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LPC1810FET100,551 NXP Semiconductors
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Technische Details LPC1810FET100,551 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 100TFBGA, Packaging: Tray, Package / Case: 100-TFBGA, Mounting Type: Surface Mount, Speed: 150MHz, RAM Size: 136K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 12x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT, Supplier Device Package: 100-TFBGA (9x9), Number of I/O: 64, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC1810FET100,551
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LPC1810FET100,551 | Hersteller : NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |