auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 31.49 EUR |
12+ | 27.32 EUR |
24+ | 25.61 EUR |
108+ | 23.85 EUR |
252+ | 22.26 EUR |
504+ | 21.56 EUR |
1008+ | 21.23 EUR |
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Technische Details 110-93-632-41-105000 Mill-Max
Description: CONN IC DIP SOCKET 32POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-93-632-41-105000 nach Preis ab 26.84 EUR bis 33.16 EUR
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110-93-632-41-105000 | Hersteller : Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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