmenge: 1111
PMN28UN,135 PHGLS18124-1.pdf?t.download=true&u=5oefqw
PMN28UN,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 12V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 2A, 4.5V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 700mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 10.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 740 pF @ 10 V
auf Bestellung 16992 Stücke:
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1665+0.3 EUR
Mindestbestellmenge: 1665
PMEG6010ESBYL PMEG6010ESB.pdf
PMEG6010ESBYL
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7088+0.066 EUR
Mindestbestellmenge: 7088
TEA1792ATS/1Z TEA1792ATS.pdf
TEA1792ATS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
TEA1792TS/1Z TEA1792TS.pdf
TEA1792TS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
BAS28,235 PHGLS22063-1.pdf?t.download=true&u=5oefqw
BAS28,235
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 75V 215MA SOT143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: SOT-143B
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
auf Bestellung 746710 Stücke:
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Anzahl Preis ohne MwSt
8768+0.049 EUR
Mindestbestellmenge: 8768
74HCT4060DB,118 PHGL-S-A0001477848-1.pdf?t.download=true&u=5oefqw
74HCT4060DB,118
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 14-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
959+0.51 EUR
Mindestbestellmenge: 959
74HCT74D,652 74HC_HCT74.pdf
74HCT74D,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 55410 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2929+0.16 EUR
Mindestbestellmenge: 2929
NCF3320EHN/0SY
Hersteller: NXP USA Inc.
Description: NCF3320EHN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, RS 232
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18092, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MPC5554MVR80 MPC5554.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Produkt ist nicht verfügbar
MPC5554MZP112
MPC5554MZP112
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LFVBBOM54W1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5554 422 PIN 1.0MM VE
Packaging: Bulk
For Use With/Related Products: MPC5554
Accessory Type: Base Board
Produkt ist nicht verfügbar
MC33FS8530A1KS FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA9600DPZ
PCA9600DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
PBSS5320D,125 PBSS5320D.pdf
PBSS5320D,125
Hersteller: NXP USA Inc.
Description: TRANS PNP 20V 3A LO-SAT 6TSOP
Packaging: Bulk
auf Bestellung 675000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4163+0.12 EUR
Mindestbestellmenge: 4163
PBSS5320X,135 PBSS5320X.pdf
PBSS5320X,135
Hersteller: NXP USA Inc.
Description: TRANS PNP 20V 3A SOT89
Packaging: Bulk
auf Bestellung 306021 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4024+0.12 EUR
Mindestbestellmenge: 4024
S9S12G128AMLHR S12GFS.pdf
S9S12G128AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1500+8.61 EUR
Mindestbestellmenge: 1500
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