Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35047) > Seite 376 nach 585
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N74F04D,602 | NXP USA Inc. |
 Description: IC INVERTER 6CH 1-INP 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 6 |
auf Bestellung 51436 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT4556AUK012 | NXP USA Inc. |
Description: SIM CARD INTERFACE LEVEL TRANSLA Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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BCX56-16115 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA Packaging: Bulk Package / Case: TO-243AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V Frequency - Transition: 180MHz Supplier Device Package: SOT-89 Part Status: Active Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 500 mW |
Produkt ist nicht verfügbar |
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| BCX56-16147 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PBSS4041NZ115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4041NZ SMALL SI Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74ABT16245BDL,118 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 48SSOP Packaging: Bulk |
auf Bestellung 4900 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08AW16E5CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LV4066DB,118-NXP | NXP USA Inc. |
Description: IC SWITCH SPST-NOX4 35OHM 14SSOP Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 35Ohm -3db Bandwidth: 200MHz Supplier Device Package: 14-SSOP Voltage - Supply, Single (V+): 1V ~ 6V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 16ns, 28ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 2µA Part Status: Active Number of Circuits: 4 |
Produkt ist nicht verfügbar |
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MMBZ20VAL/DG/B2215 | NXP USA Inc. |
Description: TRANS VOLTAGE SUPPRESSOR DIODE |
Produkt ist nicht verfügbar |
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74AHC1G17GV125 | NXP USA Inc. |
Description: 74AHC1G17 BUFFER |
Produkt ist nicht verfügbar |
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| 74AHC1G17GW125 | NXP USA Inc. | Description: BUFFER, AHC/VHC/H/U/V SERIES |
Produkt ist nicht verfügbar |
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TEA1751AT/N1518 | NXP USA Inc. |
Description: GREENCHIP III PRIMARY CONTROLLER Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA1751AT/N1/S35518 | NXP USA Inc. |
Description: GREENCHIP III PRIMARY CONTROLLER Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA1753LT/N1518 | NXP USA Inc. |
Description: GREENCHIP III SMPS CONTROL IC Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Supplier Device Package: 16-SO Operating Temperature: -40°C ~ 150°C (TJ) Frequency - Switching: 250kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 15V ~ 38V Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 22 V Power (Watts): 250 W |
Produkt ist nicht verfügbar |
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PHE13003A126 | NXP USA Inc. |
Description: NOW WEEN - PHE13003A - POWER BIP Packaging: Bulk Part Status: Active |
auf Bestellung 104960 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC3G04DP-Q100125 | NXP USA Inc. |
Description: IC INVERTER 3CH 3-INP 8TSSOP |
auf Bestellung 8387 Stücke: Lieferzeit 10-14 Tag (e) |
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| PESD5V0X1BCSF315 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk |
auf Bestellung 1906000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4053BQ-Q100115 | NXP USA Inc. |
Description: DIFFERENTIAL MUX Packaging: Bulk |
Produkt ist nicht verfügbar |
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74HC11D | NXP USA Inc. |
Description: IC GATE AND 3CH 3-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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P89LPC933HDH518 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28TSSOP Packaging: Bulk Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x8b; D/A 1x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 28-TSSOP Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCF8593P112 | NXP USA Inc. |
Description: RTC VOLATILE 0 TIMER(S) |
Produkt ist nicht verfügbar |
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BC807-16/6215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V Frequency - Transition: 80MHz Supplier Device Package: TO-236AB Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 250 mW |
auf Bestellung 339000 Stücke: Lieferzeit 10-14 Tag (e) |
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NCX2200GMAZ | NXP USA Inc. |
Description: IC COMPAR 1 GEN PUR SLP0603P2X3F Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Output Type: Complementary, Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Propagation Delay (Max): 800ns (Typ) Current - Quiescent (Max): 6µA (Typ) Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V Current - Output (Typ): 68mA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Active |
auf Bestellung 145000 Stücke: Lieferzeit 10-14 Tag (e) |
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NCX2200GMBZ | NXP USA Inc. |
Description: IC COMPARATOR RRIO SINGLE 6-XSON |
Produkt ist nicht verfügbar |
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74HCT2G04GW-Q100125 | NXP USA Inc. |
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP |
Produkt ist nicht verfügbar |
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PBSS5350D125 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS5350D - SMALL S Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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SL3S1204FTB0/1X | NXP USA Inc. |
Description: IC UCODE SMART 860-960MHZ XSON6 |
Produkt ist nicht verfügbar |
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MC68HC705C8AFNE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC05 CPU Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5169-001-M03-2534 | NXP USA Inc. |
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8 Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 379 Stücke: Lieferzeit 10-14 Tag (e) |
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JN5169-001-M03-2 | NXP USA Inc. |
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8 Packaging: Bulk |
auf Bestellung 370 Stücke: Lieferzeit 10-14 Tag (e) |
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| JN5169-001-M00AZ | NXP USA Inc. | Description: RX TXRX MODULE SURFACE MOUNT |
Produkt ist nicht verfügbar |
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| JN5169/001515 | NXP USA Inc. |
Description: ZIGBEE AND IEEE802.15.4 WIRELESS |
Produkt ist nicht verfügbar |
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JN5169-001-M06-2534 | NXP USA Inc. |
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8 Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 386 Stücke: Lieferzeit 10-14 Tag (e) |
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BC846BW/ZL,135 | NXP USA Inc. |
Description: BC846 - 65V, 100MA NPN GENERAL-P Packaging: Bulk Part Status: Active Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 65 V Power - Max: 200 mW |
Produkt ist nicht verfügbar |
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| BC846BW/ZL135 | NXP USA Inc. |
Description: NOW NEXPERIA BC846BW - SMALL SIG Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PDTC143ET235 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC244PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk |
Produkt ist nicht verfügbar |
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74AHC244PW/C1118 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-TSSOP |
auf Bestellung 2647 Stücke: Lieferzeit 10-14 Tag (e) |
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BAV23C235 | NXP USA Inc. |
Description: NEXPERIA BAV23C - DUAL HIGH-VOL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 225mA (DC) Supplier Device Package: TO-236AB Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 200 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 200 V |
Produkt ist nicht verfügbar |
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74HC4514DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC4514DB - DECODE Packaging: Bulk Package / Case: 24-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 4:16 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 25-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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S9S08AW32E5VFGE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP |
Produkt ist nicht verfügbar |
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S9S08AW32E5CFDER | NXP USA Inc. | Description: IC MCU 8BIT 32KB FLASH 48QFN |
Produkt ist nicht verfügbar |
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S9S08AW32E7CFDER | NXP USA Inc. | Description: IC MCU 8BIT 32KB FLASH 48QFN |
Produkt ist nicht verfügbar |
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S9S08AW32E7VFGER | NXP USA Inc. | Description: IC MCU 8BIT 32KB FLASH 44LQFP |
Produkt ist nicht verfügbar |
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S9S08AW32E7CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08AW32E7VFGE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP |
Produkt ist nicht verfügbar |
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S9S08AW32E5MFUER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| S9S08AW32E5MFGE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
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S9S08AW32E5CPUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
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74LV174N,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 6BIT 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Non-Inverted Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5.5V Current - Quiescent (Iq): 160 µA Current - Output High, Low: 12mA, 12mA Trigger Type: Positive Edge Clock Frequency: 100 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 6 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BAW56W/DG/B2115 | NXP USA Inc. |
Description: DIODE ARRAY GP 90V 150MA SOT323 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Common Anode Current - Average Rectified (Io) (per Diode): 150mA (DC) Supplier Device Package: SOT-323 Operating Temperature - Junction: 150°C (Max) Grade: Automotive Voltage - DC Reverse (Vr) (Max): 90 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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| BAW56W/DG/B3115 | NXP USA Inc. |
Description: BAW56 - HIGH-SPEED SWITCHING DIO Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BUK7Y25-40B/C3115 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET |
auf Bestellung 10500 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU6005/N2115 | NXP USA Inc. |
Description: LOW NOISE AMPLIFIER MMIC |
Produkt ist nicht verfügbar |
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BGU6005115 | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 17dB ~ 17.5dB Current - Supply: 5.2mA Test Frequency: 1.559GHz ~ 1.61GHz Supplier Device Package: 6-XSON (1.45x1) Part Status: Active |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8L1115 | NXP USA Inc. |
Description: IC AMP LTE 728MHZ-960MHZ 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz RF Type: LTE, WiMax Voltage - Supply: 1.5V ~ 3.1V Gain: 14.5dB Current - Supply: 4.6mA Noise Figure: 0.7dB P1dB: -3dBm Test Frequency: 882MHz Supplier Device Package: 6-XSON (1.1x0.7) |
auf Bestellung 22500 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8M1UK019 | NXP USA Inc. |
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.2GHz RF Type: Cellular Voltage - Supply: 1.5V ~ 3.1V Gain: 17dB Current - Supply: 5mA Noise Figure: 0.7dB P1dB: -5dBm Test Frequency: 1.843GHz Supplier Device Package: 6-WLCSP (0.65x0.44) |
Produkt ist nicht verfügbar |
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BGS8L4UK019 | NXP USA Inc. |
Description: SIGE:C LOW NOISE AMPLIFIER MMIC Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MC56F8006VLC,557 | NXP USA Inc. |
Description: DIGITAL SIGNAL CONTROLLER Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8006MLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 18x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 27 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| N74F04D,602 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 6
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 6
auf Bestellung 51436 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2664+ | 0.18 EUR |
| NVT4556AUK012 |
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Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 396+ | 1.27 EUR |
| BCX56-16115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: SOT-89
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 500 mW
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: SOT-89
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
| BCX56-16147 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PBSS4041NZ115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS4041NZ SMALL SI
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PBSS4041NZ SMALL SI
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74ABT16245BDL,118 |
|
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 484+ | 1.02 EUR |
| S9S08AW16E5CFGER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LV4066DB,118-NXP |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NOX4 35OHM 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Part Status: Active
Number of Circuits: 4
Description: IC SWITCH SPST-NOX4 35OHM 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Part Status: Active
Number of Circuits: 4
Produkt ist nicht verfügbar
| MMBZ20VAL/DG/B2215 |
|
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Produkt ist nicht verfügbar
| 74AHC1G17GW125 |
Hersteller: NXP USA Inc.
Description: BUFFER, AHC/VHC/H/U/V SERIES
Description: BUFFER, AHC/VHC/H/U/V SERIES
Produkt ist nicht verfügbar
| TEA1751AT/N1518 |
Hersteller: NXP USA Inc.
Description: GREENCHIP III PRIMARY CONTROLLER
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: GREENCHIP III PRIMARY CONTROLLER
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TEA1751AT/N1/S35518 |
Hersteller: NXP USA Inc.
Description: GREENCHIP III PRIMARY CONTROLLER
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: GREENCHIP III PRIMARY CONTROLLER
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TEA1753LT/N1518 |
|
Hersteller: NXP USA Inc.
Description: GREENCHIP III SMPS CONTROL IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 16-SO
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
Description: GREENCHIP III SMPS CONTROL IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 16-SO
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
Produkt ist nicht verfügbar
| PHE13003A126 |
|
Hersteller: NXP USA Inc.
Description: NOW WEEN - PHE13003A - POWER BIP
Packaging: Bulk
Part Status: Active
Description: NOW WEEN - PHE13003A - POWER BIP
Packaging: Bulk
Part Status: Active
auf Bestellung 104960 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4609+ | 0.11 EUR |
| 74HC3G04DP-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8TSSOP
Description: IC INVERTER 3CH 3-INP 8TSSOP
auf Bestellung 8387 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1529+ | 0.35 EUR |
| PESD5V0X1BCSF315 |
|
auf Bestellung 1906000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5170+ | 0.11 EUR |
| 74HC11D |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
| P89LPC933HDH518 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCF8593P112 |
|
Hersteller: NXP USA Inc.
Description: RTC VOLATILE 0 TIMER(S)
Description: RTC VOLATILE 0 TIMER(S)
Produkt ist nicht verfügbar
| BC807-16/6215 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Frequency - Transition: 80MHz
Supplier Device Package: TO-236AB
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Frequency - Transition: 80MHz
Supplier Device Package: TO-236AB
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
auf Bestellung 339000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.032 EUR |
| NCX2200GMAZ |
|
Hersteller: NXP USA Inc.
Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
auf Bestellung 145000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5000+ | 0.22 EUR |
| 10000+ | 0.2 EUR |
| 25000+ | 0.19 EUR |
| NCX2200GMBZ |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR RRIO SINGLE 6-XSON
Description: IC COMPARATOR RRIO SINGLE 6-XSON
Produkt ist nicht verfügbar
| 74HCT2G04GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP
Produkt ist nicht verfügbar
| PBSS5350D125 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS5350D - SMALL S
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PBSS5350D - SMALL S
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| SL3S1204FTB0/1X |
|
Hersteller: NXP USA Inc.
Description: IC UCODE SMART 860-960MHZ XSON6
Description: IC UCODE SMART 860-960MHZ XSON6
Produkt ist nicht verfügbar
| MC68HC705C8AFNE-NXP |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC05 CPU
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC05 CPU
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| JN5169-001-M03-2534 |
|
Hersteller: NXP USA Inc.
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 379 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 21+ | 23.33 EUR |
| JN5169-001-M03-2 |
|
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 21+ | 23.33 EUR |
| JN5169-001-M00AZ |
Hersteller: NXP USA Inc.
Description: RX TXRX MODULE SURFACE MOUNT
Description: RX TXRX MODULE SURFACE MOUNT
Produkt ist nicht verfügbar
| JN5169/001515 |
|
Hersteller: NXP USA Inc.
Description: ZIGBEE AND IEEE802.15.4 WIRELESS
Description: ZIGBEE AND IEEE802.15.4 WIRELESS
Produkt ist nicht verfügbar
| JN5169-001-M06-2534 |
|
Hersteller: NXP USA Inc.
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: ZIGBEE 3.0, ZIGBEE PRO AND IEEE8
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 386 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 31.13 EUR |
| BC846BW/ZL,135 |
|
Hersteller: NXP USA Inc.
Description: BC846 - 65V, 100MA NPN GENERAL-P
Packaging: Bulk
Part Status: Active
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 200 mW
Description: BC846 - 65V, 100MA NPN GENERAL-P
Packaging: Bulk
Part Status: Active
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 200 mW
Produkt ist nicht verfügbar
| BC846BW/ZL135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC846BW - SMALL SIG
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BC846BW - SMALL SIG
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PDTC143ET235 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74AHC244PW/C1118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
auf Bestellung 2647 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2647+ | 0.19 EUR |
| BAV23C235 |
|
Hersteller: NXP USA Inc.
Description: NEXPERIA BAV23C - DUAL HIGH-VOL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 225mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Description: NEXPERIA BAV23C - DUAL HIGH-VOL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 225mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Produkt ist nicht verfügbar
| 74HC4514DB118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC4514DB - DECODE
Packaging: Bulk
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 25-SSOP
Part Status: Active
Description: NOW NEXPERIA 74HC4514DB - DECODE
Packaging: Bulk
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 25-SSOP
Part Status: Active
Produkt ist nicht verfügbar
| S9S08AW32E5VFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Produkt ist nicht verfügbar
| S9S08AW32E5CFDER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Description: IC MCU 8BIT 32KB FLASH 48QFN
Produkt ist nicht verfügbar
| S9S08AW32E7CFDER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Description: IC MCU 8BIT 32KB FLASH 48QFN
Produkt ist nicht verfügbar
| S9S08AW32E7VFGER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Produkt ist nicht verfügbar
| S9S08AW32E7CFGE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08AW32E7VFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Produkt ist nicht verfügbar
| S9S08AW32E5MFUER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08AW32E5MFGE557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
| S9S08AW32E5CPUE557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
| 74LV174N,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 6BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 160 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 100 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 6
Description: IC FF D-TYPE SNGL 6BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 160 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 100 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 6
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 437+ | 1.12 EUR |
| BAW56W/DG/B2115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 90V 150MA SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Qualification: AEC-Q101
Description: DIODE ARRAY GP 90V 150MA SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| BAW56W/DG/B3115 |
|
Hersteller: NXP USA Inc.
Description: BAW56 - HIGH-SPEED SWITCHING DIO
Packaging: Bulk
Part Status: Active
Description: BAW56 - HIGH-SPEED SWITCHING DIO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BUK7Y25-40B/C3115 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Description: N-CHANNEL POWER MOSFET
auf Bestellung 10500 Stücke:
Lieferzeit 10-14 Tag (e)| BGU6005/N2115 |
|
Hersteller: NXP USA Inc.
Description: LOW NOISE AMPLIFIER MMIC
Description: LOW NOISE AMPLIFIER MMIC
Produkt ist nicht verfügbar
| BGU6005115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.18 EUR |
| BGU8L1115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP LTE 728MHZ-960MHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Description: IC AMP LTE 728MHZ-960MHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1355+ | 0.37 EUR |
| BGU8M1UK019 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Produkt ist nicht verfügbar
| BGS8L4UK019 |
|
Hersteller: NXP USA Inc.
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Packaging: Bulk
Part Status: Active
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MC56F8006VLC,557 |
|
Hersteller: NXP USA Inc.
Description: DIGITAL SIGNAL CONTROLLER
Packaging: Tray
DigiKey Programmable: Not Verified
Description: DIGITAL SIGNAL CONTROLLER
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC56F8006MLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 18x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 18x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar