Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35281) > Seite 185 nach 589
Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC1778FET180,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 141 DigiKey Programmable: Not Verified |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1785FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 165 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1786FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1787FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1788FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 109 DigiKey Programmable: Not Verified |
auf Bestellung 222 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1788FET180,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 141 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1820FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 135 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1833FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 80 DigiKey Programmable: Not Verified |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1837FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 80 DigiKey Programmable: Not Verified |
auf Bestellung 777 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1853FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 80 DigiKey Programmable: Not Verified |
auf Bestellung 270 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1857FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
auf Bestellung 7427 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4310FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
auf Bestellung 197 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4320FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
auf Bestellung 258 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4330FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
auf Bestellung 202 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4350FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
auf Bestellung 240 Stücke: Lieferzeit 10-14 Tag (e) |
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P80C51FA-4B,557 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44PQFP Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 16MHz RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM Supplier Device Package: 44-PQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P80C552EFB/08,557 | NXP USA Inc. | Description: IC MCU 8BIT ROMLESS 80PQFP |
Produkt ist nicht verfügbar |
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P80CE598FFB/00,557 | NXP USA Inc. | Description: IC MCU 8BIT ROMLESS 80QFP |
Produkt ist nicht verfügbar |
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P87C51RD2FBD/01,15 | NXP USA Inc. |
Description: IC MCU 8BIT 64KB OTP 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 33MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Obsolete Number of I/O: 32 |
Produkt ist nicht verfügbar |
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P87C52SFBB,557 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 44PQFP Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR Supplier Device Package: 44-PQFP (10x10) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PXAH30KFBE,557 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 30MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: XA Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PXAH40KFBE,557 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 30MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: XA Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TDA18250HN/C1,551 | NXP USA Inc. | Description: IC VIDEO TUNER 48HVQFN |
Produkt ist nicht verfügbar |
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TDA18250HN/C1,557 | NXP USA Inc. | Description: IC VIDEO TUNER 48HVQFN |
Produkt ist nicht verfügbar |
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TDA19989AETC189,55 | NXP USA Inc. | Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA |
Produkt ist nicht verfügbar |
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TDA8296HN/C1,551 | NXP USA Inc. |
Description: RF DEMODULATOR IC 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.1V ~ 3.6V Supplier Device Package: 40-HVQFN (6x6) Current - Supply: 65 mA |
Produkt ist nicht verfügbar |
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TDA8296HN/C1,557 | NXP USA Inc. |
Description: RF DEMODULATOR IC 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.1V ~ 3.6V Supplier Device Package: 40-HVQFN (6x6) Part Status: Obsolete Current - Supply: 65 mA |
Produkt ist nicht verfügbar |
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BF1118,215 | NXP USA Inc. |
Description: IC RF SWITCH 1GHZ SOT143B Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Impedance: 50Ohm Mounting Type: Surface Mount RF Type: General Purpose Insertion Loss: 2.5dB (max) Frequency Range: 0Hz ~ 1GHz Test Frequency: 1GHz Isolation: 30dB (min) Supplier Device Package: SOT-143B Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BF1118R,215 | NXP USA Inc. | Description: IC RF SWITCH 1GHZ SOT143R |
Produkt ist nicht verfügbar |
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BF1118W,115 | NXP USA Inc. |
Description: IC RF SWITCH 1GHZ 4SO Packaging: Tape & Reel (TR) Package / Case: SOT-343 Reverse Pinning Impedance: 50Ohm Mounting Type: Surface Mount RF Type: General Purpose Insertion Loss: 2.5dB (max) Frequency Range: 0Hz ~ 1GHz Test Frequency: 1GHz Isolation: 30dB (min) Supplier Device Package: 4-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BUK7Y08-40B/C,115 | NXP USA Inc. | Description: MOSFET N-CH 40V 75A LFPAK |
Produkt ist nicht verfügbar |
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BUK7Y25-40B/C,115 | NXP USA Inc. |
Description: MOSFET N-CH 40V 35.3A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 35.3A (Tc) Rds On (Max) @ Id, Vgs: 25mOhm @ 20A, 10V Power Dissipation (Max): 59.4W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 12.1 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 693 pF @ 25 V |
Produkt ist nicht verfügbar |
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HTMS1001FTK/AF,115 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAP Packaging: Tape & Reel (TR) Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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HTMS1301FTB/AF,115 | NXP USA Inc. | Description: RFID TAG R/W 100-150KHZ ENCAP |
Produkt ist nicht verfügbar |
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HTMS8001FTK/AF,115 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAP Packaging: Tape & Reel (TR) Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) |
Produkt ist nicht verfügbar |
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NVT2004TL,115 | NXP USA Inc. |
Description: IC TRNSLTR BIDIRECTIONAL 12HXSON Features: Auto-Direction Sensing Packaging: Tape & Reel (TR) Package / Case: 12-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DFN2514-12 Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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TJA1028TK/3V3/10:1 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 3.3V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1028TK/5V0/10:1 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1028TK/5V0/20:1 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Part Status: Active |
auf Bestellung 1400 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G27LS-50BN,118 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V CDFM6 Packaging: Tape & Reel (TR) Package / Case: SOT-1112B Current Rating (Amps): 12A Mounting Type: Chassis Mount Frequency: 2.5GHz ~ 2.7GHz Configuration: Dual Power - Output: 3W Gain: 16.5dB Technology: LDMOS Supplier Device Package: CDFM6 Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 430 mA |
Produkt ist nicht verfügbar |
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LPC1111FHN33/102'5 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1114FBD48/301:1 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1342FBD48,118 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1342FHN33,518 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1754FBD80,518 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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P80C32UBAA,518 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44PLCC Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 33MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: UART/USART Peripherals: POR Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P80C32UFAA,518 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44PLCC Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 33MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: UART/USART Peripherals: POR Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P80C552EBA/08,518 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC Packaging: Tape & Reel (TR) Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 16MHz RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: 8051 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, I²C, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.18x24.18) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P80C552EFA/08,518 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC Packaging: Tape & Reel (TR) Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 16MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: 8051 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, I²C, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.18x24.18) Part Status: Obsolete Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P80C552IBA/08,518 | NXP USA Inc. | Description: IC MCU 8BIT ROMLESS 68PLCC |
Produkt ist nicht verfügbar |
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P80C592FFA/00,518 | NXP USA Inc. | Description: IC MCU 8BIT ROMLESS 68PLCC |
Produkt ist nicht verfügbar |
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P80CE598FFB/00,518 | NXP USA Inc. | Description: IC MCU 8BIT ROMLESS 80QFP |
Produkt ist nicht verfügbar |
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P87LPC760BDH,118 | NXP USA Inc. |
Description: IC MCU 8BIT 1KB OTP 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 1KB (1K x 8) RAM Size: 128 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Supplier Device Package: 14-TSSOP Number of I/O: 12 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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P87LPC769HD,518 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 20SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Data Converters: A/D 4x8b; D/A 2x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Supplier Device Package: 20-SO Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P89LPC921FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Obsolete Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P89LPC9221FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Obsolete Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P89LPC935FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 12MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 8051 Data Converters: A/D 8x8b; D/A 2x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TDA18250HN/C1,518 | NXP USA Inc. | Description: IC VIDEO TUNER 48HVQFN |
Produkt ist nicht verfügbar |
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TDA19989AETC189,51 | NXP USA Inc. | Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA |
Produkt ist nicht verfügbar |
LPC1778FET180,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 141
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 141
DigiKey Programmable: Not Verified
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.51 EUR |
10+ | 21.99 EUR |
LPC1785FBD208,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1786FBD208,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.83 EUR |
10+ | 23.83 EUR |
LPC1787FBD208,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.75 EUR |
10+ | 26.17 EUR |
LPC1788FBD144,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
DigiKey Programmable: Not Verified
auf Bestellung 222 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 33.18 EUR |
10+ | 26.52 EUR |
120+ | 22.4 EUR |
LPC1788FET180,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1810FET100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1820FET100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.61 EUR |
10+ | 15.41 EUR |
80+ | 12.76 EUR |
LPC1833FET256,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.99 EUR |
10+ | 23.96 EUR |
90+ | 20.24 EUR |
LPC1837FET256,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 777 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.05 EUR |
10+ | 25.62 EUR |
90+ | 21.64 EUR |
450+ | 21.51 EUR |
LPC1853FET256,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 270 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.86 EUR |
10+ | 26.27 EUR |
90+ | 22.19 EUR |
LPC1857FET256,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 7427 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 35.38 EUR |
10+ | 28.27 EUR |
90+ | 23.88 EUR |
450+ | 23.73 EUR |
LPC4310FET100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 197 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.23 EUR |
10+ | 8.03 EUR |
80+ | 6.65 EUR |
LPC4320FET100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 258 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.92 EUR |
10+ | 11.72 EUR |
80+ | 9.7 EUR |
LPC4330FET256,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 202 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.8 EUR |
10+ | 19.81 EUR |
90+ | 16.73 EUR |
LPC4350FET256,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.26 EUR |
10+ | 21.79 EUR |
90+ | 18.4 EUR |
P80C51FA-4B,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Supplier Device Package: 44-PQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Supplier Device Package: 44-PQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P80C552EFB/08,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80PQFP
Description: IC MCU 8BIT ROMLESS 80PQFP
Produkt ist nicht verfügbar
P80CE598FFB/00,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Description: IC MCU 8BIT ROMLESS 80QFP
Produkt ist nicht verfügbar
P87C51RD2FBD/01,15 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB OTP 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
Description: IC MCU 8BIT 64KB OTP 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
Produkt ist nicht verfügbar
P87C52SFBB,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PXAH30KFBE,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: XA
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: XA
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PXAH40KFBE,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: XA
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: XA
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TDA18250HN/C1,551 |
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 48HVQFN
Description: IC VIDEO TUNER 48HVQFN
Produkt ist nicht verfügbar
TDA18250HN/C1,557 |
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 48HVQFN
Description: IC VIDEO TUNER 48HVQFN
Produkt ist nicht verfügbar
TDA19989AETC189,55 |
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA
Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA
Produkt ist nicht verfügbar
TDA8296HN/C1,551 |
Hersteller: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 65 mA
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 65 mA
Produkt ist nicht verfügbar
TDA8296HN/C1,557 |
Hersteller: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
Produkt ist nicht verfügbar
BF1118,215 |
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143B
Part Status: Obsolete
Description: IC RF SWITCH 1GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143B
Part Status: Obsolete
Produkt ist nicht verfügbar
BF1118R,215 |
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ SOT143R
Description: IC RF SWITCH 1GHZ SOT143R
Produkt ist nicht verfügbar
BF1118W,115 |
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ 4SO
Packaging: Tape & Reel (TR)
Package / Case: SOT-343 Reverse Pinning
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: 4-SO
Part Status: Obsolete
Description: IC RF SWITCH 1GHZ 4SO
Packaging: Tape & Reel (TR)
Package / Case: SOT-343 Reverse Pinning
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: 4-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
BUK7Y08-40B/C,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A LFPAK
Description: MOSFET N-CH 40V 75A LFPAK
Produkt ist nicht verfügbar
BUK7Y25-40B/C,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 35.3A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35.3A (Tc)
Rds On (Max) @ Id, Vgs: 25mOhm @ 20A, 10V
Power Dissipation (Max): 59.4W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 12.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 693 pF @ 25 V
Description: MOSFET N-CH 40V 35.3A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35.3A (Tc)
Rds On (Max) @ Id, Vgs: 25mOhm @ 20A, 10V
Power Dissipation (Max): 59.4W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 12.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 693 pF @ 25 V
Produkt ist nicht verfügbar
HTMS1001FTK/AF,115 |
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Produkt ist nicht verfügbar
HTMS1301FTB/AF,115 |
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Description: RFID TAG R/W 100-150KHZ ENCAP
Produkt ist nicht verfügbar
HTMS8001FTK/AF,115 |
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
NVT2004TL,115 |
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 12HXSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DFN2514-12
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRNSLTR BIDIRECTIONAL 12HXSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DFN2514-12
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
TJA1028TK/3V3/10:1 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
TJA1028TK/5V0/10:1 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
TJA1028TK/5V0/20:1 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1400 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1400+ | 1.49 EUR |
BLF6G27LS-50BN,118 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Tape & Reel (TR)
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Tape & Reel (TR)
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
Produkt ist nicht verfügbar
LPC1111FHN33/102'5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4000+ | 1.96 EUR |
LPC1114FBD48/301:1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1342FBD48,118 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1342FHN33,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1754FBD80,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 12.41 EUR |
P80C32UBAA,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P80C32UFAA,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P80C552EBA/08,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P80C552EFA/08,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P80C552IBA/08,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
P80C592FFA/00,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
P80CE598FFB/00,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Description: IC MCU 8BIT ROMLESS 80QFP
Produkt ist nicht verfügbar
P87LPC760BDH,118 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1KB OTP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
Description: IC MCU 8BIT 1KB OTP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
P87LPC769HD,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P89LPC921FDH,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P89LPC9221FDH,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P89LPC935FDH,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TDA18250HN/C1,518 |
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 48HVQFN
Description: IC VIDEO TUNER 48HVQFN
Produkt ist nicht verfügbar
TDA19989AETC189,51 |
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA
Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA
Produkt ist nicht verfügbar