Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35031) > Seite 560 nach 584
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| S9S12GN16J0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
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MC908JB8JDWE | NXP USA Inc. |
 Description: IC MCU 8BIT 8KB FLASH 20SOICPackaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V Connectivity: USB Peripherals: LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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| MWCT2016SHVPBR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP172 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MWCT2016SHVPB | NXP USA Inc. |
Description: MWCT2016S,MAXQFP172 Packaging: Tray |
Produkt ist nicht verfügbar |
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SSL3250AHN/C1,528 | NXP USA Inc. |
Description: IC LED DRVR RGLTR I2C 16HVQFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Voltage - Output: 9.5V Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 1.2MHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Applications: Camera Flash Current - Output / Channel: 500mA Internal Switch(s): Yes Topology: Step-Up (Boost) Supplier Device Package: 16-HVQFN (3x3) Dimming: I2C Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
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SSL3250AHN/C1,528 | NXP USA Inc. |
Description: IC LED DRVR RGLTR I2C 16HVQFN Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Voltage - Output: 9.5V Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 1.2MHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Applications: Camera Flash Current - Output / Channel: 500mA Internal Switch(s): Yes Topology: Step-Up (Boost) Supplier Device Package: 16-HVQFN (3x3) Dimming: I2C Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
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MC32PF1550A8EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.1V ~ 6V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MCIMX6S8DVM10AB | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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DSPB56374AE | NXP USA Inc. |
Description: IC DSP 24BIT 150MHZ 52-LQFP Packaging: Tray Package / Case: 52-LQFP Mounting Type: Surface Mount Interface: Host Interface, I2C, SAI, SPI Type: Audio Processor Operating Temperature: 0°C ~ 70°C (TA) Non-Volatile Memory: ROM (84kB) On-Chip RAM: 54kB Voltage - I/O: 3.30V Voltage - Core: 1.25V Clock Rate: 150MHz Supplier Device Package: 52-TQFP (10x10) |
Produkt ist nicht verfügbar |
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S912XEG384J3VAA | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51QU64VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 13x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MC33PF8100FJESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE- Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MC33PF8100FJES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE- Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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FS32K118LFT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| S12ZVML-MINIKIT | NXP USA Inc. |
Description: S12ZVML-MINIBRD WITH A LINIX PM Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: S12ZVML128 Supplied Contents: Board(s) Primary Attributes: Motors (PMSM) Embedded: Yes, MCU, 16-Bit |
Produkt ist nicht verfügbar |
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| MIMXRT106PDVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 128MB ROM 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 |
Produkt ist nicht verfügbar |
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| SL3S1204FUD/HA1Z | NXP USA Inc. |
Description: IC RFID TRANSP 860-960MHZ WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 860MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Standards: EPC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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| MIMXRT1011DAE5AR | NXP USA Inc. |
Description: IC MCU 32BIT 64KB ROM 80LQFP Packaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 64KB (64K x 8) RAM Size: 128K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 15x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 44 |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLN8372QR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-16G ANALOG 12QFN Features: Selectable Scale Packaging: Tape & Reel (TR) Package / Case: 12-VQFN Exposed Pad Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 2.7kHz (X,Y), 600Hz (Z) Supplier Device Package: 12-QFN (3x3) Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g) |
Produkt ist nicht verfügbar |
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| TJA1128BTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128BTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128ATK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| TJA1128ATK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 4750 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128CTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128CTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128FTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128FTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128ETK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128ETK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128DTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128DTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128HTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128HTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1128GTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| TJA1128GTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 5973 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33FS4507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MC33FS4507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MRF6S19100HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.99GHz Power - Output: 22W Gain: 16.1dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 900 mA |
Produkt ist nicht verfügbar |
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MC50XS4200BEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP Features: Slew Rate Controlled Packaging: Bulk Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 50mOhm Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V Current - Output (Max): 1.2A Ratio - Input:Output: 1:1 Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJR1462BTK/0Z | NXP USA Inc. |
Description: IC 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (3x3) |
Produkt ist nicht verfügbar |
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| TJR1462ATK/0Z | NXP USA Inc. |
Description: IC 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (3x3) |
Produkt ist nicht verfügbar |
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| TJR1462BT/0Z | NXP USA Inc. |
Description: IC 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
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| TJR1462AT/0Z | NXP USA Inc. |
Description: IC 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
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| TJR1463ATK/0Z | NXP USA Inc. |
Description: IC 14HVSON Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 14-HVSON (3x4.5) |
Produkt ist nicht verfügbar |
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TJR1463AT/0Z | NXP USA Inc. |
Description: IC 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 14-SO |
Produkt ist nicht verfügbar |
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| FRDM-K32L2A4S | NXP USA Inc. |
Description: FRDM-K32L2A4S Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: K32 L2A Platform: Freedom |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC54016JBD100Y | NXP USA Inc. |
Description: LPC54016JBD100 Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 64 |
Produkt ist nicht verfügbar |
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PMPB12UN,115 | NXP USA Inc. |
Description: MOSFET N-CH 20V 7.9A 6DFN Packaging: Tape & Reel (TR) Package / Case: 6-UDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta) Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: 6-DFN2020MD (2x2) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V |
Produkt ist nicht verfügbar |
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| PN5190B0EV/C107Y | NXP USA Inc. |
Description: PN5190B0EV Packaging: Tape & Reel (TR) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 6V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
Produkt ist nicht verfügbar |
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MC68360VR25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
Produkt ist nicht verfügbar |
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| MFS2303BMMA0EPR2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MFS2303BMMA0EP | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
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| IW610BUK/A0ZMIZ | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610BHN/A0ZMIMP | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610BHN/A0ZMIK | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610FUK/A0ZMIZ | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610FHN/A0ZMIMP | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610FHN/A0ZMIK | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610CUK/A0ZMIZ | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| IW610CHN/A0ZMIMP | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
| S9S12GN16J0VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
| MC908JB8JDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.75 EUR |
| 10+ | 8.41 EUR |
| MWCT2016SHVPBR |
Produkt ist nicht verfügbar
| MWCT2016SHVPB |
Produkt ist nicht verfügbar
| SSL3250AHN/C1,528 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
| SSL3250AHN/C1,528 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
| MC32PF1550A8EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
| MCIMX6S8DVM10AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| DSPB56374AE |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Produkt ist nicht verfügbar
| S912XEG384J3VAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF51QU64VLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 13x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 13x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC33PF8100FJESR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC33PF8100FJES |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| FS32K118LFT0VLFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S12ZVML-MINIKIT |
|
Hersteller: NXP USA Inc.
Description: S12ZVML-MINIBRD WITH A LINIX PM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (PMSM)
Embedded: Yes, MCU, 16-Bit
Description: S12ZVML-MINIBRD WITH A LINIX PM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (PMSM)
Embedded: Yes, MCU, 16-Bit
Produkt ist nicht verfügbar
| MIMXRT106PDVL6B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Produkt ist nicht verfügbar
| SL3S1204FUD/HA1Z |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: EPC
Supplier Device Package: Wafer
Description: IC RFID TRANSP 860-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
| MIMXRT1011DAE5AR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB ROM 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 44
Description: IC MCU 32BIT 64KB ROM 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 44
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.13 EUR |
| 10+ | 6.46 EUR |
| 25+ | 6.32 EUR |
| 50+ | 6.28 EUR |
| 100+ | 5.63 EUR |
| 250+ | 5.61 EUR |
| 500+ | 5.41 EUR |
| FXLN8372QR1 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Features: Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 2.7kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Features: Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 2.7kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Produkt ist nicht verfügbar
| TJA1128BTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.22 EUR |
| TJA1128BTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.78 EUR |
| 10+ | 2.5 EUR |
| 25+ | 2.35 EUR |
| 100+ | 2.01 EUR |
| 250+ | 1.88 EUR |
| 500+ | 1.65 EUR |
| 1000+ | 1.36 EUR |
| 2500+ | 1.27 EUR |
| TJA1128ATK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJA1128ATK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4750 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.78 EUR |
| 10+ | 2.5 EUR |
| 25+ | 2.35 EUR |
| 100+ | 2.01 EUR |
| 250+ | 1.88 EUR |
| 500+ | 1.65 EUR |
| 1000+ | 1.36 EUR |
| 2500+ | 1.27 EUR |
| TJA1128CTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.34 EUR |
| TJA1128CTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.04 EUR |
| 10+ | 2.73 EUR |
| 25+ | 2.58 EUR |
| 100+ | 2.2 EUR |
| 250+ | 2.06 EUR |
| 500+ | 1.8 EUR |
| 1000+ | 1.5 EUR |
| 2500+ | 1.39 EUR |
| TJA1128FTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.35 EUR |
| TJA1128FTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.04 EUR |
| 10+ | 2.74 EUR |
| 25+ | 2.59 EUR |
| 100+ | 2.21 EUR |
| 250+ | 2.07 EUR |
| 500+ | 1.81 EUR |
| 1000+ | 1.5 EUR |
| 2500+ | 1.4 EUR |
| TJA1128ETK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.35 EUR |
| TJA1128ETK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.04 EUR |
| 10+ | 2.74 EUR |
| 25+ | 2.59 EUR |
| 100+ | 2.21 EUR |
| 250+ | 2.07 EUR |
| 500+ | 1.81 EUR |
| 1000+ | 1.5 EUR |
| 2500+ | 1.4 EUR |
| TJA1128DTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.35 EUR |
| TJA1128DTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.04 EUR |
| 10+ | 2.74 EUR |
| 25+ | 2.59 EUR |
| 100+ | 2.21 EUR |
| 250+ | 2.07 EUR |
| 500+ | 1.81 EUR |
| 1000+ | 1.5 EUR |
| 2500+ | 1.4 EUR |
| TJA1128HTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.47 EUR |
| TJA1128HTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.33 EUR |
| 10+ | 2.99 EUR |
| 25+ | 2.82 EUR |
| 100+ | 2.41 EUR |
| 250+ | 2.26 EUR |
| 500+ | 1.98 EUR |
| 1000+ | 1.64 EUR |
| 2500+ | 1.52 EUR |
| TJA1128GTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJA1128GTK/1Z |
|
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5973 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.33 EUR |
| 10+ | 2.99 EUR |
| 25+ | 2.82 EUR |
| 100+ | 2.41 EUR |
| 250+ | 2.26 EUR |
| 500+ | 1.98 EUR |
| 1000+ | 1.64 EUR |
| 2500+ | 1.52 EUR |
| MC33FS4507NAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC33FS4507NAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MRF6S19100HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 22W
Gain: 16.1dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 22W
Gain: 16.1dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
| MC50XS4200BEK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 42+ | 11.85 EUR |
| TJR1462BTK/0Z |
Hersteller: NXP USA Inc.
Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
| TJR1462ATK/0Z |
Hersteller: NXP USA Inc.
Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Description: IC 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
| TJR1462BT/0Z |
Hersteller: NXP USA Inc.
Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
| TJR1462AT/0Z |
Hersteller: NXP USA Inc.
Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Description: IC 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
| TJR1463ATK/0Z |
Hersteller: NXP USA Inc.
Description: IC 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 14-HVSON (3x4.5)
Description: IC 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 14-HVSON (3x4.5)
Produkt ist nicht verfügbar
| TJR1463AT/0Z |
Hersteller: NXP USA Inc.
Description: IC 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Description: IC 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
| FRDM-K32L2A4S |
|
Hersteller: NXP USA Inc.
Description: FRDM-K32L2A4S
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2A
Platform: Freedom
Description: FRDM-K32L2A4S
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2A
Platform: Freedom
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 86.82 EUR |
| LPC54016JBD100Y |
Hersteller: NXP USA Inc.
Description: LPC54016JBD100
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
Description: LPC54016JBD100
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
| PMPB12UN,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 7.9A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
Description: MOSFET N-CH 20V 7.9A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
Produkt ist nicht verfügbar
| PN5190B0EV/C107Y |
Hersteller: NXP USA Inc.
Description: PN5190B0EV
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN5190B0EV
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
| MC68360VR25VL |
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Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
| MFS2303BMMA0EPR2 |
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Produkt ist nicht verfügbar