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110-91-952-41-001000 110-91-952-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-91-964-41-001000 110-91-964-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
110-93-210-41-001000 110-93-210-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.77 EUR
10+ 22.84 EUR
40+ 21.08 EUR
80+ 19.91 EUR
110-93-210-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
110-93-304-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
110-93-304-41-105000 110-93-304-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
110-93-306-41-001000 110-93-306-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.06 EUR
10+ 16.01 EUR
25+ 15.39 EUR
110-93-306-41-105000 110-93-306-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
110-93-306-41-605000 110-93-306-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
110-93-308-41-105000 110-93-308-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.05 EUR
10+ 23.09 EUR
25+ 22.2 EUR
50+ 21.31 EUR
110-93-308-41-605000 110-93-308-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
110-93-310-41-001000 110-93-310-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.83 EUR
10+ 22.01 EUR
40+ 20.32 EUR
80+ 19.19 EUR
110-93-310-41-105000 110-93-310-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 1148 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.92 EUR
10+ 22.47 EUR
40+ 20.98 EUR
80+ 18.52 EUR
280+ 17.28 EUR
520+ 16.91 EUR
1000+ 16.05 EUR
110-93-314-10-001000 110-93-314-10-001000 Mill-Max Manufacturing Corp. 090.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
110-93-314-10-002000 Mill-Max Manufacturing Corp. 134.PDF Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
110-93-314-41-105000 110-93-314-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.12 EUR
10+ 23.51 EUR
28+ 22.28 EUR
110-93-314-41-605000 110-93-314-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.15 EUR
10+ 22.67 EUR
28+ 21.49 EUR
56+ 21.17 EUR
110-93-316-10-003000 110-93-316-10-003000 Mill-Max Manufacturing Corp. 2017-11%3A135.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-316-41-105000 110-93-316-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.04 EUR
10+ 24.31 EUR
25+ 23.04 EUR
50+ 22.71 EUR
110-93-316-41-605000 110-93-316-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.12 EUR
10+ 23.5 EUR
25+ 22.27 EUR
110-93-318-41-105000 110-93-318-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-318-41-605000 110-93-318-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-320-41-105000 110-93-320-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.72 EUR
20+ 24.9 EUR
40+ 23.26 EUR
110-93-320-41-605000 110-93-320-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.44 EUR
20+ 23.78 EUR
40+ 22.22 EUR
110-93-322-41-001000 110-93-322-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.88 EUR
18+ 23.29 EUR
36+ 22.08 EUR
54+ 21.76 EUR
110-93-322-41-105000 110-93-322-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.43 EUR
10+ 25.51 EUR
25+ 24.18 EUR
110-93-322-41-801000 110-93-322-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-324-41-105000 110-93-324-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-324-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-328-41-105000 110-93-328-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-420-41-001000 110-93-420-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 538 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.71 EUR
10+ 22.28 EUR
25+ 21.12 EUR
50+ 20.81 EUR
100+ 18.36 EUR
250+ 17.14 EUR
500+ 16.77 EUR
110-93-420-41-105000 110-93-420-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
110-93-422-41-105000 110-93-422-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
110-93-422-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
110-93-422-41-801000 Mill-Max Manufacturing Corp. 098.PDF Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
110-93-424-41-105000 110-93-424-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.03 EUR
16+ 26.03 EUR
32+ 24.67 EUR
110-93-428-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-428-41-105000 110-93-428-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-432-41-001000 110-93-432-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.55 EUR
10+ 25.61 EUR
25+ 24.27 EUR
110-93-432-41-105000 110-93-432-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
110-93-624-41-105000 110-93-624-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-624-41-605000 110-93-624-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-628-41-105000 110-93-628-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-628-41-605000 110-93-628-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-632-41-105000 110-93-632-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.16 EUR
12+ 28.73 EUR
36+ 27.24 EUR
60+ 26.84 EUR
110-93-632-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
110-93-632-41-801000 Mill-Max Manufacturing Corp. 098.PDF Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
110-93-636-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
110-93-636-41-105000 110-93-636-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
110-93-640-41-105000 110-93-640-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.78 EUR
10+ 26.95 EUR
30+ 25.79 EUR
50+ 24.96 EUR
110-93-640-41-605000 110-93-640-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
110-93-642-41-001000 110-93-642-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
110-93-642-41-105000 110-93-642-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
110-93-648-41-105000 110-93-648-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-650-41-001000 110-93-650-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
110-93-650-41-105000 110-93-650-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
110-93-652-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
110-93-652-41-105000 110-93-652-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
110-93-950-41-105000 110-93-950-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-93-952-41-001000 110-93-952-41-001000 Mill-Max Manufacturing Corp. 090.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
110-91-952-41-001000 2017-11%3A090.pdf
110-91-952-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-91-964-41-001000 2017-11%3A090.pdf
110-91-964-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
110-93-210-41-001000 2017-11%3A090.pdf
110-93-210-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.77 EUR
10+ 22.84 EUR
40+ 21.08 EUR
80+ 19.91 EUR
110-93-210-41-105000 104.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
110-93-304-41-001000 090.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
110-93-304-41-105000 104.PDF
110-93-304-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
110-93-306-41-001000 2017-11%3A090.pdf
110-93-306-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.06 EUR
10+ 16.01 EUR
25+ 15.39 EUR
110-93-306-41-105000 104.PDF
110-93-306-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
110-93-306-41-605000 094.pdf
110-93-306-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
110-93-308-41-105000 2017-11%3A104.pdf
110-93-308-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.05 EUR
10+ 23.09 EUR
25+ 22.2 EUR
50+ 21.31 EUR
110-93-308-41-605000 094.pdf
110-93-308-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
110-93-310-41-001000 2017-11%3A090.pdf
110-93-310-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+24.83 EUR
10+ 22.01 EUR
40+ 20.32 EUR
80+ 19.19 EUR
110-93-310-41-105000 2017-11%3A104.pdf
110-93-310-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 1148 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.92 EUR
10+ 22.47 EUR
40+ 20.98 EUR
80+ 18.52 EUR
280+ 17.28 EUR
520+ 16.91 EUR
1000+ 16.05 EUR
110-93-314-10-001000 090.pdf
110-93-314-10-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
110-93-314-10-002000 134.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
110-93-314-41-105000 2017-11%3A104.pdf
110-93-314-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.12 EUR
10+ 23.51 EUR
28+ 22.28 EUR
110-93-314-41-605000 2017-11%3A094.pdf
110-93-314-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.15 EUR
10+ 22.67 EUR
28+ 21.49 EUR
56+ 21.17 EUR
110-93-316-10-003000 2017-11%3A135.pdf
110-93-316-10-003000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-316-41-105000 2017-11%3A104.pdf
110-93-316-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+28.04 EUR
10+ 24.31 EUR
25+ 23.04 EUR
50+ 22.71 EUR
110-93-316-41-605000 2017-11%3A094.pdf
110-93-316-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.12 EUR
10+ 23.5 EUR
25+ 22.27 EUR
110-93-318-41-105000 2017-11%3A104.pdf
110-93-318-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-318-41-605000 2017-11%3A094.pdf
110-93-318-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-320-41-105000 2017-11%3A104.pdf
110-93-320-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+28.72 EUR
20+ 24.9 EUR
40+ 23.26 EUR
110-93-320-41-605000 2017-11%3A094.pdf
110-93-320-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.44 EUR
20+ 23.78 EUR
40+ 22.22 EUR
110-93-322-41-001000 2017-11%3A090.pdf
110-93-322-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.88 EUR
18+ 23.29 EUR
36+ 22.08 EUR
54+ 21.76 EUR
110-93-322-41-105000 2017-11%3A104.pdf
110-93-322-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.43 EUR
10+ 25.51 EUR
25+ 24.18 EUR
110-93-322-41-801000 2017-11%3A098.pdf
110-93-322-41-801000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-324-41-105000 104.PDF
110-93-324-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-324-41-605000 094.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-328-41-105000 104.PDF
110-93-328-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-420-41-001000 2017-11%3A090.pdf
110-93-420-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 538 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.71 EUR
10+ 22.28 EUR
25+ 21.12 EUR
50+ 20.81 EUR
100+ 18.36 EUR
250+ 17.14 EUR
500+ 16.77 EUR
110-93-420-41-105000 104.pdf
110-93-420-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
110-93-422-41-105000 104.PDF
110-93-422-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
110-93-422-41-605000 094.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
110-93-422-41-801000 098.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
110-93-424-41-105000 2017-11%3A104.pdf
110-93-424-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.03 EUR
16+ 26.03 EUR
32+ 24.67 EUR
110-93-428-41-001000 090.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-428-41-105000 104.pdf
110-93-428-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-432-41-001000 2017-11%3A090.pdf
110-93-432-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.55 EUR
10+ 25.61 EUR
25+ 24.27 EUR
110-93-432-41-105000 104.PDF
110-93-432-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
110-93-624-41-105000 104.pdf
110-93-624-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-624-41-605000 094.pdf
110-93-624-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
110-93-628-41-105000 104.PDF
110-93-628-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-628-41-605000 094.PDF
110-93-628-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
110-93-632-41-105000 2017-11%3A104.pdf
110-93-632-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+33.16 EUR
12+ 28.73 EUR
36+ 27.24 EUR
60+ 26.84 EUR
110-93-632-41-605000 094.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
110-93-632-41-801000 098.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
110-93-636-41-001000 090.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
110-93-636-41-105000 104.PDF
110-93-636-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
110-93-640-41-105000 2017-11%3A104.pdf
110-93-640-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.78 EUR
10+ 26.95 EUR
30+ 25.79 EUR
50+ 24.96 EUR
110-93-640-41-605000 094.pdf
110-93-640-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
110-93-642-41-001000 2017-11%3A090.pdf
110-93-642-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
110-93-642-41-105000 104.pdf
110-93-642-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
110-93-648-41-105000 2017-11%3A104.pdf
110-93-648-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-93-650-41-001000 2017-11%3A090.pdf
110-93-650-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
110-93-650-41-105000 104.PDF
110-93-650-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
110-93-652-41-001000 090.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
110-93-652-41-105000 104.PDF
110-93-652-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
110-93-950-41-105000 2017-11%3A104.pdf
110-93-950-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-93-952-41-001000 090.pdf
110-93-952-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
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