Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35281) > Seite 315 nach 589
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
LS2048AXN7V1B | NXP USA Inc. | Description: LS2048A XT 2000 R1.1 |
Produkt ist nicht verfügbar |
||||||||||||||||
LS2088ASN7V1B | NXP USA Inc. |
Description: LS2088A ST 2000 R1.1 Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 2.0GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SATA: SATA 6Gbps (2) Part Status: Active |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MCIMX6Y2DVK09AB | NXP USA Inc. |
Description: IC MPU I.MX6 900MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
MIMXRT1051CVL5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 1108 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MIMXRT1051DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 777 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MIMXRT1052CVL5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MIMXRT1052DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 4002 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MINISASTOCSI | NXP USA Inc. |
Description: OV5640 MIPI CSI BOARD (MINI SAS) Packaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MTRCKTSPS5744P | NXP USA Inc. |
Description: AUTOMOTIVE PMSM DEVELOPMENT KIT Packaging: Box Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC5744P Supplied Contents: Board(s) |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MTRDEVKSBNK144 | NXP USA Inc. | Description: S32K144 MOTOR CTRL |
Produkt ist nicht verfügbar |
||||||||||||||||
MTRDEVKSPNK144 | NXP USA Inc. |
Description: S32K144 MOTOR CTRL Packaging: Box Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: S32K1xx Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
OM13552UL | NXP USA Inc. | Description: NX5P2190 LOAD SWITCH BOARD |
Produkt ist nicht verfügbar |
||||||||||||||||
OM13554UL | NXP USA Inc. |
Description: NX5P1107 LOAD SWITCH BOARD Packaging: Box Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: NX5P1107 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
P2041NXN7PNC | NXP USA Inc. | Description: P2041-1500MHZ XT NE R2 |
Produkt ist nicht verfügbar |
||||||||||||||||
QN9080DHNE | NXP USA Inc. | Description: IC RF BTLE SOC 48VFQFN |
Produkt ist nicht verfügbar |
||||||||||||||||
QN9080DHNY | NXP USA Inc. | Description: IC RF BTLE SOC 48VFQFN |
Produkt ist nicht verfügbar |
||||||||||||||||
S32K142EVB-Q100 | NXP USA Inc. |
Description: S32K142 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K142 Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
S32K146EVB-Q144 | NXP USA Inc. |
Description: S32K146 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K146 Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
S912ZVL64F0MLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
S912ZVL64F0VFMR | NXP USA Inc. | Description: IC MCU 16BIT 64KB FLASH 32QFN |
Produkt ist nicht verfügbar |
||||||||||||||||
S9S08RN48W1VLFR | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
SA604AD/02J | NXP USA Inc. |
Description: HIGH PERFORMANCE LOW POWER FM IF Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Function: FM IF System Frequency: 25MHz RF Type: Cellular, ASK, FSK Secondary Attributes: RSSI Equipped Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
||||||||||||||||
SJA1105PELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Tape & Reel (TR) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105QELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Tape & Reel (TR) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105RELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Tape & Reel (TR) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105SELY | NXP USA Inc. | Description: IC ETHERNET SWITCH SPI 159LFBGA |
Produkt ist nicht verfügbar |
||||||||||||||||
SP5746BSK1ACMH2R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
||||||||||||||||
SP5746CBK1AMMH6R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
||||||||||||||||
SP5748GSK0AVKU2R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
SPC5744PEK1AMMM5 | NXP USA Inc. | Description: IC MCU 32B 2.5MB FLASH 257MAPBGA |
Produkt ist nicht verfügbar |
||||||||||||||||
SPC5748GBK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SPC5748GSK0AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
KITPF4210EPEVB | NXP USA Inc. | Description: PF4210 EVAL BOARD |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
IMXRT1050-EVKB | NXP USA Inc. |
Description: ARDUINO I.MX RT1050 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT1050 Platform: Arduino Part Status: Active |
auf Bestellung 159 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
CLEV6630AM | NXP USA Inc. | Description: CLRC663 CUSTOMER DEV BOARD |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
NX30P6093AUKAZ | NXP USA Inc. |
Description: OVP LOAD SWITCH & OTG UP TO 1.5A Packaging: Cut Tape (CT) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
NX20P0407UKAZ | NXP USA Inc. |
Description: USB TYPE-C CC1/2 SBU1/2 PROT IC Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Technology: Internal Switch Voltage - Clamping: 28V Supplier Device Package: 12-WLCSP (1.67x1.27) Part Status: Active Number of Circuits: 4 |
auf Bestellung 10341 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
TEA19051BAAT/1J | NXP USA Inc. | Description: IC USB CONTROLLER 14SO |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||
TEA19051BAATK/1J | NXP USA Inc. |
Description: IC USB CONTROLLER 16HVSON Packaging: Cut Tape (CT) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) DigiKey Programmable: Not Verified |
auf Bestellung 67 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
TJA1102HN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 2/2 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.8V, 3.3V Number of Drivers/Receivers: 2/2 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 56-HVQFN (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3815 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105PELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Cut Tape (CT) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 2464 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105RELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Cut Tape (CT) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1645 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105QELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Cut Tape (CT) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2032 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
SJA1105SELY | NXP USA Inc. | Description: IC ETHERNET SWITCH SPI 159LFBGA |
Produkt ist nicht verfügbar |
||||||||||||||||
FXTH87EH11DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 1935 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||
FXTH87EH02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 1968 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
FXTH87EH116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 723 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||
NX30P6093AUKZ | NXP USA Inc. | Description: OVP LOAD SWITCH & OTG UP TO 1.5A |
Produkt ist nicht verfügbar |
||||||||||||||||
OL2385AHN/001A1Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48VFQFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
OM29263ADK | NXP USA Inc. |
Description: NFC ANTENNA DEV KIT Packaging: Bulk Frequency: 13.56MHz Type: RFID Reader Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MMG30271BT1 | NXP USA Inc. |
Description: IC AMP 900MHZ-4.3GHZ SOT89-3 Packaging: Cut Tape (CT) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 900MHz ~ 4.3GHz Voltage - Supply: 5V Gain: 25dB Current - Supply: 240mA P1dB: 27dBm Test Frequency: 2.14GHz Supplier Device Package: SOT-89-3 Part Status: Active |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
PCA9548AD,118 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 24SO Packaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V Applications: Translating Switch Supplier Device Package: 24-SO Part Status: Active |
auf Bestellung 12165 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MC33771BSP1AER2 | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
||||||||||||||||
MC33771BTP1AER2 | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
||||||||||||||||
MC33771BSA1AE | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1120 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MC33771BSA1AER2 | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
MC33771BTA1AE | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MC33771BSP2AE | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
||||||||||||||||
MC33771BTP2AE | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
MC33771BTP2AER2 | NXP USA Inc. |
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
LS2088ASN7V1B |
Hersteller: NXP USA Inc.
Description: LS2088A ST 2000 R1.1
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Description: LS2088A ST 2000 R1.1
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 861.1 EUR |
MCIMX6Y2DVK09AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6 900MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Produkt ist nicht verfügbar
MIMXRT1051CVL5B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1108 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.11 EUR |
10+ | 14.48 EUR |
80+ | 13.21 EUR |
MIMXRT1051DVL6B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 777 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.31 EUR |
10+ | 16.22 EUR |
80+ | 13.7 EUR |
480+ | 13.62 EUR |
MIMXRT1052CVL5B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 23.43 EUR |
MIMXRT1052DVL6B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 4002 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.46 EUR |
10+ | 17.94 EUR |
80+ | 15.16 EUR |
480+ | 15.06 EUR |
960+ | 14.22 EUR |
MINISASTOCSI |
Hersteller: NXP USA Inc.
Description: OV5640 MIPI CSI BOARD (MINI SAS)
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Part Status: Active
Description: OV5640 MIPI CSI BOARD (MINI SAS)
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 187.72 EUR |
MTRCKTSPS5744P |
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE PMSM DEVELOPMENT KIT
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC5744P
Supplied Contents: Board(s)
Description: AUTOMOTIVE PMSM DEVELOPMENT KIT
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC5744P
Supplied Contents: Board(s)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 3437.83 EUR |
MTRDEVKSPNK144 |
Hersteller: NXP USA Inc.
Description: S32K144 MOTOR CTRL
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K1xx
Supplied Contents: Board(s)
Part Status: Active
Description: S32K144 MOTOR CTRL
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K1xx
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
OM13552UL |
Hersteller: NXP USA Inc.
Description: NX5P2190 LOAD SWITCH BOARD
Description: NX5P2190 LOAD SWITCH BOARD
Produkt ist nicht verfügbar
OM13554UL |
Hersteller: NXP USA Inc.
Description: NX5P1107 LOAD SWITCH BOARD
Packaging: Box
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: NX5P1107
Supplied Contents: Board(s)
Part Status: Active
Description: NX5P1107 LOAD SWITCH BOARD
Packaging: Box
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: NX5P1107
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
P2041NXN7PNC |
Hersteller: NXP USA Inc.
Description: P2041-1500MHZ XT NE R2
Description: P2041-1500MHZ XT NE R2
Produkt ist nicht verfügbar
S32K142EVB-Q100 |
Hersteller: NXP USA Inc.
Description: S32K142 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K142
Part Status: Active
Description: S32K142 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K142
Part Status: Active
Produkt ist nicht verfügbar
S32K146EVB-Q144 |
Hersteller: NXP USA Inc.
Description: S32K146 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K146
Part Status: Active
Description: S32K146 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K146
Part Status: Active
Produkt ist nicht verfügbar
S912ZVL64F0MLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVL64F0VFMR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32QFN
Description: IC MCU 16BIT 64KB FLASH 32QFN
Produkt ist nicht verfügbar
S9S08RN48W1VLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SA604AD/02J |
Hersteller: NXP USA Inc.
Description: HIGH PERFORMANCE LOW POWER FM IF
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: FM IF System
Frequency: 25MHz
RF Type: Cellular, ASK, FSK
Secondary Attributes: RSSI Equipped
Supplier Device Package: 16-SO
Description: HIGH PERFORMANCE LOW POWER FM IF
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: FM IF System
Frequency: 25MHz
RF Type: Cellular, ASK, FSK
Secondary Attributes: RSSI Equipped
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
SJA1105PELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 8.94 EUR |
SJA1105QELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 11.28 EUR |
SJA1105RELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 9.41 EUR |
SJA1105SELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Description: IC ETHERNET SWITCH SPI 159LFBGA
Produkt ist nicht verfügbar
SP5746BSK1ACMH2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
SP5746CBK1AMMH6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
SP5748GSK0AVKU2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5744PEK1AMMM5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Produkt ist nicht verfügbar
SPC5748GBK0AVKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 93.07 EUR |
10+ | 75.51 EUR |
200+ | 65.56 EUR |
SPC5748GSK0AVKU2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
KITPF4210EPEVB |
Hersteller: NXP USA Inc.
Description: PF4210 EVAL BOARD
Description: PF4210 EVAL BOARD
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 606.02 EUR |
IMXRT1050-EVKB |
Hersteller: NXP USA Inc.
Description: ARDUINO I.MX RT1050 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1050
Platform: Arduino
Part Status: Active
Description: ARDUINO I.MX RT1050 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1050
Platform: Arduino
Part Status: Active
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 156.31 EUR |
CLEV6630AM |
Hersteller: NXP USA Inc.
Description: CLRC663 CUSTOMER DEV BOARD
Description: CLRC663 CUSTOMER DEV BOARD
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 63.69 EUR |
NX30P6093AUKAZ |
Hersteller: NXP USA Inc.
Description: OVP LOAD SWITCH & OTG UP TO 1.5A
Packaging: Cut Tape (CT)
Part Status: Active
Description: OVP LOAD SWITCH & OTG UP TO 1.5A
Packaging: Cut Tape (CT)
Part Status: Active
Produkt ist nicht verfügbar
NX20P0407UKAZ |
Hersteller: NXP USA Inc.
Description: USB TYPE-C CC1/2 SBU1/2 PROT IC
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 4
Description: USB TYPE-C CC1/2 SBU1/2 PROT IC
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 4
auf Bestellung 10341 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.83 EUR |
10+ | 2.36 EUR |
100+ | 1.88 EUR |
500+ | 1.59 EUR |
1000+ | 1.35 EUR |
2000+ | 1.28 EUR |
TEA19051BAAT/1J |
Hersteller: NXP USA Inc.
Description: IC USB CONTROLLER 14SO
Description: IC USB CONTROLLER 14SO
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)TEA19051BAATK/1J |
Hersteller: NXP USA Inc.
Description: IC USB CONTROLLER 16HVSON
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
Description: IC USB CONTROLLER 16HVSON
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.58 EUR |
10+ | 4.11 EUR |
25+ | 3.87 EUR |
TJA1102HN/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3815 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.85 EUR |
10+ | 11.61 EUR |
25+ | 11.07 EUR |
100+ | 9.61 EUR |
250+ | 9.18 EUR |
500+ | 8.37 EUR |
1000+ | 7.29 EUR |
SJA1105PELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2464 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.75 EUR |
10+ | 14.23 EUR |
25+ | 13.57 EUR |
100+ | 11.78 EUR |
250+ | 11.25 EUR |
500+ | 10.26 EUR |
SJA1105RELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1645 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.58 EUR |
10+ | 14.98 EUR |
25+ | 14.28 EUR |
100+ | 12.4 EUR |
250+ | 11.84 EUR |
500+ | 10.8 EUR |
SJA1105QELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2032 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 17.81 EUR |
10+ | 16.38 EUR |
25+ | 15.7 EUR |
100+ | 13.83 EUR |
250+ | 13.15 EUR |
500+ | 12.3 EUR |
SJA1105SELY |
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Description: IC ETHERNET SWITCH SPI 159LFBGA
Produkt ist nicht verfügbar
FXTH87EH11DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1935 Stücke:
Lieferzeit 10-14 Tag (e)FXTH87EH02DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1968 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.39 EUR |
10+ | 10.71 EUR |
25+ | 9.9 EUR |
100+ | 8.57 EUR |
500+ | 8.03 EUR |
1000+ | 7.5 EUR |
FXTH87EH116T1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 723 Stücke:
Lieferzeit 10-14 Tag (e)NX30P6093AUKZ |
Hersteller: NXP USA Inc.
Description: OVP LOAD SWITCH & OTG UP TO 1.5A
Description: OVP LOAD SWITCH & OTG UP TO 1.5A
Produkt ist nicht verfügbar
OL2385AHN/001A1Y |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
OM29263ADK |
Hersteller: NXP USA Inc.
Description: NFC ANTENNA DEV KIT
Packaging: Bulk
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Part Status: Active
Description: NFC ANTENNA DEV KIT
Packaging: Bulk
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 53.79 EUR |
MMG30271BT1 |
Hersteller: NXP USA Inc.
Description: IC AMP 900MHZ-4.3GHZ SOT89-3
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 900MHz ~ 4.3GHz
Voltage - Supply: 5V
Gain: 25dB
Current - Supply: 240mA
P1dB: 27dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
Part Status: Active
Description: IC AMP 900MHZ-4.3GHZ SOT89-3
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 900MHz ~ 4.3GHz
Voltage - Supply: 5V
Gain: 25dB
Current - Supply: 240mA
P1dB: 27dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
Part Status: Active
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.17 EUR |
10+ | 4.63 EUR |
25+ | 4.17 EUR |
100+ | 3.8 EUR |
PCA9548AD,118 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Switch
Supplier Device Package: 24-SO
Part Status: Active
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Switch
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 12165 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 4.14 EUR |
10+ | 3.71 EUR |
25+ | 3.5 EUR |
100+ | 2.98 EUR |
250+ | 2.8 EUR |
500+ | 2.45 EUR |
MC33771BSP1AER2 |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33771BTP1AER2 |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33771BSA1AE |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1120 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.06 EUR |
10+ | 22.12 EUR |
25+ | 21.2 EUR |
160+ | 18.68 EUR |
320+ | 17.76 EUR |
480+ | 16.62 EUR |
960+ | 15.24 EUR |
MC33771BSA1AER2 |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
MC33771BTA1AE |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.79 EUR |
10+ | 19.12 EUR |
25+ | 18.32 EUR |
160+ | 17.44 EUR |
MC33771BSP2AE |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33771BTP2AE |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
MC33771BTP2AER2 |
Hersteller: NXP USA Inc.
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BAT CNTRL LI-ION 7-14C 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar