Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35047) > Seite 378 nach 585
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| TJA1042T118 | NXP USA Inc. |
 Description: TJA1042T - HIGH-SPEED CAN TRANSCPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BZX84-C5V1/DG/B4215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-C5V1 - ZENER Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1145ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 14HVSON Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 800 mV Duplex: Full Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJA1145ATK/FD/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 14HVSON Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 800 mV Duplex: Full Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF3600EL/V1042D557 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESS Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PMV40UN2,215 | NXP USA Inc. |
Description: NEXPERIA, PMV40UN2 - 30V, N-CHAN Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PMV40UN2215 | NXP USA Inc. |
Description: NOW NEXPERIA PMV40UN2 - SMALL SI Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74HC21DB,112-NXP | NXP USA Inc. |
Description: IC GATE AND 2CH 4-INP 14SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.2V ~ 3.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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TFA9891UK/N1/S1Z | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.6W 49WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Package / Case: 49-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm Supplier Device Package: 49-WLCSP (3.43x2.98) Part Status: Obsolete |
auf Bestellung 1970 Stücke: Lieferzeit 10-14 Tag (e) |
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TFA9895UK/N2062 | NXP USA Inc. |
Description: BOOSTED CLASS-D AUDIO AMPLIFIER Packaging: Bulk Part Status: Active |
auf Bestellung 1592000 Stücke: Lieferzeit 10-14 Tag (e) |
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TFA9890AUK/N1 | NXP USA Inc. |
Description: 9.5V BOOSTED AUDIO SYSTEM Packaging: Bulk Part Status: Active |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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TFA9890AUK/N1062 | NXP USA Inc. |
Description: 9.5V BOOSTED AUDIO SYSTEM Packaging: Bulk Part Status: Active |
auf Bestellung 1080000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TFA9891UK/N1062 | NXP USA Inc. |
Description: TFA9891 - 9.5V BOOSTED AUDIO SYS Packaging: Bulk Part Status: Active |
auf Bestellung 22000 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE02Z16VLC2R | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL27Z64VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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MWCT1001AVLHR | NXP USA Inc. |
Description: 5W MULTI-COIL AUTO 5V STANDAR Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.7V ~ 3.6V Applications: Wireless Power Transmitter Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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MCIMX6X3EVK10ABR | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Part Status: Active Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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SPC5777CRK3MME3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA Packaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1021ASN7MQB | NXP USA Inc. |
Description: LS1 32BIT ARM SOC 1.2GHZ DDR3/ |
Produkt ist nicht verfügbar |
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LS1021ASE7MQB | NXP USA Inc. |
Description: LS1 32BIT ARM SOC 1.2GHZ DDR3/ |
Produkt ist nicht verfügbar |
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BC859CW135 | NXP USA Inc. |
Description: NOW NEXPERIA BC859CW - SMALL SIG Packaging: Bulk Part Status: Active |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTC124EMB | NXP USA Inc. |
Description: NOW NEXPERIA PDTC124EMB - SMALL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MC9S08GW64CLKR | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 80LQFP Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x16b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08GW64CLKR | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 80LQFP Packaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x16b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BAT18235 | NXP USA Inc. |
Description: BAT18 - PIN DIODE, 35V, TO-236AB Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| JN5169XK020 | NXP USA Inc. | Description: ZIGBEE LIGHTING/SENSOR NODE EXPA |
Produkt ist nicht verfügbar |
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PMSS3904135 | NXP USA Inc. |
Description: NOW NEXPERIA PMSS3904 - SMALL SI Packaging: Bulk Part Status: Active Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Frequency - Transition: 180MHz Supplier Device Package: SOT-323 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 200 mW |
auf Bestellung 300000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF574XR112 | NXP USA Inc. |
Description: POWER LDMOS TRANSISTOR, SOT1214 Packaging: Bulk Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF574XRS112 | NXP USA Inc. |
Description: POWER LDMOS TRANSISTOR, SOT1214 Packaging: Bulk Part Status: Active |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF574112 | NXP USA Inc. |
Description: HF / VHF POWER LDMOS TRANSISTOR, Packaging: Bulk |
Produkt ist nicht verfügbar |
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| TDA18221HN/C1E | NXP USA Inc. | Description: IC TUNER DGTL CBL MODEM 32HVQFN |
Produkt ist nicht verfügbar |
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| TDA18221HN/C1K | NXP USA Inc. | Description: IC TUNER DGTL CBL MODEM 32HVQFN |
Produkt ist nicht verfügbar |
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MC9S08LL16CGTR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08LL16CLHR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVHL32F1CLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 4x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 73 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVHL64F1CLL | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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S912XHZ256F1VAGR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 117 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MMG3005NT1 | NXP USA Inc. |
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN Packaging: Cut Tape (CT) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount Frequency: 800MHz ~ 2.2GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Gain: 15dB Current - Supply: 480mA Noise Figure: 5dB P1dB: 30dBm Test Frequency: 2.14GHz Supplier Device Package: 16-PQFN (5x5) |
Produkt ist nicht verfügbar |
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PCA9617ADP/S911118 | NXP USA Inc. |
Description: LEVEL TRANSLATING FM+ I2C-BUS |
Produkt ist nicht verfügbar |
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74HCT4538DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT4538DB MONOSTA Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 35 ns Independent Circuits: 2 Current - Output High, Low: 4mA, 4mA Schmitt Trigger Input: No Supplier Device Package: 16-SSOP Part Status: Active Voltage - Supply: 4.5 V ~ 5.5 V |
auf Bestellung 1396 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT823D,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 9BIT 24SO Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 250 µA Current - Output High, Low: 32mA, 64mA Trigger Type: Positive Edge Clock Frequency: 200 MHz Input Capacitance: 4 pF Supplier Device Package: 24-SO Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 9 |
auf Bestellung 2400 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9412AUKZ | NXP USA Inc. |
Description: IC REG BOOST 5.4V 300MA 9WLCSP Packaging: Cut Tape (CT) Package / Case: 9-UFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Up Current - Output: 300mA Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 3MHz Voltage - Input (Max): 5.25V Topology: Boost Supplier Device Package: 9-WLCSP (1.24x1.24) Synchronous Rectifier: Yes Voltage - Output (Max): 5.56V Voltage - Input (Min): 2.5V Voltage - Output (Min/Fixed): 5.4V Part Status: Active |
auf Bestellung 2705 Stücke: Lieferzeit 10-14 Tag (e) |
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SL3S1204FTB0/1X | NXP USA Inc. |
Description: IC UCODE SMART 860-960MHZ XSON6 |
auf Bestellung 4180 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTU02043HEJ | NXP USA Inc. |
Description: IC DIFF SWITCH 2:1 HUQFN16 Packaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: USB -3db Bandwidth: 12GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
auf Bestellung 19695 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA82C250T/YM115 | NXP USA Inc. |
Description: IC CAN CNTRL INTERFACE 8-SO Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ASL2417SHNY | NXP USA Inc. |
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN |
Produkt ist nicht verfügbar |
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S9S08RNA16W2VTGR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVC64F0CLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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MCZ33903DD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SSOP-EP |
Produkt ist nicht verfügbar |
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NCF3320EHN/0Y | NXP USA Inc. |
Description: IC 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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SPC5744BK1CMH2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
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SPC5746CSK1MKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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SPC5743RK1MLQ5R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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| FRDM-17531AEJEVB | NXP USA Inc. |
Description: FRDM-17531AEJE Packaging: Bulk Function: Motor Controller/Driver, Stepper Type: Power Management Utilized IC / Part: MPC17531A Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| FRDM-34933EVB | NXP USA Inc. |
Description: FRDM-34933EVB Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC34933 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| HVP-KV58F | NXP USA Inc. | Description: KV5X EVAL BRD |
Produkt ist nicht verfügbar |
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IP4253CZ16-8,118 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/30PF SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 30pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 33dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 727050 Stücke: Lieferzeit 10-14 Tag (e) |
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SCS8AC128EBCFUER,528 | NXP USA Inc. |
Description: MCU 8-BIT S08 CISC 128KB FLASH 3 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| TDA8954J/N1112 | NXP USA Inc. |
Description: AUDIO POWER AMPLIFIER CLASS D 2 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BZV55-C4V3135 | NXP USA Inc. |
Description: NOW NEXPERIA BZV55-C4V3 - ZENER Packaging: Bulk Part Status: Active Tolerance: ±5% Package / Case: DO-213AC, MINI-MELF, SOD-80 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 4.3 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: LLDS; MiniMelf Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 1 V |
Produkt ist nicht verfügbar |
| TJA1042T118 |
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Hersteller: NXP USA Inc.
Description: TJA1042T - HIGH-SPEED CAN TRANSC
Packaging: Bulk
Part Status: Active
Description: TJA1042T - HIGH-SPEED CAN TRANSC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BZX84-C5V1/DG/B4215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZX84-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| TJA1145ATK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJA1145ATK/FD/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 2.56 EUR |
| SAF3600EL/V1042D557 |
|
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PMV40UN2,215 |
|
Hersteller: NXP USA Inc.
Description: NEXPERIA, PMV40UN2 - 30V, N-CHAN
Packaging: Bulk
Part Status: Active
Description: NEXPERIA, PMV40UN2 - 30V, N-CHAN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PMV40UN2215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMV40UN2 - SMALL SI
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PMV40UN2 - SMALL SI
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74HC21DB,112-NXP |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 4-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.2V ~ 3.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 2CH 4-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.2V ~ 3.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
| TFA9891UK/N1/S1Z |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
auf Bestellung 1970 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 365+ | 1.35 EUR |
| TFA9895UK/N2062 |
|
Hersteller: NXP USA Inc.
Description: BOOSTED CLASS-D AUDIO AMPLIFIER
Packaging: Bulk
Part Status: Active
Description: BOOSTED CLASS-D AUDIO AMPLIFIER
Packaging: Bulk
Part Status: Active
auf Bestellung 1592000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 244+ | 2.02 EUR |
| TFA9890AUK/N1 |
|
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 295+ | 1.68 EUR |
| TFA9890AUK/N1062 |
|
auf Bestellung 1080000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 247+ | 2.01 EUR |
| TFA9891UK/N1062 |
|
Hersteller: NXP USA Inc.
Description: TFA9891 - 9.5V BOOSTED AUDIO SYS
Packaging: Bulk
Part Status: Active
Description: TFA9891 - 9.5V BOOSTED AUDIO SYS
Packaging: Bulk
Part Status: Active
auf Bestellung 22000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 243+ | 2.04 EUR |
| MKE02Z16VLC2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL27Z64VLH4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
| MWCT1001AVLHR |
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V STANDAR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Description: 5W MULTI-COIL AUTO 5V STANDAR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
| MCIMX6X3EVK10ABR |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
| SPC5777CRK3MME3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LS1021ASN7MQB |
|
Hersteller: NXP USA Inc.
Description: LS1 32BIT ARM SOC 1.2GHZ DDR3/
Description: LS1 32BIT ARM SOC 1.2GHZ DDR3/
Produkt ist nicht verfügbar
| LS1021ASE7MQB |
|
Hersteller: NXP USA Inc.
Description: LS1 32BIT ARM SOC 1.2GHZ DDR3/
Description: LS1 32BIT ARM SOC 1.2GHZ DDR3/
Produkt ist nicht verfügbar
| BC859CW135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC859CW - SMALL SIG
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BC859CW - SMALL SIG
Packaging: Bulk
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.035 EUR |
| PDTC124EMB |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC124EMB - SMALL
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PDTC124EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MC9S08GW64CLKR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08GW64CLKR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BAT18235 |
|
Hersteller: NXP USA Inc.
Description: BAT18 - PIN DIODE, 35V, TO-236AB
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: BAT18 - PIN DIODE, 35V, TO-236AB
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| JN5169XK020 |
Hersteller: NXP USA Inc.
Description: ZIGBEE LIGHTING/SENSOR NODE EXPA
Description: ZIGBEE LIGHTING/SENSOR NODE EXPA
Produkt ist nicht verfügbar
| PMSS3904135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMSS3904 - SMALL SI
Packaging: Bulk
Part Status: Active
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 180MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 200 mW
Description: NOW NEXPERIA PMSS3904 - SMALL SI
Packaging: Bulk
Part Status: Active
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 180MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 200 mW
auf Bestellung 300000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.032 EUR |
| BLF574XR112 |
Hersteller: NXP USA Inc.
Description: POWER LDMOS TRANSISTOR, SOT1214
Packaging: Bulk
Part Status: Active
Description: POWER LDMOS TRANSISTOR, SOT1214
Packaging: Bulk
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 336.03 EUR |
| BLF574XRS112 |
Hersteller: NXP USA Inc.
Description: POWER LDMOS TRANSISTOR, SOT1214
Packaging: Bulk
Part Status: Active
Description: POWER LDMOS TRANSISTOR, SOT1214
Packaging: Bulk
Part Status: Active
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 336.03 EUR |
| BLF574112 |
Produkt ist nicht verfügbar
| TDA18221HN/C1E |
Hersteller: NXP USA Inc.
Description: IC TUNER DGTL CBL MODEM 32HVQFN
Description: IC TUNER DGTL CBL MODEM 32HVQFN
Produkt ist nicht verfügbar
| TDA18221HN/C1K |
Hersteller: NXP USA Inc.
Description: IC TUNER DGTL CBL MODEM 32HVQFN
Description: IC TUNER DGTL CBL MODEM 32HVQFN
Produkt ist nicht verfügbar
| MC9S08LL16CGTR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08LL16CLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVHL32F1CLL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVHL64F1CLL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Produkt ist nicht verfügbar
| S912XHZ256F1VAGR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 117
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MMG3005NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.2GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 15dB
Current - Supply: 480mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 16-PQFN (5x5)
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.2GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 15dB
Current - Supply: 480mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 16-PQFN (5x5)
Produkt ist nicht verfügbar
| PCA9617ADP/S911118 |
|
Hersteller: NXP USA Inc.
Description: LEVEL TRANSLATING FM+ I2C-BUS
Description: LEVEL TRANSLATING FM+ I2C-BUS
Produkt ist nicht verfügbar
| 74HCT4538DB118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4538DB MONOSTA
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 35 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Description: NOW NEXPERIA 74HCT4538DB MONOSTA
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 35 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
auf Bestellung 1396 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 761+ | 0.65 EUR |
| 74ABT823D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 9BIT 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 250 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 4 pF
Supplier Device Package: 24-SO
Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 9
Description: IC FF D-TYPE SNGL 9BIT 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 250 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 4 pF
Supplier Device Package: 24-SO
Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 9
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 417+ | 1.19 EUR |
| PCA9412AUKZ |
|
Hersteller: NXP USA Inc.
Description: IC REG BOOST 5.4V 300MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.56V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.4V
Part Status: Active
Description: IC REG BOOST 5.4V 300MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.56V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.4V
Part Status: Active
auf Bestellung 2705 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 2.2 EUR |
| 10+ | 1.97 EUR |
| 25+ | 1.87 EUR |
| 100+ | 1.54 EUR |
| 250+ | 1.44 EUR |
| 500+ | 1.27 EUR |
| 1000+ | 1 EUR |
| SL3S1204FTB0/1X |
|
Hersteller: NXP USA Inc.
Description: IC UCODE SMART 860-960MHZ XSON6
Description: IC UCODE SMART 860-960MHZ XSON6
auf Bestellung 4180 Stücke:
Lieferzeit 10-14 Tag (e)| CBTU02043HEJ |
|
Hersteller: NXP USA Inc.
Description: IC DIFF SWITCH 2:1 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
-3db Bandwidth: 12GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC DIFF SWITCH 2:1 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
-3db Bandwidth: 12GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
auf Bestellung 19695 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.82 EUR |
| 10+ | 2.54 EUR |
| 25+ | 2.39 EUR |
| 100+ | 2.04 EUR |
| 250+ | 1.91 EUR |
| 500+ | 1.68 EUR |
| 1000+ | 1.39 EUR |
| 2500+ | 1.29 EUR |
| 5000+ | 1.24 EUR |
| PCA82C250T/YM115 |
|
Hersteller: NXP USA Inc.
Description: IC CAN CNTRL INTERFACE 8-SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC CAN CNTRL INTERFACE 8-SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| ASL2417SHNY |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Produkt ist nicht verfügbar
| S9S08RNA16W2VTGR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVC64F0CLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
| MCZ33903DD5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Produkt ist nicht verfügbar
| NCF3320EHN/0Y |
|
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| SPC5744BK1CMH2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
| SPC5746CSK1MKU6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
| SPC5743RK1MLQ5R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Produkt ist nicht verfügbar
| FRDM-17531AEJEVB |
Hersteller: NXP USA Inc.
Description: FRDM-17531AEJE
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Description: FRDM-17531AEJE
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| FRDM-34933EVB |
Hersteller: NXP USA Inc.
Description: FRDM-34933EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Description: FRDM-34933EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| IP4253CZ16-8,118 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/30PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 33dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 200 OHM/30PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 33dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 727050 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2420+ | 0.19 EUR |
| SCS8AC128EBCFUER,528 |
Hersteller: NXP USA Inc.
Description: MCU 8-BIT S08 CISC 128KB FLASH 3
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MCU 8-BIT S08 CISC 128KB FLASH 3
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TDA8954J/N1112 |
|
Hersteller: NXP USA Inc.
Description: AUDIO POWER AMPLIFIER CLASS D 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: AUDIO POWER AMPLIFIER CLASS D 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BZV55-C4V3135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV55-C4V3 - ZENER
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Description: NOW NEXPERIA BZV55-C4V3 - ZENER
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Produkt ist nicht verfügbar