Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35021) > Seite 526 nach 584
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MC33771BSP2AER2 | NXP USA Inc. |
 Description: IC BAT CNTRL LI-ION 7-14C 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Grade: Automotive Qualification: AEC-Q100 |
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MIMXRT1042XJM5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 128KB (128K x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, PWM, WDT Supplier Device Package: 169-LFBGA (11x11) DigiKey Programmable: Not Verified |
auf Bestellung 185 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100FBANES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) |
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PMV30XN,215 | NXP USA Inc. |
Description: MOSFET N-CH 20V 3.2A TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta) Rds On (Max) @ Id, Vgs: 35mOhm @ 3.2A, 4.5V Power Dissipation (Max): 380mW (Ta) Vgs(th) (Max) @ Id: 1.5V @ 250µA Supplier Device Package: SOT-23 (TO-236AB) Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 15 V |
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PMV30XN,215 | NXP USA Inc. |
Description: MOSFET N-CH 20V 3.2A TO236AB Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta) Rds On (Max) @ Id, Vgs: 35mOhm @ 3.2A, 4.5V Power Dissipation (Max): 380mW (Ta) Vgs(th) (Max) @ Id: 1.5V @ 250µA Supplier Device Package: SOT-23 (TO-236AB) Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 15 V |
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MKL05Z32VFK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24QFN Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 22 DigiKey Programmable: Not Verified |
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S912XDG128F2VAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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S912XDG128F2VAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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S912XDG128F2MAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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S912XDG128F2MALR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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MC9S12XDG128MAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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MC9S12XDG128MAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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MC9S12DG128VPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Verified |
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MC9S12DG128MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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MC9S12DG128MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Verified |
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MC912DG128CCPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 69 DigiKey Programmable: Not Verified |
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MC912DG128AVPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 69 DigiKey Programmable: Not Verified |
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MC9S12DG128BCFU | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12DG128MPV | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908GR16ACFAE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified |
auf Bestellung 1715 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC153DB,112 | NXP USA Inc. |
Description: IC DUAL 4-IN MUX 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
auf Bestellung 1092 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08EL32F1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MD7IC2012GNR1 | NXP USA Inc. |
Description: NARROW BAND HIGH POWER AMPLIFIER Packaging: Bulk |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MKW36A512VFT4R | NXP USA Inc. |
Description: KINETIS W MCU, ARM CM0+ Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -99dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 5dBm Protocol: Bluetooth v5.0 Current - Receiving: 6.3mA Data Rate (Max): 1Mbps Current - Transmitting: 5.7mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 25 Modulation: FSK, GFSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
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| MK65FN2M0VMI18R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 169-MAPBGA (9x9) Number of I/O: 116 DigiKey Programmable: Not Verified |
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HEC4069UBT,112 | NXP USA Inc. |
Description: IC INVERTER 6CH 1-INP 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 15V Current - Output High, Low: 3.4mA, 3.4mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 4V ~ 12.5V Input Logic Level - Low: 1V ~ 2.5V Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 1 µA |
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FRDM-BC3770-EVM | NXP USA Inc. |
Description: BC3770 BOARD WITH FRDM-KL25Z Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: BC3770, KL1x, KL2x, mbed-Enabled Development Supplied Contents: Board(s), Cable(s) Primary Attributes: Li-Ion (1 Cell) Embedded: Yes, MCU, 32-Bit |
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MPC860SRVR50D4-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk |
auf Bestellung 433 Stücke: Lieferzeit 10-14 Tag (e) |
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MPX4100AP | NXP USA Inc. |
 Description: SENSOR 15.23PSIA 0.19" 4.9VPackaging: Tray Features: Temperature Compensated Package / Case: 6-SIP Module Output Type: Analog Voltage Mounting Type: Through Hole Output: 0.3 V ~ 4.9 V Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa) Pressure Type: Absolute Accuracy: ±1.8% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 4.85V ~ 5.35V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) |
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74LVC138ADB,118 | NXP USA Inc. |
Description: IC 3-8 DECOD/DEMUX INV 16SSOP Packaging: Bulk |
auf Bestellung 8323 Stücke: Lieferzeit 10-14 Tag (e) |
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PMCM650VNEZ | NXP USA Inc. |
Description: MOSFET N-CH 12V 6.4A 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta) Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V Power Dissipation (Max): 556mW (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 900mV @ 250µA Supplier Device Package: 6-WLCSP (1.48x0.98) Drive Voltage (Max Rds On, Min Rds On): 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V |
auf Bestellung 474624 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1777FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08EL16F1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
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S912XET256W1VAAR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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S912XEP768W1CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
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AFT27S010NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5W Packaging: Tape & Reel (TR) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 1.26W Gain: 21.7dB Technology: LDMOS Supplier Device Package: PLD-1.5W Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 90 mA |
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AFT27S010NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5W Packaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 1.26W Gain: 21.7dB Technology: LDMOS Supplier Device Package: PLD-1.5W Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 90 mA |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836CX4/18P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 300MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.8V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.16V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 44975 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC870ZT133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART |
Produkt ist nicht verfügbar |
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MPC870CVR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART |
Produkt ist nicht verfügbar |
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74HC241D,652 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST DUAL 20SOIC Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 4 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SO |
auf Bestellung 36922 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL3S1206FUD2/HAA | NXP USA Inc. |
Description: SL3S1206FUD2 Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Type: RFID Reader Operating Temperature: -40°C ~ 85°C Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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| S912ZVL12AVLFR | NXP USA Inc. |
Description: S12Z CPU, 6128K FLASH Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 |
Produkt ist nicht verfügbar |
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74AUP2G3404GM,125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AUP2G3404GM - INV Packaging: Bulk Package / Case: 6-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Buffer/Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Input (1, 1) Schmitt Trigger Input: No Supplier Device Package: 6-XSON (1.45x1) Number of Circuits: 2 |
auf Bestellung 91440 Stücke: Lieferzeit 10-14 Tag (e) |
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SL3S1214FTB0/1X | NXP USA Inc. |
Description: IC RFID TRANSP 860-960MHZ 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 860MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: 6-XSON, SOT886 (1.45x1) |
Produkt ist nicht verfügbar |
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SL3S1214FTB0/1X | NXP USA Inc. |
Description: IC RFID TRANSP 860-960MHZ 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 860MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: 6-XSON, SOT886 (1.45x1) |
Produkt ist nicht verfügbar |
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NZH3V0B115 | NXP USA Inc. |
Description: NOW NEXPERIA NZH3V0B - ZENER DIO Packaging: Bulk Tolerance: ±5% Package / Case: SOD-123F Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 3 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOD-123F Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 µA @ 1 V Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 25950 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8377VRANGA | NXP USA Inc. |
Description: IC MPU MPC83XX 800MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) |
Produkt ist nicht verfügbar |
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S912ZVC19AVKHR | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 16x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 42 |
Produkt ist nicht verfügbar |
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S912ZVC19AVKH | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| STMP3780XXBBEA5N | NXP USA Inc. |
Description: STMP3780XXBBEA5N Packaging: Bulk |
Produkt ist nicht verfügbar |
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| PH5830DLX | NXP USA Inc. |
Description: PH5830 - N-CHANNEL TRENCHMOS LOG Packaging: Bulk |
auf Bestellung 152950 Stücke: Lieferzeit 10-14 Tag (e) |
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PH5830DL,115 | NXP USA Inc. |
Description: PH5830 - N-CHANNEL TRENCHMOS LOG Packaging: Bulk |
auf Bestellung 106500 Stücke: Lieferzeit 10-14 Tag (e) |
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ASL2416SHNY | NXP USA Inc. |
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Voltage - Output: 2.5V ~ 70V Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 100kHz ~ 2MHz Type: Linear Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive, Lighting Current - Output / Channel: 1.5A Internal Switch(s): No Topology: Buck Supplier Device Package: 32-HVQFN (5x5) Dimming: PWM Voltage - Supply (Min): 10V Voltage - Supply (Max): 80V |
Produkt ist nicht verfügbar |
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ASL2416SHNY | NXP USA Inc. |
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Voltage - Output: 2.5V ~ 70V Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 100kHz ~ 2MHz Type: Linear Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive, Lighting Current - Output / Channel: 1.5A Internal Switch(s): No Topology: Buck Supplier Device Package: 32-HVQFN (5x5) Dimming: PWM Voltage - Supply (Min): 10V Voltage - Supply (Max): 80V |
Produkt ist nicht verfügbar |
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| ASL2416SHN/L1Y | NXP USA Inc. |
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Voltage - Output: 2.5V ~ 70V Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 100kHz ~ 2MHz Type: Linear Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive, Lighting Current - Output / Channel: 1.5A Internal Switch(s): No Topology: Buck Supplier Device Package: 32-HVQFN (5x5) Dimming: PWM Voltage - Supply (Min): 10V Voltage - Supply (Max): 80V |
Produkt ist nicht verfügbar |
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S912ZVCA96F0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x12b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVCA96F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x12b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MIMXRT1042XFP5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 128KB (128K x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, PWM, WDT Supplier Device Package: 169-LFBGA (9x9) DigiKey Programmable: Not Verified |
auf Bestellung 502 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1041DFP6B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 90°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Connectivity: CANbus, Ethernet, I²C, MMC/SD, SAI, SPI, UART/USART, USB Peripherals: DMA, I²S, LCD, PWM, WDT Supplier Device Package: 169-LFBGA (9x9) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| MC33771BSP2AER2 |
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Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MIMXRT1042XJM5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
DigiKey Programmable: Not Verified
auf Bestellung 185 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.95 EUR |
| 10+ | 18.34 EUR |
| 176+ | 15.49 EUR |
| MMPF0100FBANES |
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
| PMV30XN,215 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 3.2A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 35mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 15 V
Description: MOSFET N-CH 20V 3.2A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 35mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 15 V
Produkt ist nicht verfügbar
| PMV30XN,215 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 3.2A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 35mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 15 V
Description: MOSFET N-CH 20V 3.2A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 35mOhm @ 3.2A, 4.5V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 15 V
Produkt ist nicht verfügbar
| MKL05Z32VFK4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XDG128F2VAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XDG128F2VAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XDG128F2MAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XDG128F2MALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12XDG128MAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12XDG128MAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12DG128VPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC9S12DG128MFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12DG128MPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC912DG128CCPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC912DG128AVPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12DG128BCFU |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12DG128MPV |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908GR16ACFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1715 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 21+ | 24.31 EUR |
| 74HC153DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC DUAL 4-IN MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC DUAL 4-IN MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 1092 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1092+ | 0.56 EUR |
| S9S08EL32F1CTJR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MD7IC2012GNR1 |
|
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 74 EUR |
| MKW36A512VFT4R |
Hersteller: NXP USA Inc.
Description: KINETIS W MCU, ARM CM0+
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 25
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: KINETIS W MCU, ARM CM0+
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 25
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MK65FN2M0VMI18R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Number of I/O: 116
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| HEC4069UBT,112 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
| FRDM-BC3770-EVM |
|
Hersteller: NXP USA Inc.
Description: BC3770 BOARD WITH FRDM-KL25Z
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: BC3770, KL1x, KL2x, mbed-Enabled Development
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Li-Ion (1 Cell)
Embedded: Yes, MCU, 32-Bit
Description: BC3770 BOARD WITH FRDM-KL25Z
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: BC3770, KL1x, KL2x, mbed-Enabled Development
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Li-Ion (1 Cell)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
| MPC860SRVR50D4-NXP |
|
auf Bestellung 433 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 275.45 EUR |
| MPX4100AP | |
|
Hersteller: NXP USA Inc.
Description: SENSOR 15.23PSIA 0.19" 4.9V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.8%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.85V ~ 5.35V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 15.23PSIA 0.19" 4.9V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.8%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.85V ~ 5.35V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
| 74LVC138ADB,118 |
|
auf Bestellung 8323 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1893+ | 0.26 EUR |
| PMCM650VNEZ |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 12V 6.4A 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V
Description: MOSFET N-CH 12V 6.4A 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V
auf Bestellung 474624 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 275+ | 1.77 EUR |
| LPC1777FBD208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 29.71 EUR |
| 10+ | 23.74 EUR |
| S9S08EL16F1CTJR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XET256W1VAAR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XEP768W1CAGR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| AFT27S010NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
| AFT27S010NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.53 EUR |
| 10+ | 20.71 EUR |
| 25+ | 19.86 EUR |
| LD6836CX4/18P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 44975 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2664+ | 0.18 EUR |
| MPC870ZT133 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
| MPC870CVR66 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
| 74HC241D,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST DUAL 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Description: IC BUFF/DVR TRI-ST DUAL 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
auf Bestellung 36922 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 964+ | 0.51 EUR |
| SL3S1206FUD2/HAA |
|
Hersteller: NXP USA Inc.
Description: SL3S1206FUD2
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: Wafer
Description: SL3S1206FUD2
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
| S912ZVL12AVLFR |
Hersteller: NXP USA Inc.
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
| 74AUP2G3404GM,125 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP2G3404GM - INV
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2 Input (1, 1)
Schmitt Trigger Input: No
Supplier Device Package: 6-XSON (1.45x1)
Number of Circuits: 2
Description: NOW NEXPERIA 74AUP2G3404GM - INV
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2 Input (1, 1)
Schmitt Trigger Input: No
Supplier Device Package: 6-XSON (1.45x1)
Number of Circuits: 2
auf Bestellung 91440 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3096+ | 0.16 EUR |
| SL3S1214FTB0/1X |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Description: IC RFID TRANSP 860-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Produkt ist nicht verfügbar
| SL3S1214FTB0/1X |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Description: IC RFID TRANSP 860-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Produkt ist nicht verfügbar
| NZH3V0B115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA NZH3V0B - ZENER DIO
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-123F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOD-123F
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q100
Description: NOW NEXPERIA NZH3V0B - ZENER DIO
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-123F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOD-123F
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 25950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11823+ | 0.05 EUR |
| MPC8377VRANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
| S912ZVC19AVKHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
Produkt ist nicht verfügbar
| S912ZVC19AVKH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 28
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 28
Produkt ist nicht verfügbar
| STMP3780XXBBEA5N |
Produkt ist nicht verfügbar
| PH5830DLX |
auf Bestellung 152950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1268+ | 0.39 EUR |
| PH5830DL,115 |
auf Bestellung 106500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1268+ | 0.39 EUR |
| ASL2416SHNY |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Produkt ist nicht verfügbar
| ASL2416SHNY |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Produkt ist nicht verfügbar
| ASL2416SHN/L1Y |
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive, Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): No
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Produkt ist nicht verfügbar
| S912ZVCA96F0MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVCA96F0MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MIMXRT1042XFP5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Connectivity: CANbus, Ethernet, I2C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
DigiKey Programmable: Not Verified
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 23.16 EUR |
| 10+ | 18.52 EUR |
| 80+ | 15.64 EUR |
| MIMXRT1041DFP6B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 90°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Connectivity: CANbus, Ethernet, I²C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I²S, LCD, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 90°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Connectivity: CANbus, Ethernet, I²C, MMC/SD, SAI, SPI, UART/USART, USB
Peripherals: DMA, I²S, LCD, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar