Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35031) > Seite 562 nach 584
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S9S12ZVLS3F0MFMR | NXP USA Inc. |
 Description: IC MCU 16BIT 32KB FLASH 32QFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12ZVLS3F0MFMR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32QFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVL64F0MFMR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| S912ZVLA12F0MFMR | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12 Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b, 6x12b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 |
Produkt ist nicht verfügbar |
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| FD32K116LFT0MFMR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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LPC802M001JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 33HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 17 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC802M001JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 33HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 17 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF775CHN/N208WDMP | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| LFK77CINTPWA | NXP USA Inc. |
Description: MPC5777C ON A 416 PIN 1.0 MM BGA Packaging: Bulk For Use With/Related Products: MPC5777C Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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| MC35FS4507CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MC35FS4507CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MF3D43C0DA4/00J | NXP USA Inc. |
Description: MF3D43C0DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
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MPXH6101A6U | NXP USA Inc. |
Description: SENSOR 15.23PSIA 5V 8SSOP Features: Temperature Compensated Packaging: Tube Package / Case: 8-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 5 V Operating Pressure: 2.18PSI ~ 15.23PSI (15kPa ~ 105kPa) Pressure Type: Absolute Accuracy: ±1.72% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.5V Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) |
Produkt ist nicht verfügbar |
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74AUP1T34GM,132 | NXP USA Inc. |
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.1V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON (1.45x1) |
auf Bestellung 1152416 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1T34GXH | NXP USA Inc. |
Description: IC TRANSLATOR UNIDIR 5X2SON Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.1V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 5-X2SON (0.80x0.80) |
auf Bestellung 1790440 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1T34GM,115 | NXP USA Inc. |
Description: IC BUFFER LOW PWR N-INV 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.1V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON, SOT886 (1.45x1) |
auf Bestellung 24683406 Stücke: Lieferzeit 10-14 Tag (e) |
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MK10DN32VLH5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 19x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| UJA1132AHW/3F0/0Y | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC32PF1550A1EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MPF5032BMMA5ES | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO A1 DIE Packaging: Tray Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5032BMMA0ESR2 | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO A1 DIE Packaging: Tape & Reel (TR) Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5032BMMA5ESR2 | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO A1 DIE Packaging: Tape & Reel (TR) Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5032BMBA0ESR2 | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO A1 DIE Packaging: Tape & Reel (TR) Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5032BMDA0ESR2 | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO Packaging: Tape & Reel (TR) Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5032BMMA0ES | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO A1 DIE Packaging: Tray Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5032BMBA0ES | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO A1 DIE Packaging: Tray Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5032BMDA0ES | NXP USA Inc. |
Description: PMIC 2 BUCKS 2 LDO Packaging: Tray Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MIMX8MQ6DVAJZIB | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 621-FBGA, FCBGA Speed: 1.5GHz RAM Size: 160kB Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART Peripherals: DMA, PWM, WDT Supplier Device Package: 621-FCPBGA (17x17) Architecture: MPU |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| LFK46MINTPM3QA | NXP USA Inc. |
Description: QORIVVA MPC5746M ON A 176 PIN 0. Packaging: Bulk For Use With/Related Products: MPC5746M Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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| MCIMX7D2DVK12SDR | NXP USA Inc. |
Description: I.MX 7 SERIES 32-BIT MPU, DUAL A Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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LPC1810FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 DigiKey Programmable: Not Verified |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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| KMI86HP | NXP USA Inc. |
Description: KMI86 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| KMI86 | NXP USA Inc. |
Description: MAG SWITCH ANGULAR SENS SOT1291 Packaging: Tape & Reel (TR) Mounting Type: Through Hole |
Produkt ist nicht verfügbar |
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| LFTAJ56M2T | NXP USA Inc. |
Description: QORIVVA MPC5600 176 LQFP ADAPTER Packaging: Bulk For Use With/Related Products: MPC5600 Module/Board Type: Socket Module - LQFP |
Produkt ist nicht verfügbar |
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MC9S08SH32MTG | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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MCHC908QT2MDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SO Packaging: Tube Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BT236X-600F,127 | NXP USA Inc. |
Description: TRIAC 600V 6A TO220-3 Packaging: Bulk |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXV2053GP | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP Features: Temperature Compensated Packaging: Tray Package / Case: 8-SMD, Gull Wing, Side Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: -0.6% ~ 0.4% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 29.01PSI (200kPa) |
Produkt ist nicht verfügbar |
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| 88W8987SA2-NYEA/BK | NXP USA Inc. |
Description: 1X1 11AC WAVE-2 OR 11P CHIP WITH Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Sensitivity: -99dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V, 1.8V, 2.2V Power - Output: 22dBm Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Current - Receiving: 38mA ~ 82mA Data Rate (Max): 433Mbps Current - Transmitting: 79mA ~ 145mA Supplier Device Package: 68-HVQFN (8x8) GPIO: 21 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART |
Produkt ist nicht verfügbar |
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| 88W9098-A1-NYGC/AZ | NXP USA Inc. |
Description: 88W9098-A1-NYGC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| 88W9098-A1-NYGC/AK | NXP USA Inc. |
Description: 88W9098-A1-NYGC Packaging: Tray |
Produkt ist nicht verfügbar |
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| 88Q9098RA1-NYIA/AZ | NXP USA Inc. |
Description: 88Q9098RA1-NYIA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| 88Q9098RA1-NYIA/AK | NXP USA Inc. |
Description: 88Q9098RA1-NYIA Packaging: Tray |
Produkt ist nicht verfügbar |
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| 88W9064-A1-BWPC/AZ | NXP USA Inc. |
Description: MOCHI WIFI ACCESS POINT SOC. 2.4 Packaging: Tape & Reel (TR) Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ax, Bluetooth v5.0 Data Rate (Max): 2.4Gbps Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, PCM, SPI, UART |
Produkt ist nicht verfügbar |
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| 88W9064-A1-BWPC/AK | NXP USA Inc. |
Description: MOCHI WIFI ACCESS POINT SOC. 2.4 Packaging: Tray Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ax, Bluetooth v5.0 Data Rate (Max): 2.4Gbps Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, PCM, SPI, UART |
Produkt ist nicht verfügbar |
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| 88W9064-A1-BWPI/AZ | NXP USA Inc. |
Description: MOCHI WIFI ACCESS POINT SOC. 2.4 Packaging: Tape & Reel (TR) Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ax, Bluetooth v5.0 Data Rate (Max): 2.4Gbps Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, PCM, SPI, UART |
Produkt ist nicht verfügbar |
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| 88W9064-A1-BWPI/AK | NXP USA Inc. |
Description: MOCHI WIFI ACCESS POINT SOC. 2.4 Packaging: Tray Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ax, Bluetooth v5.0 Data Rate (Max): 2.4Gbps Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, PCM, SPI, UART |
Produkt ist nicht verfügbar |
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SPC5744BBK1AMKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX6U5EVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6U1AVM08ADR | NXP USA Inc. |
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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S9S12GN48ACLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12GN48ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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NCK2982RHN/00100Y | NXP USA Inc. |
Description: MANTRA CS Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVL64F0MFM | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC35FS4500NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4500CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4501NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6502NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4500NAE | NXP USA Inc. |
Description: FS4500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6502CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
| S9S12ZVLS3F0MFMR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2500+ | 5.91 EUR |
| S9S12ZVLS3F0MFMR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.77 EUR |
| 10+ | 9.2 EUR |
| 100+ | 7.54 EUR |
| 500+ | 7.38 EUR |
| 1000+ | 6.22 EUR |
| S912ZVL64F0MFMR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVLA12F0MFMR |
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
| FD32K116LFT0MFMR |
Produkt ist nicht verfügbar
| LPC802M001JHI33Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.47 EUR |
| LPC802M001JHI33Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.33 EUR |
| 10+ | 2.6 EUR |
| 100+ | 2.09 EUR |
| 500+ | 1.98 EUR |
| 1000+ | 1.64 EUR |
| 2500+ | 1.52 EUR |
| SAF775CHN/N208WDMP |
Produkt ist nicht verfügbar
| LFK77CINTPWA |
Hersteller: NXP USA Inc.
Description: MPC5777C ON A 416 PIN 1.0 MM BGA
Packaging: Bulk
For Use With/Related Products: MPC5777C
Module/Board Type: Socket Adapter
Description: MPC5777C ON A 416 PIN 1.0 MM BGA
Packaging: Bulk
For Use With/Related Products: MPC5777C
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
| MC35FS4507CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4507CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MF3D43C0DA4/00J |
Hersteller: NXP USA Inc.
Description: MF3D43C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D43C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
| MPXH6101A6U |
|
Hersteller: NXP USA Inc.
Description: SENSOR 15.23PSIA 5V 8SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 5 V
Operating Pressure: 2.18PSI ~ 15.23PSI (15kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.72%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 15.23PSIA 5V 8SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 5 V
Operating Pressure: 2.18PSI ~ 15.23PSI (15kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.72%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
| 74AUP1T34GM,132 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
auf Bestellung 1152416 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2551+ | 0.2 EUR |
| 74AUP1T34GXH |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC TRANSLATOR UNIDIR 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 1790440 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2160+ | 0.23 EUR |
| 74AUP1T34GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Description: IC BUFFER LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
auf Bestellung 24683406 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1811+ | 0.28 EUR |
| MK10DN32VLH5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| UJA1132AHW/3F0/0Y |
|
Produkt ist nicht verfügbar
| MC32PF1550A1EP |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
| MPF5032BMMA5ES |
|
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.17 EUR |
| 10+ | 8.36 EUR |
| 25+ | 8.2 EUR |
| 40+ | 8.14 EUR |
| 80+ | 7.31 EUR |
| 230+ | 7.28 EUR |
| 490+ | 6.82 EUR |
| MPF5032BMMA0ESR2 |
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5032BMMA5ESR2 |
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5032BMBA0ESR2 |
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5032BMDA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO
Packaging: Tape & Reel (TR)
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5032BMMA0ES |
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5032BMBA0ES |
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5032BMDA0ES |
|
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MIMX8MQ6DVAJZIB |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Speed: 1.5GHz
RAM Size: 160kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 621-FCPBGA (17x17)
Architecture: MPU
Description: IC
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Speed: 1.5GHz
RAM Size: 160kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 621-FCPBGA (17x17)
Architecture: MPU
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 104.39 EUR |
| 10+ | 98.07 EUR |
| 25+ | 94.9 EUR |
| 90+ | 87.94 EUR |
| LFK46MINTPM3QA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746M ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5746M ON A 176 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
| MCIMX7D2DVK12SDR |
|
Produkt ist nicht verfügbar
| LPC1810FBD144,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 41+ | 14.27 EUR |
| KMI86HP |
Produkt ist nicht verfügbar
| KMI86 |
Hersteller: NXP USA Inc.
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Description: MAG SWITCH ANGULAR SENS SOT1291
Packaging: Tape & Reel (TR)
Mounting Type: Through Hole
Produkt ist nicht verfügbar
| LFTAJ56M2T |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5600 176 LQFP ADAPTER
Packaging: Bulk
For Use With/Related Products: MPC5600
Module/Board Type: Socket Module - LQFP
Description: QORIVVA MPC5600 176 LQFP ADAPTER
Packaging: Bulk
For Use With/Related Products: MPC5600
Module/Board Type: Socket Module - LQFP
Produkt ist nicht verfügbar
| MC9S08SH32MTG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 70+ | 7.17 EUR |
| MCHC908QT2MDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BT236X-600F,127 |
|
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 846+ | 0.58 EUR |
| MPXV2053GP |
|
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
| 88W8987SA2-NYEA/BK |
|
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 OR 11P CHIP WITH
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Description: 1X1 11AC WAVE-2 OR 11P CHIP WITH
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
| 88W9098-A1-NYGC/AZ |
Produkt ist nicht verfügbar
| 88W9098-A1-NYGC/AK |
Produkt ist nicht verfügbar
| 88Q9098RA1-NYIA/AZ |
Produkt ist nicht verfügbar
| 88Q9098RA1-NYIA/AK |
Produkt ist nicht verfügbar
| 88W9064-A1-BWPC/AZ |
|
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
| 88W9064-A1-BWPC/AK |
|
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
| 88W9064-A1-BWPI/AZ |
|
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
| 88W9064-A1-BWPI/AK |
|
Hersteller: NXP USA Inc.
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Description: MOCHI WIFI ACCESS POINT SOC. 2.4
Packaging: Tray
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ax, Bluetooth v5.0
Data Rate (Max): 2.4Gbps
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, PCM, SPI, UART
Produkt ist nicht verfügbar
| SPC5744BBK1AMKU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCIMX6U5EVM10AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6U1AVM08ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| S9S12GN48ACLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12GN48ACLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| NCK2982RHN/00100Y |
Hersteller: NXP USA Inc.
Description: MANTRA CS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: MANTRA CS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVL64F0MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC35FS4500NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4500CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4501NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6502NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4500NAE |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6502CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar