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BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
BB156,115 BB156,115 NXP USA Inc. BB156.pdf Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
SL3S1203FTB0,115 SL3S1203FTB0,115 NXP USA Inc. SL3S1203_1213.pdf Description: IC RFID TRANSP 840-960MHZ XSON6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Standards: ISO 18000-6, EPC
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1731LTS/1,115 TEA1731LTS/1,115 NXP USA Inc. TEA1731LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7725 Stücke:
Lieferzeit 10-14 Tag (e)
29+0.62 EUR
38+ 0.47 EUR
44+ 0.41 EUR
100+ 0.26 EUR
250+ 0.22 EUR
500+ 0.18 EUR
1000+ 0.13 EUR
2500+ 0.12 EUR
5000+ 0.11 EUR
Mindestbestellmenge: 29
HTMS8001FTK/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
PMBFJ308,215 PMBFJ308,215 NXP USA Inc. PMBFJ308_309_310.pdf Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
Produkt ist nicht verfügbar
BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
MC9S08PL4CTG MC9S08PL4CTG NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 2988 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.39 EUR
10+ 1.86 EUR
96+ 1.45 EUR
576+ 1.38 EUR
1056+ 1.09 EUR
2592+ 1.01 EUR
Mindestbestellmenge: 8
MC9S08PL60CQH MC9S08PL60CQH NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PL8CTG MC9S08PL8CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PL16CTG MC9S08PL16CTG NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PL16CTJ MC9S08PL16CTJ NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 973 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.33 EUR
10+ 3.39 EUR
150+ 2.72 EUR
525+ 2.57 EUR
Mindestbestellmenge: 5
SPC5775BDK3MME2 SPC5775BDK3MME2 NXP USA Inc. MPC5775BEFS.pdf Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
auf Bestellung 170 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.25 EUR
10+ 64.29 EUR
MPC5775BE-416DS MPC5775BE-416DS NXP USA Inc. MPC5777CEVBUG.pdf Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+1045.84 EUR
TEA19051BABTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA19051BACTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA19051BAFTK/1J NXP USA Inc. TEA19051BTK.pdf Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FRDM33771BSPIEVB FRDM33771BSPIEVB NXP USA Inc. MC33771B_SDS.pdf Description: EVAL BOARD MC33771 14-CH SPI
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+336.65 EUR
K32W032S1M2CAVAR NXP USA Inc. K32W0XFS.pdf Description: MCU KINETIS BT5/FSK WLCSP
Produkt ist nicht verfügbar
SAF7730HV/N231D,51 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF7730HV/N231D,55 NXP USA Inc. Nexperia-based_Auto_Audio&VideoSolutions.pdf Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
SPC5744PK1MLQ5 SPC5744PK1MLQ5 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
SPC5744PK1MLQ5R SPC5744PK1MLQ5R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
MC34PF1550A7EP MC34PF1550A7EP NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A7EPR2 MC34PF1550A7EPR2 NXP USA Inc. PF1550.pdf Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-PF1550EVM FRDM-PF1550EVM NXP USA Inc. PF1550.pdf Description: FREEDOM EXPANSION BOARD -PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+457.92 EUR
MC32PF1510A1EPR2 MC32PF1510A1EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4965 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.41 EUR
10+ 6.65 EUR
25+ 6.29 EUR
100+ 5.45 EUR
250+ 5.17 EUR
500+ 4.64 EUR
1000+ 3.91 EUR
2500+ 3.72 EUR
Mindestbestellmenge: 3
MC32PF1510A3EPR2 MC32PF1510A3EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3328 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.59 EUR
10+ 6.81 EUR
25+ 6.43 EUR
100+ 5.58 EUR
250+ 5.29 EUR
500+ 4.75 EUR
1000+ 4 EUR
2500+ 3.8 EUR
Mindestbestellmenge: 3
MC34PF1510A4EPR2 MC34PF1510A4EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF1510A6EPR2 MC34PF1510A6EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC32PF1550A1EPR2 MC32PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.01 EUR
10+ 8.09 EUR
25+ 7.65 EUR
100+ 6.63 EUR
250+ 6.29 EUR
500+ 5.65 EUR
1000+ 4.76 EUR
2500+ 4.52 EUR
Mindestbestellmenge: 2
MC32PF1550A3EPR2 MC32PF1550A3EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A1EPR2 MC34PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A4EPR2 MC34PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MWCT1003AVLHR MWCT1003AVLHR NXP USA Inc. MWCT1001A3AFS.pdf Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
MKW41Z512VHT4R MKW41Z512VHT4R NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.14 EUR
10+ 13.47 EUR
100+ 11.15 EUR
1000+ 9.72 EUR
Mindestbestellmenge: 2
PCT2075GV/N005X PCT2075GV/N005X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+0.61 EUR
Mindestbestellmenge: 3000
PCT2075GV/P110X PCT2075GV/P110X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
PCT2075GV/N005X PCT2075GV/N005X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 4520 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.55 EUR
15+ 1.18 EUR
25+ 1.02 EUR
50+ 0.98 EUR
100+ 0.84 EUR
500+ 0.73 EUR
1000+ 0.64 EUR
Mindestbestellmenge: 12
PCT2075GV/P110X PCT2075GV/P110X NXP USA Inc. PCT2075.pdf Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 2328 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.53 EUR
15+ 1.17 EUR
25+ 1.01 EUR
50+ 0.98 EUR
100+ 0.83 EUR
500+ 0.72 EUR
1000+ 0.63 EUR
Mindestbestellmenge: 12
MIMXRT1060-EVK MIMXRT1060-EVK NXP USA Inc. IMXRT1060IEC.pdf Description: I.MX RT1060 EVAL BRD
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
1+215.95 EUR
MIMXRT1062DVL6A MIMXRT1062DVL6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMXRT1062CVL5A MIMXRT1062CVL5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMXRT1051DVJ6B MIMXRT1051DVJ6B NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.49 EUR
10+ 12.38 EUR
189+ 11.29 EUR
Mindestbestellmenge: 2
MIMXRT1052CVJ5B MIMXRT1052CVJ5B NXP USA Inc. IMXRT1050IEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
MIMXRT1052DVJ6B MIMXRT1052DVJ6B NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1369 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.44 EUR
10+ 18.74 EUR
189+ 15.82 EUR
567+ 15.73 EUR
945+ 14.85 EUR
MIMXRT1061DVL6A MIMXRT1061DVL6A NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
MIMXRT1061CVL5A MIMXRT1061CVL5A NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
FS32R372SDK0MMMT FS32R372SDK0MMMT NXP USA Inc. S32R372.pdf Description: IC MCU RADAR S32R LFBGA257
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 753 Stücke:
Lieferzeit 10-14 Tag (e)
1+90.52 EUR
10+ 73.43 EUR
80+ 63.76 EUR
FS32R372SEK0MMMT FS32R372SEK0MMMT NXP USA Inc. Description: S32R RADAR MICROCONTROLLER - S32
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S32R372141EVB NXP USA Inc. S32R372DS.pdf Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+741.56 EUR
S32R372RRSEVB S32R372RRSEVB NXP USA Inc. S32R372DS.pdf Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+649.92 EUR
PN7360AUEV/C300E PN7360AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.44 EUR
10+ 15.78 EUR
25+ 14.53 EUR
80+ 13.29 EUR
230+ 12.46 EUR
490+ 11.63 EUR
980+ 11.05 EUR
Mindestbestellmenge: 2
PN7362AUEV/C300E PN7362AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 581 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.08 EUR
10+ 11.84 EUR
25+ 10.97 EUR
Mindestbestellmenge: 2
PN7462AUEV/C300E PN7462AUEV/C300E NXP USA Inc. PN7462.pdf Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 4283 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.15 EUR
10+ 12.8 EUR
25+ 11.86 EUR
Mindestbestellmenge: 2
BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
BB156,115 BB156.pdf
BB156,115
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
SL3S1203FTB0,115 SL3S1203_1213.pdf
SL3S1203FTB0,115
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ XSON6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Standards: ISO 18000-6, EPC
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1731LTS/1,115 TEA1731LTS.pdf
TEA1731LTS/1,115
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7725 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
29+0.62 EUR
38+ 0.47 EUR
44+ 0.41 EUR
100+ 0.26 EUR
250+ 0.22 EUR
500+ 0.18 EUR
1000+ 0.13 EUR
2500+ 0.12 EUR
5000+ 0.11 EUR
Mindestbestellmenge: 29
HTMS8001FTK/AF,115 HTMS1X01_8X01.pdf
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
PMBFJ308,215 PMBFJ308_309_310.pdf
PMBFJ308,215
Hersteller: NXP USA Inc.
Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
Produkt ist nicht verfügbar
BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
MC9S08PL4CTG MC9S08PL4.pdf
MC9S08PL4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 2988 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.39 EUR
10+ 1.86 EUR
96+ 1.45 EUR
576+ 1.38 EUR
1056+ 1.09 EUR
2592+ 1.01 EUR
Mindestbestellmenge: 8
MC9S08PL60CQH MC9S08PL60.pdf
MC9S08PL60CQH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PL8CTG MC9S08PL16.pdf
MC9S08PL8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PL16CTG MC9S08PL16.pdf
MC9S08PL16CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PL16CTJ MC9S08PL16.pdf
MC9S08PL16CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 973 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.33 EUR
10+ 3.39 EUR
150+ 2.72 EUR
525+ 2.57 EUR
Mindestbestellmenge: 5
SPC5775BDK3MME2 MPC5775BEFS.pdf
SPC5775BDK3MME2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
auf Bestellung 170 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+79.25 EUR
10+ 64.29 EUR
MPC5775BE-416DS MPC5777CEVBUG.pdf
MPC5775BE-416DS
Hersteller: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1045.84 EUR
TEA19051BABTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA19051BACTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA19051BAFTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FRDM33771BSPIEVB MC33771B_SDS.pdf
FRDM33771BSPIEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD MC33771 14-CH SPI
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+336.65 EUR
K32W032S1M2CAVAR K32W0XFS.pdf
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Produkt ist nicht verfügbar
SAF7730HV/N231D,51 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF7730HV/N231D,55 Nexperia-based_Auto_Audio&VideoSolutions.pdf
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
SPC5744PK1MLQ5
SPC5744PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
SPC5744PK1MLQ5R
SPC5744PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
MC34PF1550A7EP PF1550.pdf
MC34PF1550A7EP
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A7EPR2 PF1550.pdf
MC34PF1550A7EPR2
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-PF1550EVM PF1550.pdf
FRDM-PF1550EVM
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD -PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+457.92 EUR
MC32PF1510A1EPR2 PF1510.pdf
MC32PF1510A1EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 4965 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.41 EUR
10+ 6.65 EUR
25+ 6.29 EUR
100+ 5.45 EUR
250+ 5.17 EUR
500+ 4.64 EUR
1000+ 3.91 EUR
2500+ 3.72 EUR
Mindestbestellmenge: 3
MC32PF1510A3EPR2 PF1510.pdf
MC32PF1510A3EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
auf Bestellung 3328 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.59 EUR
10+ 6.81 EUR
25+ 6.43 EUR
100+ 5.58 EUR
250+ 5.29 EUR
500+ 4.75 EUR
1000+ 4 EUR
2500+ 3.8 EUR
Mindestbestellmenge: 3
MC34PF1510A4EPR2 PF1510.pdf
MC34PF1510A4EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF1510A6EPR2 PF1510.pdf
MC34PF1510A6EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC32PF1550A1EPR2 PF1550.pdf
MC32PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.01 EUR
10+ 8.09 EUR
25+ 7.65 EUR
100+ 6.63 EUR
250+ 6.29 EUR
500+ 5.65 EUR
1000+ 4.76 EUR
2500+ 4.52 EUR
Mindestbestellmenge: 2
MC32PF1550A3EPR2 PF1550.pdf
MC32PF1550A3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A1EPR2 PF1550.pdf
MC34PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A4EPR2 PF1550.pdf
MC34PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MWCT1003AVLHR MWCT1001A3AFS.pdf
MWCT1003AVLHR
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
MKW41Z512VHT4R MKW41Z512.pdf
MKW41Z512VHT4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.14 EUR
10+ 13.47 EUR
100+ 11.15 EUR
1000+ 9.72 EUR
Mindestbestellmenge: 2
PCT2075GV/N005X PCT2075.pdf
PCT2075GV/N005X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3000+0.61 EUR
Mindestbestellmenge: 3000
PCT2075GV/P110X PCT2075.pdf
PCT2075GV/P110X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Produkt ist nicht verfügbar
PCT2075GV/N005X PCT2075.pdf
PCT2075GV/N005X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 4520 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.55 EUR
15+ 1.18 EUR
25+ 1.02 EUR
50+ 0.98 EUR
100+ 0.84 EUR
500+ 0.73 EUR
1000+ 0.64 EUR
Mindestbestellmenge: 12
PCT2075GV/P110X PCT2075.pdf
PCT2075GV/P110X
Hersteller: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit, Shutdown Mode
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
auf Bestellung 2328 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.53 EUR
15+ 1.17 EUR
25+ 1.01 EUR
50+ 0.98 EUR
100+ 0.83 EUR
500+ 0.72 EUR
1000+ 0.63 EUR
Mindestbestellmenge: 12
MIMXRT1060-EVK IMXRT1060IEC.pdf
MIMXRT1060-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+215.95 EUR
MIMXRT1062DVL6A IMXRT1060CEC.pdf
MIMXRT1062DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMXRT1062CVL5A IMXRT1060IEC.pdf
MIMXRT1062CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMXRT1051DVJ6B IMXRT1050CEC.pdf
MIMXRT1051DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.49 EUR
10+ 12.38 EUR
189+ 11.29 EUR
Mindestbestellmenge: 2
MIMXRT1052CVJ5B IMXRT1050IEC.pdf
MIMXRT1052CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
MIMXRT1052DVJ6B IMXRT1050CEC.pdf
MIMXRT1052DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1369 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+23.44 EUR
10+ 18.74 EUR
189+ 15.82 EUR
567+ 15.73 EUR
945+ 14.85 EUR
MIMXRT1061DVL6A IMXRT1060CEC.pdf
MIMXRT1061DVL6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
MIMXRT1061CVL5A IMXRT1060IEC.pdf
MIMXRT1061CVL5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
FS32R372SDK0MMMT S32R372.pdf
FS32R372SDK0MMMT
Hersteller: NXP USA Inc.
Description: IC MCU RADAR S32R LFBGA257
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 753 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+90.52 EUR
10+ 73.43 EUR
80+ 63.76 EUR
FS32R372SEK0MMMT
FS32R372SEK0MMMT
Hersteller: NXP USA Inc.
Description: S32R RADAR MICROCONTROLLER - S32
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S32R372141EVB S32R372DS.pdf
Hersteller: NXP USA Inc.
Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+741.56 EUR
S32R372RRSEVB S32R372DS.pdf
S32R372RRSEVB
Hersteller: NXP USA Inc.
Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+649.92 EUR
PN7360AUEV/C300E PN7462.pdf
PN7360AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.44 EUR
10+ 15.78 EUR
25+ 14.53 EUR
80+ 13.29 EUR
230+ 12.46 EUR
490+ 11.63 EUR
980+ 11.05 EUR
Mindestbestellmenge: 2
PN7362AUEV/C300E PN7462.pdf
PN7362AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 581 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.08 EUR
10+ 11.84 EUR
25+ 10.97 EUR
Mindestbestellmenge: 2
PN7462AUEV/C300E PN7462.pdf
PN7462AUEV/C300E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 4283 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.15 EUR
10+ 12.8 EUR
25+ 11.86 EUR
Mindestbestellmenge: 2
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