![MPC860SRVR50D4-NXP MPC860SRVR50D4-NXP](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/4280/MFG_MPC860ENCZQ66D4.jpg)
MPC860SRVR50D4-NXP NXP USA Inc.
![FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw](/images/adobe-acrobat.png)
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 1049 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 257.22 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details MPC860SRVR50D4-NXP NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC, Packaging: Bulk, Package / Case: 357-BBGA, Mounting Type: Surface Mount, Speed: 50MHz, Operating Temperature: 0°C ~ 95°C (TJ), Core Processor: MPC8xx, Voltage - I/O: 3.3V, Supplier Device Package: 357-PBGA (25x25), Ethernet: 10Mbps (4), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Communications; CPM, RAM Controllers: DRAM, Graphics Acceleration: No, Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART.