Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35281) > Seite 529 nach 589
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TLVH431ACDBZR,215 | NXP USA Inc. |
 Description: IC VREF SHUNT ADJ 1% TO236ABPackaging: Bulk Tolerance: ±1% Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 1.24V Current - Cathode: 80 µA Current - Output: 70 mA Voltage - Output (Max): 18 V |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| NX3DV42GU33Z | NXP USA Inc. |
Description: NX3DV42GU33 Packaging: Tape & Reel (TR) Features: Break-Before-Make, USB 2.0 Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: USB On-State Resistance (Max): 6.5Ohm -3db Bandwidth: 950MHz Supplier Device Package: 10-XQFN (1.4x1.8) Voltage - Supply, Single (V+): 3V ~ 4.3V Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 1 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MIMXRT1015CAF4BR | NXP USA Inc. |
Description: IC MCU 32BIT 96KB ROM 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 400MHz Program Memory Size: 96KB (96K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 |
Produkt ist nicht verfügbar |
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| MIMXRT1015CAF4AR | NXP USA Inc. |
Description: IC MCU 32BIT 96KB ROM 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 400MHz Program Memory Size: 96KB (96K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 |
Produkt ist nicht verfügbar |
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MIMXRT1015DAF5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 500MHz RAM Size: 128K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 9x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1015CAF4B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 400MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 9x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPF5024AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU610F,115 | NXP USA Inc. |
Description: RF TRANS NPN 5.5V 15GHZ 4DFP Packaging: Tape & Reel (TR) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.5dB ~ 23.5dB Power - Max: 136mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 5.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V Frequency - Transition: 15GHz Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz Supplier Device Package: 4-DFP |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU610F,115 | NXP USA Inc. |
Description: RF TRANS NPN 5.5V 15GHZ 4DFP Packaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.5dB ~ 23.5dB Power - Max: 136mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 5.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V Frequency - Transition: 15GHz Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz Supplier Device Package: 4-DFP |
auf Bestellung 5793 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF54454CVP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF2DL1001DUD/02V | NXP USA Inc. |
Description: MIFARE DESFIRE LIGHT CONTACTLESS Packaging: Tray Package / Case: Die Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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| MF3D2201DUD/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 MULTI APP Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D2201DUF/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 MULTI APP Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D2200DA6/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D2200DA4/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH2201DUD/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH2201DUF/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH2200DA6/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH2200DA4/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D4201DUD/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D4201DUF/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D4200DA6/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D4200DA4/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH4201DUD/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH4201DUF/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH4200DA6/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH4200DA4/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D8201DUD/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D8201DUF/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D8200DA6/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3D8200DA4/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH8201DUD/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH8201DUF/01V | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 FFC Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH8200DA6/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MF3DH8200DA4/01J | NXP USA Inc. |
Description: IC MIFARE DESFIRE EV2 PLMCC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVC2G00GF115 | NXP USA Inc. |
Description: IC GATE NAND 2CH 2-INP 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: 8-XSON (1.35x1) Input Logic Level - High: 1.07V ~ 3.85V Input Logic Level - Low: 0.58V ~ 1.65V Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 4 µA |
auf Bestellung 570000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC2G00GD,125 | NXP USA Inc. |
Description: IC GATE NAND 2CH 2-INP 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 8-XSON (2x3) Input Logic Level - High: 1.5V ~ 3.85V Input Logic Level - Low: 0.5V ~ 1.65V Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 10 µA |
auf Bestellung 128658 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G06GF,132 | NXP USA Inc. |
Description: IC INVERTER 2CH 2-INP 6XSON Packaging: Bulk Features: Open Drain Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: -, 32mA Number of Inputs: 2 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 2.9ns @ 5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 4 µA |
auf Bestellung 74292 Stücke: Lieferzeit 10-14 Tag (e) |
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NTB0101AGWH | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 6-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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NTB0101AGWH | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 6-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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MRF8S9102NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 920MHz Power - Output: 28W Gain: 23.1dB Technology: LDMOS Supplier Device Package: OM-780-2 Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 750 mA |
Produkt ist nicht verfügbar |
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TYN16-600RT127 | NXP USA Inc. |
Description: SILICON CONTROLLED RECTIFIER - T Packaging: Bulk |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8343VRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
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MC56F8002VWL | NXP USA Inc. |
Description: IC MCU 16BIT 12KB FLASH 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 12KB (6K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 15x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8002VWLR | NXP USA Inc. |
Description: IC MCU 16BIT 12KB FLASH 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 12KB (6K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 15x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| TDA8547TSN1/02,118 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 1.2W 20SSOP Packaging: Tape & Reel (TR) Features: Mute, Short-Circuit and Thermal Protection, Standby Package / Case: 20-LSSOP (0.173", 4.40mm Width) Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.2V ~ 18V Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
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| LFK73KINTPT3A | NXP USA Inc. |
Description: QORIVVA PS32R274K ON A 257 PIN 0 Packaging: Bulk For Use With/Related Products: PS32R274K Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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MC908AP64CFAE | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 3714 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908AP64CFAER | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AP64CFAE | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 32 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC908AP64ACFAE | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AP64ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 44QFP Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 44-QFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BUK9510-100B,127 | NXP USA Inc. |
Description: MOSFET N-CH 100V 75A TO220AB Packaging: Tube |
auf Bestellung 10087 Stücke: Lieferzeit 10-14 Tag (e) |
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| MF3ICD8101DUD/05,0 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die |
Produkt ist nicht verfügbar |
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74HC367DB,112 | NXP USA Inc. |
Description: IC BUFF DVR TRI-ST HEX 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 16-SSOP |
auf Bestellung 2496 Stücke: Lieferzeit 10-14 Tag (e) |
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| BRKTSTBAPA7250S | NXP USA Inc. |
Description: PRESSURE EVAL BREAKOUT BOARD Packaging: Box Interface: I2C, Serial, SPI Sensor Type: Pressure Utilized IC / Part: FXPS7250X Supplied Contents: Board(s) Embedded: No |
Produkt ist nicht verfügbar |
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S912XDG256F1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 14K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12DG25F0VPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12DG25F0CPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12DG25F0MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| TLVH431ACDBZR,215 |
|
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Bulk
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Bulk
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3000+ | 0.18 EUR |
| NX3DV42GU33Z |
|
Hersteller: NXP USA Inc.
Description: NX3DV42GU33
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
Description: NX3DV42GU33
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MIMXRT1015CAF4BR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
| MIMXRT1015CAF4AR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Produkt ist nicht verfügbar
| MIMXRT1015DAF5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.67 EUR |
| 10+ | 8.54 EUR |
| 25+ | 7.81 EUR |
| 80+ | 6.98 EUR |
| MIMXRT1015CAF4B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MPF5024AMMA0ES |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.12 EUR |
| 10+ | 10.04 EUR |
| 25+ | 9.58 EUR |
| 80+ | 8.31 EUR |
| 230+ | 7.94 EUR |
| BFU610F,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3000+ | 0.35 EUR |
| BFU610F,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
auf Bestellung 5793 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 18+ | 1.02 EUR |
| 20+ | 0.89 EUR |
| 100+ | 0.62 EUR |
| 500+ | 0.48 EUR |
| 1000+ | 0.39 EUR |
| MCF54454CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF2DL1001DUD/02V |
|
Hersteller: NXP USA Inc.
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
| MF3D2201DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D2201DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D2200DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D2200DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH2201DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH2201DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH2200DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH2200DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D4201DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D4201DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D4200DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D4200DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH4201DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH4201DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH4200DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH4200DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D8201DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D8201DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D8200DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3D8200DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH8201DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH8201DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH8200DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MF3DH8200DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVC2G00GF115 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 570000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1612+ | 0.31 EUR |
| 74AHC2G00GD,125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA
auf Bestellung 128658 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.24 EUR |
| 74LVC2G06GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 2CH 2-INP 6XSON
Packaging: Bulk
Features: Open Drain
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.9ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
Description: IC INVERTER 2CH 2-INP 6XSON
Packaging: Bulk
Features: Open Drain
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.9ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 74292 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1880+ | 0.26 EUR |
| NTB0101AGWH |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
| NTB0101AGWH |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
| MRF8S9102NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 28W
Gain: 23.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 750 mA
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 28W
Gain: 23.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
| TYN16-600RT127 |
|
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 888+ | 0.57 EUR |
| MPC8343VRAGDB |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
| MC56F8002VWL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC56F8002VWLR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 12KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 12KB (6K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TDA8547TSN1/02,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Packaging: Tape & Reel (TR)
Features: Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Packaging: Tape & Reel (TR)
Features: Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
| LFK73KINTPT3A |
Hersteller: NXP USA Inc.
Description: QORIVVA PS32R274K ON A 257 PIN 0
Packaging: Bulk
For Use With/Related Products: PS32R274K
Module/Board Type: Socket Adapter
Description: QORIVVA PS32R274K ON A 257 PIN 0
Packaging: Bulk
For Use With/Related Products: PS32R274K
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
| MC908AP64CFAE |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 3714 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 20.54 EUR |
| MC908AP64CFAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908AP64CFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC908AP64ACFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908AP64ACFBE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BUK9510-100B,127 |
|
auf Bestellung 10087 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 392+ | 1.27 EUR |
| MF3ICD8101DUD/05,0 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
| 74HC367DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST HEX 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SSOP
Description: IC BUFF DVR TRI-ST HEX 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SSOP
auf Bestellung 2496 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 833+ | 0.58 EUR |
| BRKTSTBAPA7250S |
|
Hersteller: NXP USA Inc.
Description: PRESSURE EVAL BREAKOUT BOARD
Packaging: Box
Interface: I2C, Serial, SPI
Sensor Type: Pressure
Utilized IC / Part: FXPS7250X
Supplied Contents: Board(s)
Embedded: No
Description: PRESSURE EVAL BREAKOUT BOARD
Packaging: Box
Interface: I2C, Serial, SPI
Sensor Type: Pressure
Utilized IC / Part: FXPS7250X
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
| S912XDG256F1MAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12DG25F0VPVE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12DG25F0CPVE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12DG25F0MPVE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar