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MIMX9331AVTYMAB NXP USA Inc. IMX93AEC.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MIMX9332AVTYMAB NXP USA Inc. IMX93AEC.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MIMX9351AVTYMAB NXP USA Inc. IMX93AEC.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
XC7WH14DP,125 XC7WH14DP,125 NXP USA Inc. PHGLS26034-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 3CH 3IN 8TSSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 2.2V ~ 3.85V
Input Logic Level - Low: 0.9V ~ 1.65V
Max Propagation Delay @ V, Max CL: 10.6ns @ 5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 33390 Stücke:
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934+0.52 EUR
Mindestbestellmenge: 934
TJA1103SDB TJA1103SDB NXP USA Inc. getting-started-with-the-tja1103sdb:GS-TJA1103SDB Description: TJA1103 SABRE DEV BOARD
Packaging: Box
Function: Ethernet PHY
Type: Interface
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
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MC56F81866AMLFA NXP USA Inc. MC56F81XXXL.pdf Description: IC
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
LPC1113FBD48/303,1 LPC1113FBD48/303,1 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
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10+ 5.79 EUR
80+ 4.74 EUR
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LPC1113FHN33/202,5 LPC1113FHN33/202,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1040 Stücke:
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129+3.84 EUR
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LPC1113FHN33/203,5 LPC1113FHN33/203,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1113JHN33/203E LPC1113JHN33/203E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PM823HN/A0CHP NXP USA Inc. PM823.pdf Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 24-HVQFN (4x4)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Produkt ist nicht verfügbar
MC56F81868LVLH NXP USA Inc. MC56F81XXXL.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
FB32K146HAT0VLLR NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
PCF85063AT/AY PCF85063AT/AY NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 77500 Stücke:
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2500+0.7 EUR
5000+ 0.67 EUR
12500+ 0.64 EUR
25000+ 0.62 EUR
Mindestbestellmenge: 2500
PCF85063AT/AY PCF85063AT/AY NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 78704 Stücke:
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11+1.65 EUR
12+ 1.48 EUR
25+ 1.41 EUR
100+ 1.15 EUR
250+ 1.08 EUR
500+ 0.95 EUR
1000+ 0.75 EUR
Mindestbestellmenge: 11
PSMN8R5-100ESQ PSMN8R5-100ESQ NXP USA Inc. PHGLS25567-1.pdf?t.download=true&u=5oefqw Description: POWER FIELD-EFFECT TRANSISTOR, 1
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V
auf Bestellung 1274 Stücke:
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MC9S08DZ32AMLF MC9S08DZ32AMLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08DZ32ACLH MC9S08DZ32ACLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908AZ32AVFUE MC908AZ32AVFUE NXP USA Inc. MC68HC908AZ32A.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HC151DB,118 74HC151DB,118 NXP USA Inc. PHGL-S-A0001367771-1.pdf?t.download=true&u=5oefqw Description: MULTIPLEXER, HC/UH SERIES, 1-FUN
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 3696 Stücke:
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1051+0.48 EUR
Mindestbestellmenge: 1051
74HC151DB,112 74HC151DB,112 NXP USA Inc. 74HC_HCT151_Rev5.pdf Description: IC 8-INPUT MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 2751 Stücke:
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912+0.54 EUR
Mindestbestellmenge: 912
NTB0102JKZ NXP USA Inc. NTB0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
NXH3675UK/A2Z NXP USA Inc. NXH3675A4FS.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SPC5644BF0MLU1R SPC5644BF0MLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BCF0VLU8R SPC5644BCF0VLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BF0MLU1 SPC5644BF0MLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BCF0VLU8 SPC5644BCF0VLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BK0VLU1 SPC5644BK0VLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BUK9520-55A,127 BUK9520-55A,127 NXP USA Inc. BUK9520-55A.pdf Description: MOSFET N-CH 55V 54A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V
Power Dissipation (Max): 118W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V
auf Bestellung 1364 Stücke:
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666+0.73 EUR
Mindestbestellmenge: 666
BUK9520-100B,127 NXP USA Inc. BUK9520-100B.pdf Description: MOSFET N-CH 100V 63A TO220AB
Packaging: Tube
auf Bestellung 8479 Stücke:
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567+0.86 EUR
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BUK9520-100A,127 NXP USA Inc. BUK9520-100A.pdf Description: MOSFET N-CH 100V 63A SOT78
Packaging: Tube
auf Bestellung 2996 Stücke:
Lieferzeit 10-14 Tag (e)
494+0.99 EUR
Mindestbestellmenge: 494
BT169D,116 NXP USA Inc. BT169_Series.pdf Description: THYRISTOR 400V 0.8A TO92-3
Packaging: Bulk
auf Bestellung 8037 Stücke:
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4646+0.098 EUR
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PBLS2001D,115 PBLS2001D,115 NXP USA Inc. PBLS2001D.pdf Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP
Packaging: Bulk
auf Bestellung 51400 Stücke:
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4230+0.11 EUR
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MC33FS8530A4KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33FS8530A4KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S9KEAZN8ACTGR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: KINETIS E 32-BIT MCU, ARM CORTEX
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
SPC5745CBK1AMMJ6 SPC5745CBK1AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F80738VLH MC56F80738VLH NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PEMI6QFN/HE,132 PEMI6QFN/HE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.26 EUR
Mindestbestellmenge: 1902
SAF7751HN/N207WK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
TDA8766G/C1,118 TDA8766G/C1,118 NXP USA Inc. TDA8766.pdf Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
20+25.52 EUR
Mindestbestellmenge: 20
S912XD256F1CAAR S912XD256F1CAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7SH32GV,125 XC7SH32GV,125 NXP USA Inc. XC7SH32.pdf Description: IC GATE OR 1CH 2-INP 5-TSOP
Packaging: Bulk
auf Bestellung 120000 Stücke:
Lieferzeit 10-14 Tag (e)
1679+0.29 EUR
Mindestbestellmenge: 1679
XC7SET14GV,125 XC7SET14GV,125 NXP USA Inc. XC7SET14.pdf Description: IC SCHMITT TRIGGER INVERT 5TSOP
Packaging: Bulk
auf Bestellung 76262 Stücke:
Lieferzeit 10-14 Tag (e)
1679+0.29 EUR
Mindestbestellmenge: 1679
XC7SH125GM,115 XC7SH125GM,115 NXP USA Inc. XC7SH125.pdf Description: IC BUS BUFFER/LINEDVR 3ST 6XSON
Packaging: Bulk
auf Bestellung 167064 Stücke:
Lieferzeit 10-14 Tag (e)
1397+0.34 EUR
Mindestbestellmenge: 1397
PBSS5350SS,115 PBSS5350SS,115 NXP USA Inc. PBSS5350SS.pdf Description: TRANS 2PNP 50V 2.7A 8SO
Packaging: Bulk
auf Bestellung 1790 Stücke:
Lieferzeit 10-14 Tag (e)
1790+0.28 EUR
Mindestbestellmenge: 1790
MC32PF1550A5EPR2 MC32PF1550A5EPR2 NXP USA Inc. Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC32PF1550A7EPR2 MC32PF1550A7EPR2 NXP USA Inc. Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC32PF1550A6EP MC32PF1550A6EP NXP USA Inc. Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
74LVC157ADB,112 74LVC157ADB,112 NXP USA Inc. 74LVC157A.pdf Description: IC QUAD 2-IN MUX 16SSOP
Packaging: Tube
auf Bestellung 4591 Stücke:
Lieferzeit 10-14 Tag (e)
1967+0.24 EUR
Mindestbestellmenge: 1967
NAFE11388B40BSMP NAFE11388B40BSMP NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+20.47 EUR
Mindestbestellmenge: 1000
NAFE11388B40BSMP NAFE11388B40BSMP NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.31 EUR
10+ 29.7 EUR
25+ 28.47 EUR
100+ 25.08 EUR
250+ 23.85 EUR
500+ 22.31 EUR
NAFE11388B40BSE NAFE11388B40BSE NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.31 EUR
10+ 29.7 EUR
25+ 28.47 EUR
80+ 25.08 EUR
260+ 23.85 EUR
S912XDP512J1CAGR S912XDP512J1CAGR NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
500+44.32 EUR
Mindestbestellmenge: 500
SAF775DHV/N208W/GY NXP USA Inc. Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/GK NXP USA Inc. Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/EY NXP USA Inc. Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/EK NXP USA Inc. Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775CHV/N208W/KY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775CHV/N208W/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
MIMX9331AVTYMAB IMX93AEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MIMX9332AVTYMAB IMX93AEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MIMX9351AVTYMAB IMX93AEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
XC7WH14DP,125 PHGLS26034-1.pdf?t.download=true&u=5oefqw
XC7WH14DP,125
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3IN 8TSSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 2.2V ~ 3.85V
Input Logic Level - Low: 0.9V ~ 1.65V
Max Propagation Delay @ V, Max CL: 10.6ns @ 5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 33390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
934+0.52 EUR
Mindestbestellmenge: 934
TJA1103SDB getting-started-with-the-tja1103sdb:GS-TJA1103SDB
TJA1103SDB
Hersteller: NXP USA Inc.
Description: TJA1103 SABRE DEV BOARD
Packaging: Box
Function: Ethernet PHY
Type: Interface
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+325.72 EUR
MC56F81866AMLFA MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
LPC1113FBD48/303,1 LPC111X.pdf
LPC1113FBD48/303,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.41 EUR
10+ 5.79 EUR
80+ 4.74 EUR
Mindestbestellmenge: 3
LPC1113FHN33/202,5 UM10398.pdf
LPC1113FHN33/202,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1040 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
129+3.84 EUR
Mindestbestellmenge: 129
LPC1113FHN33/203,5 UM10398.pdf
LPC1113FHN33/203,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1113JHN33/203E LPC111X.pdf
LPC1113JHN33/203E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PM823HN/A0CHP PM823.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 24-HVQFN (4x4)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Produkt ist nicht verfügbar
MC56F81868LVLH MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
FB32K146HAT0VLLR
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
PCF85063AT/AY PCF85063A.pdf
PCF85063AT/AY
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 77500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+0.7 EUR
5000+ 0.67 EUR
12500+ 0.64 EUR
25000+ 0.62 EUR
Mindestbestellmenge: 2500
PCF85063AT/AY PCF85063A.pdf
PCF85063AT/AY
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
auf Bestellung 78704 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11+1.65 EUR
12+ 1.48 EUR
25+ 1.41 EUR
100+ 1.15 EUR
250+ 1.08 EUR
500+ 0.95 EUR
1000+ 0.75 EUR
Mindestbestellmenge: 11
PSMN8R5-100ESQ PHGLS25567-1.pdf?t.download=true&u=5oefqw
PSMN8R5-100ESQ
Hersteller: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR, 1
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V
auf Bestellung 1274 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
486+1.01 EUR
Mindestbestellmenge: 486
MC9S08DZ32AMLF MC9S08DZ60.pdf
MC9S08DZ32AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08DZ32ACLH
MC9S08DZ32ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908AZ32AVFUE MC68HC908AZ32A.pdf
MC908AZ32AVFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HC151DB,118 PHGL-S-A0001367771-1.pdf?t.download=true&u=5oefqw
74HC151DB,118
Hersteller: NXP USA Inc.
Description: MULTIPLEXER, HC/UH SERIES, 1-FUN
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 3696 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1051+0.48 EUR
Mindestbestellmenge: 1051
74HC151DB,112 74HC_HCT151_Rev5.pdf
74HC151DB,112
Hersteller: NXP USA Inc.
Description: IC 8-INPUT MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 2751 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
912+0.54 EUR
Mindestbestellmenge: 912
NTB0102JKZ NTB0102.pdf
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
NXH3675UK/A2Z NXH3675A4FS.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SPC5644BF0MLU1R
SPC5644BF0MLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BCF0VLU8R
SPC5644BCF0VLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BF0MLU1
SPC5644BF0MLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BCF0VLU8
SPC5644BCF0VLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BK0VLU1
SPC5644BK0VLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BUK9520-55A,127 BUK9520-55A.pdf
BUK9520-55A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 54A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V
Power Dissipation (Max): 118W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V
auf Bestellung 1364 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
666+0.73 EUR
Mindestbestellmenge: 666
BUK9520-100B,127 BUK9520-100B.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 63A TO220AB
Packaging: Tube
auf Bestellung 8479 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
567+0.86 EUR
Mindestbestellmenge: 567
BUK9520-100A,127 BUK9520-100A.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 63A SOT78
Packaging: Tube
auf Bestellung 2996 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
494+0.99 EUR
Mindestbestellmenge: 494
BT169D,116 BT169_Series.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 400V 0.8A TO92-3
Packaging: Bulk
auf Bestellung 8037 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4646+0.098 EUR
Mindestbestellmenge: 4646
PBLS2001D,115 PBLS2001D.pdf
PBLS2001D,115
Hersteller: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP
Packaging: Bulk
auf Bestellung 51400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4230+0.11 EUR
Mindestbestellmenge: 4230
MC33FS8530A4KSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33FS8530A4KS FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S9KEAZN8ACTGR S9KEA8P44M48SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS E 32-BIT MCU, ARM CORTEX
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
SPC5745CBK1AMMJ6 MPC5746C.pdf
SPC5745CBK1AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F80738VLH MC56F80XXX.pdf
MC56F80738VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PEMI6QFN/HE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/HE,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1902+0.26 EUR
Mindestbestellmenge: 1902
SAF7751HN/N207WK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
TDA8766G/C1,118 TDA8766.pdf
TDA8766G/C1,118
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
20+25.52 EUR
Mindestbestellmenge: 20
S912XD256F1CAAR
S912XD256F1CAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7SH32GV,125 XC7SH32.pdf
XC7SH32GV,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5-TSOP
Packaging: Bulk
auf Bestellung 120000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1679+0.29 EUR
Mindestbestellmenge: 1679
XC7SET14GV,125 XC7SET14.pdf
XC7SET14GV,125
Hersteller: NXP USA Inc.
Description: IC SCHMITT TRIGGER INVERT 5TSOP
Packaging: Bulk
auf Bestellung 76262 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1679+0.29 EUR
Mindestbestellmenge: 1679
XC7SH125GM,115 XC7SH125.pdf
XC7SH125GM,115
Hersteller: NXP USA Inc.
Description: IC BUS BUFFER/LINEDVR 3ST 6XSON
Packaging: Bulk
auf Bestellung 167064 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1397+0.34 EUR
Mindestbestellmenge: 1397
PBSS5350SS,115 PBSS5350SS.pdf
PBSS5350SS,115
Hersteller: NXP USA Inc.
Description: TRANS 2PNP 50V 2.7A 8SO
Packaging: Bulk
auf Bestellung 1790 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1790+0.28 EUR
Mindestbestellmenge: 1790
MC32PF1550A5EPR2
MC32PF1550A5EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC32PF1550A7EPR2
MC32PF1550A7EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC32PF1550A6EP
MC32PF1550A6EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
74LVC157ADB,112 74LVC157A.pdf
74LVC157ADB,112
Hersteller: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16SSOP
Packaging: Tube
auf Bestellung 4591 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1967+0.24 EUR
Mindestbestellmenge: 1967
NAFE11388B40BSMP
NAFE11388B40BSMP
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+20.47 EUR
Mindestbestellmenge: 1000
NAFE11388B40BSMP
NAFE11388B40BSMP
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.31 EUR
10+ 29.7 EUR
25+ 28.47 EUR
100+ 25.08 EUR
250+ 23.85 EUR
500+ 22.31 EUR
NAFE11388B40BSE
NAFE11388B40BSE
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.31 EUR
10+ 29.7 EUR
25+ 28.47 EUR
80+ 25.08 EUR
260+ 23.85 EUR
S912XDP512J1CAGR
S912XDP512J1CAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
500+44.32 EUR
Mindestbestellmenge: 500
SAF775DHV/N208W/GY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/GK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775DHV/N208W/EY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775DHV/N208W/EK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
SAF775CHV/N208W/KY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Bulk
Produkt ist nicht verfügbar
SAF775CHV/N208W/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
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