P3S0210BQAZ NXP USA Inc.
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Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
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Technische Details P3S0210BQAZ NXP USA Inc.
Description: IC, Packaging: Tape & Reel (TR), Package / Case: 14-VFQFN Exposed Pad, Mounting Type: Surface Mount, Circuit: 1 x 2:1, 1 x 1:2, Type: Bus Switch, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 0.72V ~ 3.63V, Independent Circuits: 1, Current - Output High, Low: 10µA, 10µA, Voltage Supply Source: Single Supply, Supplier Device Package: 14-DHVQFN (2.5x3).
Weitere Produktangebote P3S0210BQAZ
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P3S0210BQAZ | Hersteller : NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-VFQFN Exposed Pad Mounting Type: Surface Mount Circuit: 1 x 2:1, 1 x 1:2 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.72V ~ 3.63V Independent Circuits: 1 Current - Output High, Low: 10µA, 10µA Voltage Supply Source: Single Supply Supplier Device Package: 14-DHVQFN (2.5x3) |
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P3S0210BQAZ | Hersteller : NXP Semiconductors |
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