110-93-322-41-001000 Mill-Max
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.58 EUR |
10+ | 20.59 EUR |
18+ | 17.74 EUR |
108+ | 16.17 EUR |
252+ | 14.73 EUR |
504+ | 14.12 EUR |
1008+ | 13.34 EUR |
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Technische Details 110-93-322-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 22POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-93-322-41-001000 nach Preis ab 21.76 EUR bis 26.88 EUR
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110-93-322-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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