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88W9098-A2-NYGC/MP NXP USA Inc. Description: 88W9098-A2-NYGC
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 88-HVQFN (10x10)
Produkt ist nicht verfügbar
88W9098-A2-NYGC/AK NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MPC857DSLCVR66B MPC857DSLCVR66B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 115°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
TEF7006HN/V1,518 TEF7006HN/V1,518 NXP USA Inc. PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
auf Bestellung 1900 Stücke:
Lieferzeit 10-14 Tag (e)
74+6.72 EUR
Mindestbestellmenge: 74
MRFG35002N6T1 MRFG35002N6T1 NXP USA Inc. MRFG35002N6.pdf Description: RF MOSFET PHEMT FET 6V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 1.5W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 8 V
Voltage - Test: 6 V
Current - Test: 65 mA
Produkt ist nicht verfügbar
FXLS90230AESR2 NXP USA Inc. FXLS9xxx0.pdf Description: X SINGLE-AXIS HIGH-G INERTIAL S
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
S32K338GHT1VPCSR NXP USA Inc. S32K3xx.pdf Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S32K338GHT1VPCST NXP USA Inc. S32K3xx.pdf Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S9S12ZVL16F0MLFR NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S9S12G64J0WLFR NXP USA Inc. Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
MC33FS6506NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PMP5501G,115 PMP5501G,115 NXP USA Inc. PHGLS19178-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual) Matched Pair, Common Emitter
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 175MHz
Supplier Device Package: SOT-353
auf Bestellung 331269 Stücke:
Lieferzeit 10-14 Tag (e)
4438+0.11 EUR
Mindestbestellmenge: 4438
QN9080CHNY QN9080CHNY NXP USA Inc. Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
QN9080CHNY QN9080CHNY NXP USA Inc. Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MGD3160AM318EKR2 NXP USA Inc. PB_GD3160.pdf Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC35FS6506CAER2 NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC35FS6506CAE NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
A1006UK/TA1NXZ A1006UK/TA1NXZ NXP USA Inc. Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+1.23 EUR
8000+ 1.22 EUR
12000+ 1.18 EUR
Mindestbestellmenge: 4000
A1006UK/TA1NXZ A1006UK/TA1NXZ NXP USA Inc. Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Cut Tape (CT)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
auf Bestellung 15979 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.78 EUR
11+ 1.62 EUR
25+ 1.6 EUR
50+ 1.59 EUR
100+ 1.42 EUR
250+ 1.41 EUR
500+ 1.39 EUR
1000+ 1.34 EUR
Mindestbestellmenge: 10
TEF5200EL/V1K NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
TEF5200EL/V1Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MF3D8300DA8/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D8300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
FRDMGD3162HBIEVM FRDMGD3162HBIEVM NXP USA Inc. UM11729.pdf Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3162
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
DC6M601X6/18S,135 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK 1.8V 650MA 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.8V
auf Bestellung 12300 Stücke:
Lieferzeit 10-14 Tag (e)
807+0.61 EUR
Mindestbestellmenge: 807
BZX79-B8V2,133 BZX79-B8V2,133 NXP USA Inc. PHGLS19463-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 8.2V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
auf Bestellung 176010 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
Mindestbestellmenge: 13172
OM6748J NXP USA Inc. Description: DUMMY MODULE
Packaging: Bulk
Produkt ist nicht verfügbar
OM6722,118 NXP USA Inc. Description: 08 BIT SMX
Packaging: Bulk
Produkt ist nicht verfügbar
OM7770/ZKRSMXDBF NXP USA Inc. Description: OM7770/ZKRSMXDBF
Packaging: Bulk
Produkt ist nicht verfügbar
OM6737/NXD61P-HB1J NXP USA Inc. Description: 6-PIN DIF MODULE NXD6.2
Packaging: Bulk
Produkt ist nicht verfügbar
PCA9958HN/Q900Y NXP USA Inc. PCA9958.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
PCA9468UKZ NXP USA Inc. Description: IC BATT CHG 2:1 SWITCHED CAP
Packaging: Bulk
Produkt ist nicht verfügbar
MPR083Q MPR083Q NXP USA Inc. MPR083Q-v1.jpg Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tray
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPR084EJ MPR084EJ NXP USA Inc. MPR083EJ-SIDE.jpg description Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BYC20-600,127 NXP USA Inc. byc20-600.pdf Description: DIODE RECT 600V 20A TO-220AC
Packaging: Bulk
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
364+1.36 EUR
Mindestbestellmenge: 364
BZV55-B4V7,135 BZV55-B4V7,135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 500MW LLDS
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
Mindestbestellmenge: 13172
MC33FS6600M2KSR2 MC33FS6600M2KSR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M1KSR2 MC33FS6600M1KSR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M0KSR2 MC33FS6600M0KSR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M2KS MC33FS6600M2KS NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M1KS MC33FS6600M1KS NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M0KS MC33FS6600M0KS NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
S912ZVL96AMLFR NXP USA Inc. Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
PCA9511ADP,118 PCA9511ADP,118 NXP USA Inc. PCA9511A.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
auf Bestellung 107500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+2.02 EUR
Mindestbestellmenge: 2500
PCA9511ADP,118 PCA9511ADP,118 NXP USA Inc. PCA9511A.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
auf Bestellung 108784 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.38 EUR
10+ 3.04 EUR
25+ 2.86 EUR
100+ 2.44 EUR
250+ 2.29 EUR
500+ 2.02 EUR
Mindestbestellmenge: 6
MC8641VJ1500KE MC8641VJ1500KE NXP USA Inc. FSCLS11792-1.pdf?t.download=true&u=5oefqw Description: 32-BIT POWER ARCHITECTURE SOC, 1
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+1321.76 EUR
MC8641DVU1500KE MC8641DVU1500KE NXP USA Inc. MCP8641%28D%29.pdf Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+1049.86 EUR
MC8641DVU1500KE MC8641DVU1500KE NXP USA Inc. MCP8641%28D%29.pdf Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
MC33FS6517NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33FS6517NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33912G5ACR2 MC33912G5ACR2 NXP USA Inc. MC33912.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
K32W2ARD-ITPS NXP USA Inc. Description: K32W2ARD-ITPS
Packaging: Bulk
Produkt ist nicht verfügbar
XFRDM-STBA-A8961 NXP USA Inc. Description: DEV KIT
Packaging: Bulk
Produkt ist nicht verfügbar
C9KEAZ128Q80EVB NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
RD33774PC3EVB NXP USA Inc. getting-started-with-the-rd33774pc3evb-evaluation-board:GS-RD33774PC3EVB Description: IC
Packaging: Box
Produkt ist nicht verfügbar
PTN38007-EVM PTN38007-EVM NXP USA Inc. UM11595.pdf Description: PTN38007 EVALUATION BOARD
Packaging: Bulk
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN38007
Supplied Contents: Board(s)
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+652.56 EUR
FRDMGD3160CSLEVM NXP USA Inc. getting-started-with-the-frdmgd3160cslevm-evaluation-board:GS-FRDMGD3160CSLEVM Description: FRDMGD3160CSLEVM
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
MC9328MXLCVP15 MC9328MXLCVP15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
PDTA144EM,315 PDTA144EM,315 NXP USA Inc. PDTA144EE.pdf Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 78670 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
74HCT4046ADB,118 74HCT4046ADB,118 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PLL W/VCO 16SSOP
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 5843 Stücke:
Lieferzeit 10-14 Tag (e)
577+0.86 EUR
Mindestbestellmenge: 577
BCW60B,215 NXP USA Inc. BCW60.pdf Description: TRANSISTOR NPN 32V 100MA SOT23
Packaging: Bulk
auf Bestellung 36914 Stücke:
Lieferzeit 10-14 Tag (e)
13053+0.033 EUR
Mindestbestellmenge: 13053
88W9098-A2-NYGC/MP
Hersteller: NXP USA Inc.
Description: 88W9098-A2-NYGC
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 88-HVQFN (10x10)
Produkt ist nicht verfügbar
88W9098-A2-NYGC/AK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MPC857DSLCVR66B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC857DSLCVR66B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 115°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
TEF7006HN/V1,518 PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw
TEF7006HN/V1,518
Hersteller: NXP USA Inc.
Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
auf Bestellung 1900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
74+6.72 EUR
Mindestbestellmenge: 74
MRFG35002N6T1 MRFG35002N6.pdf
MRFG35002N6T1
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 6V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 1.5W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 8 V
Voltage - Test: 6 V
Current - Test: 65 mA
Produkt ist nicht verfügbar
FXLS90230AESR2 FXLS9xxx0.pdf
Hersteller: NXP USA Inc.
Description: X SINGLE-AXIS HIGH-G INERTIAL S
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
S32K338GHT1VPCSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S32K338GHT1VPCST S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S9S12ZVL16F0MLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S9S12G64J0WLFR
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
MC33FS6506NAER2 FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PMP5501G,115 PHGLS19178-1.pdf?t.download=true&u=5oefqw
PMP5501G,115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual) Matched Pair, Common Emitter
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 175MHz
Supplier Device Package: SOT-353
auf Bestellung 331269 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4438+0.11 EUR
Mindestbestellmenge: 4438
QN9080CHNY
QN9080CHNY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
QN9080CHNY
QN9080CHNY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MGD3160AM318EKR2 PB_GD3160.pdf
Hersteller: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC35FS6506CAER2 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC35FS6506CAE 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
A1006UK/TA1NXZ
A1006UK/TA1NXZ
Hersteller: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+1.23 EUR
8000+ 1.22 EUR
12000+ 1.18 EUR
Mindestbestellmenge: 4000
A1006UK/TA1NXZ
A1006UK/TA1NXZ
Hersteller: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Cut Tape (CT)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
auf Bestellung 15979 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10+1.78 EUR
11+ 1.62 EUR
25+ 1.6 EUR
50+ 1.59 EUR
100+ 1.42 EUR
250+ 1.41 EUR
500+ 1.39 EUR
1000+ 1.34 EUR
Mindestbestellmenge: 10
TEF5200EL/V1K
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
TEF5200EL/V1Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MF3D8300DA8/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3D8300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
FRDMGD3162HBIEVM UM11729.pdf
FRDMGD3162HBIEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3162
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
DC6M601X6/18S,135 DC6M60xX6_Family.pdf
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.8V 650MA 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.8V
auf Bestellung 12300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
807+0.61 EUR
Mindestbestellmenge: 807
BZX79-B8V2,133 PHGLS19463-1.pdf?t.download=true&u=5oefqw
BZX79-B8V2,133
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
auf Bestellung 176010 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
OM6748J
Hersteller: NXP USA Inc.
Description: DUMMY MODULE
Packaging: Bulk
Produkt ist nicht verfügbar
OM6722,118
Hersteller: NXP USA Inc.
Description: 08 BIT SMX
Packaging: Bulk
Produkt ist nicht verfügbar
OM7770/ZKRSMXDBF
Hersteller: NXP USA Inc.
Description: OM7770/ZKRSMXDBF
Packaging: Bulk
Produkt ist nicht verfügbar
OM6737/NXD61P-HB1J
Hersteller: NXP USA Inc.
Description: 6-PIN DIF MODULE NXD6.2
Packaging: Bulk
Produkt ist nicht verfügbar
PCA9958HN/Q900Y PCA9958.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
PCA9468UKZ
Hersteller: NXP USA Inc.
Description: IC BATT CHG 2:1 SWITCHED CAP
Packaging: Bulk
Produkt ist nicht verfügbar
MPR083Q MPR083Q-v1.jpg
MPR083Q
Hersteller: NXP USA Inc.
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tray
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPR084EJ description MPR083EJ-SIDE.jpg
MPR084EJ
Hersteller: NXP USA Inc.
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BYC20-600,127 byc20-600.pdf
Hersteller: NXP USA Inc.
Description: DIODE RECT 600V 20A TO-220AC
Packaging: Bulk
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
364+1.36 EUR
Mindestbestellmenge: 364
BZV55-B4V7,135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-B4V7,135
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 500MW LLDS
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
MC33FS6600M2KSR2
MC33FS6600M2KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M1KSR2
MC33FS6600M1KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M0KSR2
MC33FS6600M0KSR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M2KS
MC33FS6600M2KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M1KS
MC33FS6600M1KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
MC33FS6600M0KS
MC33FS6600M0KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
S912ZVL96AMLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
PCA9511ADP,118 PCA9511A.pdf
PCA9511ADP,118
Hersteller: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
auf Bestellung 107500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+2.02 EUR
Mindestbestellmenge: 2500
PCA9511ADP,118 PCA9511A.pdf
PCA9511ADP,118
Hersteller: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
auf Bestellung 108784 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.38 EUR
10+ 3.04 EUR
25+ 2.86 EUR
100+ 2.44 EUR
250+ 2.29 EUR
500+ 2.02 EUR
Mindestbestellmenge: 6
MC8641VJ1500KE FSCLS11792-1.pdf?t.download=true&u=5oefqw
MC8641VJ1500KE
Hersteller: NXP USA Inc.
Description: 32-BIT POWER ARCHITECTURE SOC, 1
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
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1+1321.76 EUR
MC8641DVU1500KE MCP8641%28D%29.pdf
MC8641DVU1500KE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
auf Bestellung 8 Stücke:
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Anzahl Preis ohne MwSt
1+1049.86 EUR
MC8641DVU1500KE MCP8641%28D%29.pdf
MC8641DVU1500KE
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
MC33FS6517NAER2 FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33FS6517NAE FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33912G5ACR2 MC33912.pdf
MC33912G5ACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
K32W2ARD-ITPS
Hersteller: NXP USA Inc.
Description: K32W2ARD-ITPS
Packaging: Bulk
Produkt ist nicht verfügbar
XFRDM-STBA-A8961
Hersteller: NXP USA Inc.
Description: DEV KIT
Packaging: Bulk
Produkt ist nicht verfügbar
C9KEAZ128Q80EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
RD33774PC3EVB getting-started-with-the-rd33774pc3evb-evaluation-board:GS-RD33774PC3EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Produkt ist nicht verfügbar
PTN38007-EVM UM11595.pdf
PTN38007-EVM
Hersteller: NXP USA Inc.
Description: PTN38007 EVALUATION BOARD
Packaging: Bulk
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN38007
Supplied Contents: Board(s)
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+652.56 EUR
FRDMGD3160CSLEVM getting-started-with-the-frdmgd3160cslevm-evaluation-board:GS-FRDMGD3160CSLEVM
Hersteller: NXP USA Inc.
Description: FRDMGD3160CSLEVM
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
MC9328MXLCVP15 MC9328MXL.pdf
MC9328MXLCVP15
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
PDTA144EM,315 PDTA144EE.pdf
PDTA144EM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 78670 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11871+0.049 EUR
Mindestbestellmenge: 11871
74HCT4046ADB,118 74HC_HCT4046A.pdf
74HCT4046ADB,118
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16SSOP
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 5843 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
577+0.86 EUR
Mindestbestellmenge: 577
BCW60B,215 BCW60.pdf
Hersteller: NXP USA Inc.
Description: TRANSISTOR NPN 32V 100MA SOT23
Packaging: Bulk
auf Bestellung 36914 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13053+0.033 EUR
Mindestbestellmenge: 13053
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