Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35030) > Seite 183 nach 584
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MCIMX233DAG4C | NXP USA Inc. |
 Description: IC MPU I.MX23 454MHZ 128LQFPPackaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 510 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX233DJM4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 1760 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905BD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC |
Produkt ist nicht verfügbar |
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MC34827A1EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: OR Controller, UART/USB Data, Audio Management Current - Supply: 9µA Supplier Device Package: 20-QFN-EP (3x3) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC34827A2EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: OR Controller, UART/USB Data, Audio Management Current - Supply: 9µA Supplier Device Package: 20-QFN-EP (3x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCIMX233CAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFP Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 425 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8309CVMAHFCA | NXP USA Inc. |
Description: IC MPU MPC83XX 417MHZ 489BGA Packaging: Tray Package / Case: 489-LFBGA Mounting Type: Surface Mount Speed: 417MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 489-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
auf Bestellung 400 Stücke: Lieferzeit 10-14 Tag (e) |
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MSC8156ETVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MSC8156ESVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MSC8154TVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MSC8154ETVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
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SSL4101/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 380kHz Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 150°C (TJ) Applications: Lighting Internal Switch(s): No Topology: Flyback Supplier Device Package: 16-SO Voltage - Supply (Min): 15V Voltage - Supply (Max): 38V |
Produkt ist nicht verfügbar |
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OM13001,598 | NXP USA Inc. |
Description: LPC1788 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M3 Board Type: Evaluation Platform Utilized IC / Part: LPC1788 Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-RS08DC-KA8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: RS08 Board Type: Evaluation Platform Utilized IC / Part: MC9RS08KA8 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-S08DC-AC60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08AC60 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-S08DC-QD4 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QD4 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-S08DC-QE64 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QE64 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-S08DC-QG8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08QG8 Platform: Tower System Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-S08DC-SH8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SH8 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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| 1323XUSB | NXP USA Inc. | Description: RF EVAL FOR MC1323X |
Produkt ist nicht verfügbar |
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TWR-S08UNIV | NXP USA Inc. |
Description: TOWER SYST TWR-RS08DC/TWR-S08DC |
Produkt ist nicht verfügbar |
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1323XDSK | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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1323XDSK-BDM | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s) |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX50EVK | NXP USA Inc. |
Description: I.MX50 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A8 Board Type: Evaluation Platform Utilized IC / Part: i.MX50 Operating System: Linux Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MC13850EPR2 | NXP USA Inc. |
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.3V ~ 3V Gain: 13dB Current - Supply: 9.9mA Noise Figure: 1.85dB P1dB: 2.2dBm Test Frequency: 2.4GHz Supplier Device Package: 8-MLPD (2x2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC13852EPR2 | NXP USA Inc. |
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 2.3V ~ 3V Gain: 18.3dB Current - Supply: 5.5mA Noise Figure: 1.2dB P1dB: 9.6dBm Test Frequency: 900MHz Supplier Device Package: 8-MLPD (2x2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MRF8P20165WHSR5 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.01GHZ NI780S4 |
Produkt ist nicht verfügbar |
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MC9S08GW32CLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x16b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MMA6805AKW | NXP USA Inc. | Description: ACCELEROMETER 16QFN |
Produkt ist nicht verfügbar |
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MMA6555KW | NXP USA Inc. |
Description: ACCELEROMETER 105G SPI 16QFN Packaging: Tray Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±105g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 18.2 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MMA6823AKW | NXP USA Inc. | Description: ACCELEROMETER 50G SPI 16QFN |
Produkt ist nicht verfügbar |
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MCIMX534AVV8CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX536AVV8CR2 | NXP USA Inc. |
Description: IC MPU 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Supplier Device Package: 529-FBGA (19x19) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCIMX537CVV8CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MRF8P20165WHSR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.01GHZ NI780S4 |
Produkt ist nicht verfügbar |
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| P3041DS-PA | NXP USA Inc. |
Description: P3041 EVAL BRD |
Produkt ist nicht verfügbar |
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DEMO9S12XHY256 | NXP USA Inc. |
Description: MC9S12XHY256 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), LCD Core Processor: HCS12X Utilized IC / Part: MC9S12XHY256 Part Status: Active |
Produkt ist nicht verfügbar |
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TRK-MPC5604P | NXP USA Inc. |
Description: STARTERTRAK MPC5604P EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: e200 Utilized IC / Part: MPC5604P Platform: StarterTRAK Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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TRK-MPC5634M | NXP USA Inc. |
Description: STARTERTRAK MPC5634M EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: e200 Utilized IC / Part: MPC5634M Platform: StarterTRAK |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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| DSPAUDIOEVMMB1E | NXP USA Inc. |
Description: DSP563XX EVAL BRD |
Produkt ist nicht verfügbar |
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MX50EBOOKDC1 | NXP USA Inc. |
Description: HARDWARE MX50EBOOKDC1 Packaging: Box For Use With/Related Products: i.MX50 Accessory Type: Electronic Paper Display (EPD) Part Status: Active |
Produkt ist nicht verfügbar |
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| LFDA8451 | NXP USA Inc. |
Description: MMA8451 DEVICE ADPTR BRD Packaging: Box For Use With/Related Products: Freescale Tower System, MMA8451Q Accessory Type: Adapter Board Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MC13850-900HEVK | NXP USA Inc. |
Description: IC MC13850_900_HIIP3_EVK |
Produkt ist nicht verfügbar |
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| MC13851-2400EVK | NXP USA Inc. |
Description: IC MC13851 EVB 2400MHZ |
Produkt ist nicht verfügbar |
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| MC13852-434EVK | NXP USA Inc. |
Description: IC MC13852 EVB 434MHZ Packaging: Box For Use With/Related Products: MC13852 Frequency: 434MHz Type: Amplifier Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MC13917-1900EVK | NXP USA Inc. |
Description: IC MC13917_1900_EVK Packaging: Box For Use With/Related Products: MC13917 Frequency: 1.9GHz Type: Amplifier Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| MC13917-350EVK | NXP USA Inc. |
Description: IC MC13917_350_EVK Packaging: Box For Use With/Related Products: MC13917 Frequency: 350MHz Type: Amplifier Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| MC13917-434EVK | NXP USA Inc. |
Description: IC MC13917 EVB 434MHZ Packaging: Box For Use With/Related Products: MC13917 Frequency: 434MHz Type: Amplifier Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MC13917-900EVK | NXP USA Inc. |
Description: IC MC13917_900_EVK Packaging: Box For Use With/Related Products: MC13917 Frequency: 900MHz Type: Amplifier Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCIMX535DVV1CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 1.0GHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Part Status: Obsolete Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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PSMN3R7-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 97A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 97A (Tc) Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V Power Dissipation (Max): 64W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V |
Produkt ist nicht verfügbar |
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PSMN3R7-30YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 100A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V Power Dissipation (Max): 79W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V |
Produkt ist nicht verfügbar |
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PSMN3R7-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 97A LFPAK56 Packaging: Cut Tape (CT) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 97A (Tc) Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V Power Dissipation (Max): 64W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V |
Produkt ist nicht verfügbar |
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IP4283CZ10-TB,115 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU Packaging: Cut Tape (CT) Package / Case: 10-XFDFN Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: HDMI Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 10-XSONU (2.5x1) Unidirectional Channels: 4 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 9.5V (Typ) Power Line Protection: Yes Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PESD5V0L6UAS,118 | NXP USA Inc. | Description: TVS DIODE 5V 15V 8TSSOP |
Produkt ist nicht verfügbar |
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PBSS3540E,115 | NXP USA Inc. |
Description: TRANS PNP 40V 0.5A SC75 Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V Frequency - Transition: 300MHz Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW |
Produkt ist nicht verfügbar |
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PESD3V3L1UA,115 | NXP USA Inc. |
Description: TVS DIODE 3.3VWM 11VC SOD323 Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Capacitance @ Frequency: 34pF @ 1MHz Current - Peak Pulse (10/1000µs): 4.5A (8/20µs) Voltage - Reverse Standoff (Typ): 3.3V (Max) Supplier Device Package: SOD-323 Unidirectional Channels: 1 Voltage - Breakdown (Min): 5.3V Voltage - Clamping (Max) @ Ipp: 11V Power - Peak Pulse: 45W Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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PBSS2540E,115 | NXP USA Inc. |
Description: TRANS NPN 40V 0.5A SC75 Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V Frequency - Transition: 450MHz Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW |
Produkt ist nicht verfügbar |
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BZA862AL,115 | NXP USA Inc. |
Description: TVS DIODE 6.2VWM 5TSSOP Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Type: Zener Applications: General Purpose Capacitance @ Frequency: 200pF @ 1MHz Voltage - Reverse Standoff (Typ): 6.2V Supplier Device Package: SOT-353 Unidirectional Channels: 4 Power - Peak Pulse: 15W Power Line Protection: No |
Produkt ist nicht verfügbar |
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PMF290XN,115 | NXP USA Inc. |
Description: MOSFET N-CH 20V 1A SOT323-3 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1A (Tc) Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V Power Dissipation (Max): 560mW (Tc) Vgs(th) (Max) @ Id: 1.5V @ 250µA Supplier Device Package: SC-70 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V |
Produkt ist nicht verfügbar |
| MCIMX233DAG4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 28.44 EUR |
| 10+ | 22.73 EUR |
| 80+ | 19.2 EUR |
| 450+ | 19.08 EUR |
| MCIMX233DJM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 1760 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 33.16 EUR |
| 10+ | 26.5 EUR |
| 80+ | 22.38 EUR |
| MCZ33905BD5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Description: IC INTERFACE SPECIALIZED 54SOIC
Produkt ist nicht verfügbar
| MC34827A1EPR2 |
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC34827A2EPR2 |
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MCIMX233CAG4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 425 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.77 EUR |
| 10+ | 18.21 EUR |
| 80+ | 16.61 EUR |
| MPC8309CVMAHFCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 69.85 EUR |
| 10+ | 56.02 EUR |
| 80+ | 47.84 EUR |
| MSC8156ETVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
| MSC8156ESVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
| MSC8154TVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
| MSC8154ETVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
| SSL4101/1,518 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
Produkt ist nicht verfügbar
| OM13001,598 |
Hersteller: NXP USA Inc.
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
Produkt ist nicht verfügbar
| TWR-RS08DC-KA8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
| TWR-S08DC-AC60 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
| TWR-S08DC-QD4 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Produkt ist nicht verfügbar
| TWR-S08DC-QE64 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Produkt ist nicht verfügbar
| TWR-S08DC-QG8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.03 EUR |
| TWR-S08DC-SH8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
| TWR-S08UNIV |
|
Hersteller: NXP USA Inc.
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Produkt ist nicht verfügbar
| 1323XDSK |
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| 1323XDSK-BDM |
|
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 599.98 EUR |
| MCIMX50EVK |
|
Hersteller: NXP USA Inc.
Description: I.MX50 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A8
Board Type: Evaluation Platform
Utilized IC / Part: i.MX50
Operating System: Linux
Part Status: Active
Description: I.MX50 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A8
Board Type: Evaluation Platform
Utilized IC / Part: i.MX50
Operating System: Linux
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 951.26 EUR |
| MC13850EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 13dB
Current - Supply: 9.9mA
Noise Figure: 1.85dB
P1dB: 2.2dBm
Test Frequency: 2.4GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 13dB
Current - Supply: 9.9mA
Noise Figure: 1.85dB
P1dB: 2.2dBm
Test Frequency: 2.4GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC13852EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 18.3dB
Current - Supply: 5.5mA
Noise Figure: 1.2dB
P1dB: 9.6dBm
Test Frequency: 900MHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 18.3dB
Current - Supply: 5.5mA
Noise Figure: 1.2dB
P1dB: 9.6dBm
Test Frequency: 900MHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MRF8P20165WHSR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
| MC9S08GW32CLK |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MMA6555KW |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Packaging: Tray
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 105G SPI 16QFN
Packaging: Tray
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MMA6823AKW |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
Description: ACCELEROMETER 50G SPI 16QFN
Produkt ist nicht verfügbar
| MCIMX534AVV8CR2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX536AVV8CR2 |
Hersteller: NXP USA Inc.
Description: IC MPU 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 529-FBGA (19x19)
Part Status: Obsolete
Description: IC MPU 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 529-FBGA (19x19)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MCIMX537CVV8CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MRF8P20165WHSR3 |
|
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
| DEMO9S12XHY256 |
Hersteller: NXP USA Inc.
Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
Produkt ist nicht verfügbar
| TRK-MPC5604P |
|
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5604P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5604P
Platform: StarterTRAK
Part Status: Active
Description: STARTERTRAK MPC5604P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5604P
Platform: StarterTRAK
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 254.67 EUR |
| TRK-MPC5634M |
|
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5634M EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5634M
Platform: StarterTRAK
Description: STARTERTRAK MPC5634M EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5634M
Platform: StarterTRAK
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 278.63 EUR |
| MX50EBOOKDC1 |
|
Hersteller: NXP USA Inc.
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
| LFDA8451 |
|
Hersteller: NXP USA Inc.
Description: MMA8451 DEVICE ADPTR BRD
Packaging: Box
For Use With/Related Products: Freescale Tower System, MMA8451Q
Accessory Type: Adapter Board
Part Status: Obsolete
Description: MMA8451 DEVICE ADPTR BRD
Packaging: Box
For Use With/Related Products: Freescale Tower System, MMA8451Q
Accessory Type: Adapter Board
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC13850-900HEVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13850_900_HIIP3_EVK
Description: IC MC13850_900_HIIP3_EVK
Produkt ist nicht verfügbar
| MC13851-2400EVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13851 EVB 2400MHZ
Description: IC MC13851 EVB 2400MHZ
Produkt ist nicht verfügbar
| MC13852-434EVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13852 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13852
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Description: IC MC13852 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13852
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC13917-1900EVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13917_1900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 1.9GHz
Type: Amplifier
Supplied Contents: Board(s)
Description: IC MC13917_1900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 1.9GHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| MC13917-350EVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13917_350_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 350MHz
Type: Amplifier
Supplied Contents: Board(s)
Description: IC MC13917_350_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 350MHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| MC13917-434EVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13917 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Description: IC MC13917 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC13917-900EVK |
|
Hersteller: NXP USA Inc.
Description: IC MC13917_900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 900MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Description: IC MC13917_900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 900MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MCIMX535DVV1CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| PSMN3R7-25YLC,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Produkt ist nicht verfügbar
| PSMN3R7-30YLC,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Produkt ist nicht verfügbar
| PSMN3R7-25YLC,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Produkt ist nicht verfügbar
| IP4283CZ10-TB,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Part Status: Obsolete
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
| PESD5V0L6UAS,118 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 5V 15V 8TSSOP
Description: TVS DIODE 5V 15V 8TSSOP
Produkt ist nicht verfügbar
| PBSS3540E,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.5A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Description: TRANS PNP 40V 0.5A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
| PESD3V3L1UA,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| PBSS2540E,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 0.5A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Description: TRANS NPN 40V 0.5A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
| BZA862AL,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
Description: TVS DIODE 6.2VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
Produkt ist nicht verfügbar
| PMF290XN,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
Produkt ist nicht verfügbar