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MC34PF1550A4EPR2 NXP USA Inc.
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Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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Technische Details MC34PF1550A4EPR2 NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 3.8V ~ 7V, Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Supplier Device Package: 40-HVQFN (5x5), Part Status: Active.
Weitere Produktangebote MC34PF1550A4EPR2
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MC34PF1550A4EPR2 | Hersteller : NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
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MC34PF1550A4EPR2 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |