Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (349981) > Seite 1258 nach 5834
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SY88063CLMG-TR | Microchip Technology |
 Description: IC LIMITING AMP 16QFN |
Produkt ist nicht verfügbar |
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SY88993ALKG-TR | Microchip Technology |
Description: IC LIMIT AMP 10MSOP |
auf Bestellung 992 Stücke: Lieferzeit 10-14 Tag (e) |
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SY88053CLMG-TR | Microchip Technology |
Description: IC LIMITING AMP 16QFN Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Limiting Amplifier Applications: Optical Networks Supplier Device Package: 16-QFN (3x3) |
auf Bestellung 6998 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC6122CI2A-00AVT | Microchip Technology |
Description: MEMS OSC XO 1.71V-3.63V 4SMD |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC6122CI2A-00AVT | Microchip Technology |
Description: MEMS OSC XO 1.71V-3.63V 4SMD |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC6021CI2A-009VT | Microchip Technology |
Description: MEMS OSC XO 1.71V-3.63V 4SMD Packaging: Tape & Reel (TR) Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Output: CMOS Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 1.71V ~ 3.63V Height: 0.035" (0.90mm) Current - Supply (Max): 1.3mA (Typ) Frequency - Output 1: 74.1758MHz, 74.25MHz Base Resonator: MEMS |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC6021CI2A-009VT | Microchip Technology |
Description: MEMS OSC XO 1.71V-3.63V 4SMD Packaging: Cut Tape (CT) Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Output: CMOS Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 1.71V ~ 3.63V Height: 0.035" (0.90mm) Current - Supply (Max): 1.3mA (Typ) Frequency - Output 1: 74.1758MHz, 74.25MHz Base Resonator: MEMS |
auf Bestellung 1954 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC6021CI2A-009V | Microchip Technology |
Description: MEMS OSC XO 1.71V-3.63V 4SMD Packaging: Tube Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Output: CMOS Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 1.71V ~ 3.63V Height: 0.035" (0.90mm) Current - Supply (Max): 1.3mA (Typ) Frequency - Output 1: 74.1758MHz, 74.25MHz Base Resonator: MEMS |
auf Bestellung 1100 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC6122CI2A-00AV | Microchip Technology |
Description: MEMS OSC XO 1.71V-3.63V 4SMD Packaging: Tube Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Output: CMOS Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 1.71V ~ 3.63V Height: 0.035" (0.90mm) Current - Supply (Max): 3mA (Typ) Frequency - Output 1: 74.1758MHz, 74.25MHz Base Resonator: MEMS |
auf Bestellung 1100 Stücke: Lieferzeit 10-14 Tag (e) |
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JANS1N4468US | Microchip Technology |
Description: DIODE ZENER 13V 1.5W D5A |
auf Bestellung 494 Stücke: Lieferzeit 10-14 Tag (e) |
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JAN1N4468 | Microchip Technology |
Description: DIODE ZENER 13V 1.5W DO41 Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 8 Ohms Supplier Device Package: DO-41 Grade: Military Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA Current - Reverse Leakage @ Vr: 50 nA @ 10.4 V Qualification: MIL-PRF-19500/406 |
Produkt ist nicht verfügbar |
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JAN1N5186 | Microchip Technology |
Description: DIODE GEN PURP 100V 3A B AXIAL Packaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 150 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 120 V Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A Current - Reverse Leakage @ Vr: 2 µA @ 100 V |
Produkt ist nicht verfügbar |
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PL138-48OC-R | Microchip Technology |
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP |
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PL138-48OC-R | Microchip Technology |
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP |
auf Bestellung 389 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC18LF45K40-I/MV | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 40UQFN Packaging: Tube Package / Case: 40-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 35x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 40-UQFN (5x5) Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PIC18LF45K40T-I/ML | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 44QFN Packaging: Tape & Reel (TR) Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 35x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 44-QFN (8x8) Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PIC18LF45K40T-I/ML | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 44QFN Packaging: Cut Tape (CT) Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 35x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 44-QFN (8x8) Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PIC18LF45K40-E/ML | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 44QFN Packaging: Tube Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 35x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 44-QFN (8x8) Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PIC32MM0064GPL028-I/SS | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28SSOP Packaging: Tube Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-SSOP Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 2631 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0064GPL028-E/SS | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28SSOP Packaging: Tube Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-SSOP Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 470 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0064GPL028-E/ML | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28QFN Packaging: Tube Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-QFN (6x6) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 1891 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0064GPL028-I/ML | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28QFN Packaging: Tube Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-QFN (6x6) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0064GPL028-E/M6 | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28UQFN Packaging: Tube Package / Case: 28-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-UQFN (4x4) Part Status: Active Number of I/O: 22 |
Produkt ist nicht verfügbar |
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PIC32MM0064GPL028-I/M6 | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28UQFN Packaging: Tube Package / Case: 28-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-UQFN (4x4) Part Status: Active Number of I/O: 22 |
Produkt ist nicht verfügbar |
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PIC32MM0064GPL028T-I/M6 | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28UQFN Packaging: Tape & Reel (TR) Package / Case: 28-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-UQFN (4x4) Part Status: Active Number of I/O: 22 |
Produkt ist nicht verfügbar |
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PIC32MM0064GPL028T-I/SS | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28SSOP Packaging: Tape & Reel (TR) Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-SSOP Part Status: Active Number of I/O: 22 |
Produkt ist nicht verfügbar |
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PIC32MM0064GPL028T-I/ML | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 28QFN Packaging: Tape & Reel (TR) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-QFN (6x6) Part Status: Active Number of I/O: 22 |
Produkt ist nicht verfügbar |
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PIC32MM0032GPL028-E/M6 | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28UQFN Packaging: Tube Package / Case: 28-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-UQFN (4x4) Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 455 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0032GPL028-I/SS | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28SSOP Packaging: Tube Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-SSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 162 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0032GPL028-I/ML | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28QFN Packaging: Tube Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-QFN (6x6) Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 457 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0032GPL028-E/ML | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28QFN Packaging: Tube Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b; D/A 1x5b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-QFN (6x6) Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 427 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MM0032GPL028-I/M6 | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28UQFN |
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PIC32MM0032GPL028T-I/M6 | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28UQFN |
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PIC32MM0032GPL028T-I/SS | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28SSOP |
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PIC32MM0032GPL028T-I/ML | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28QFN |
Produkt ist nicht verfügbar |
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PIC32MM0032GPL028-E/SS | Microchip Technology |
Description: IC MCU 32BIT 32KB FLASH 28SSOP |
Produkt ist nicht verfügbar |
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ATSAMG55G19B-UNT | Microchip Technology |
Description: WLCSP MRL B 105C TEMP T&R |
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PIC32MM0256GPM028-I/M6 | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 28UQFN Packaging: Tube Package / Case: 28-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x10/12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: IrDA, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 28-UQFN (4x4) Part Status: Active Number of I/O: 21 DigiKey Programmable: Not Verified |
auf Bestellung 585 Stücke: Lieferzeit 10-14 Tag (e) |
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MCP14E4-E/SN | Microchip Technology |
Description: IC GATE DRVR LOW-SIDE 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 18V Input Type: Non-Inverting Supplier Device Package: 8-SOIC Rise / Fall Time (Typ): 15ns, 18ns Channel Type: Independent Driven Configuration: Low-Side Number of Drivers: 2 Gate Type: IGBT, N-Channel, P-Channel MOSFET Logic Voltage - VIL, VIH: 0.8V, 2.4V Current - Peak Output (Source, Sink): 4A, 4A Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 711 Stücke: Lieferzeit 10-14 Tag (e) |
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SST25VF010A-33-4C-QAE | Microchip Technology |
Description: IC FLASH 1MBIT SPI 33MHZ 8WSON Packaging: Tube Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 1Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH Clock Frequency: 33 MHz Memory Format: FLASH Supplier Device Package: 8-WSON Part Status: Active Write Cycle Time - Word, Page: 20µs Memory Interface: SPI Memory Organization: 128K x 8 DigiKey Programmable: Not Verified |
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SST25VF010A-33-4I-ZAE | Microchip Technology |
Description: IC FLASH 1MBIT SPI 33MHZ 8CSP Packaging: Tape & Reel (TR) Package / Case: 8-UFBGA, CSPBGA Mounting Type: Surface Mount Memory Size: 1Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH Clock Frequency: 33 MHz Memory Format: FLASH Supplier Device Package: 8-CSP Part Status: Active Write Cycle Time - Word, Page: 20µs Memory Interface: SPI Memory Organization: 128K x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| PIC18F23K22T-I/SO | Microchip Technology |
Description: IC MCU 8BIT 8KB FLASH 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 8KB (4K x 16) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 19x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| PIC18F23K22T-I/SO | Microchip Technology |
Description: IC MCU 8BIT 8KB FLASH 28SOIC Packaging: Cut Tape (CT) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 8KB (4K x 16) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 19x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
auf Bestellung 1255 Stücke: Lieferzeit 10-14 Tag (e) |
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DSPIC33CK64MP202-I/2N | Microchip Technology |
Description: IC MCU 16BIT 64KB FLASH 28UQFN Packaging: Tube Package / Case: 28-UQFN Exposed Pad Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC Data Converters: A/D 12x12b; D/A 3x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT Supplier Device Package: 28-UQFN (6x6) Number of I/O: 21 DigiKey Programmable: Not Verified |
auf Bestellung 305 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM120AM50CT1AG | Microchip Technology |
Description: SIC 2N-CH 1200V 55A SP1F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 2 N Channel (Phase Leg) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 245W (Tc) Drain to Source Voltage (Vdss): 1200V (1.2kV) Current - Continuous Drain (Id) @ 25°C: 55A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 1990pF @ 1000V Rds On (Max) @ Id, Vgs: 50mOhm @ 40A, 20V Gate Charge (Qg) (Max) @ Vgs: 137nC @ 20V Vgs(th) (Max) @ Id: 2.7V @ 1mA Supplier Device Package: SP1F Part Status: Active |
Produkt ist nicht verfügbar |
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MSCSM70AM19CT1AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP1F |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM120AM31CT1AG | Microchip Technology |
Description: SIC 2N-CH 1200V 89A SP1F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 2 N Channel (Phase Leg) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 395W (Tc) Drain to Source Voltage (Vdss): 1200V (1.2kV) Current - Continuous Drain (Id) @ 25°C: 89A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: SP1F |
Produkt ist nicht verfügbar |
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MSCSM70VM19C3AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP3F |
Produkt ist nicht verfügbar |
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.jpg "MSCSM120HM50CT3AG") |
MSCSM120HM50CT3AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP3F |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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.jpg "MSCSM120AM16CT1AG") |
MSCSM120AM16CT1AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP1F |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM120SKM11CT3AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Type: MOSFET Configuration: 1 Phase Voltage - Isolation: 4000Vrms Part Status: Active Current: 254 A Voltage: 1.2 kV |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM120DAM11CT3AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Type: MOSFET Configuration: 1 Phase Voltage - Isolation: 4000Vrms Current: 254 A Voltage: 1.2 kV |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM70HM19CT3AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP3F |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM70AM10CT3AG | Microchip Technology |
Description: SIC 2N-CH 700V 241A SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 2 N Channel (Phase Leg) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 690W (Tc) Drain to Source Voltage (Vdss): 700V Current - Continuous Drain (Id) @ 25°C: 241A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V Vgs(th) (Max) @ Id: 2.4V @ 8mA Supplier Device Package: SP3F Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM120HM31CT3AG | Microchip Technology |
Description: SIC 4N-CH 1200V 89A SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 4 N-Channel Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 395W (Tc) Drain to Source Voltage (Vdss): 1200V (1.2kV) Current - Continuous Drain (Id) @ 25°C: 89A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: SP3F Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM70VM10C4AG | Microchip Technology |
Description: PM-MOSFET-SIC-SBD~-SP4 Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 2 N Channel (Phase Leg) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 674W (Tc) Drain to Source Voltage (Vdss): 700V Current - Continuous Drain (Id) @ 25°C: 238A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V Vgs(th) (Max) @ Id: 2.4V @ 8mA Supplier Device Package: SP4 Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM70TAM19CT3AG | Microchip Technology |
Description: SIC 6N-CH 700V 124A SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 6 N-Channel (3-Phase Bridge) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 365W (Tc) Drain to Source Voltage (Vdss): 700V Current - Continuous Drain (Id) @ 25°C: 124A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 4500pF @ 700V Rds On (Max) @ Id, Vgs: 19mOhm @ 40A, 20V Gate Charge (Qg) (Max) @ Vgs: 215nC @ 20V Vgs(th) (Max) @ Id: 2.4V @ 4mA Supplier Device Package: SP3F |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM70AM07CT3AG | Microchip Technology |
Description: SIC 2N-CH 700V 353A SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 2 N Channel (Phase Leg) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 988W (Tc) Drain to Source Voltage (Vdss): 700V Current - Continuous Drain (Id) @ 25°C: 353A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 13500pF @ 700V Rds On (Max) @ Id, Vgs: 6.4mOhm @ 120A, 20V Gate Charge (Qg) (Max) @ Vgs: 645nC @ 20V Vgs(th) (Max) @ Id: 2.4V @ 12mA Supplier Device Package: SP3F |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM120TAM31CT3AG | Microchip Technology |
Description: SIC 6N-CH 1200V 89A SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 6 N-Channel (3-Phase Bridge) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 395W (Tc) Drain to Source Voltage (Vdss): 1200V (1.2kV) Current - Continuous Drain (Id) @ 25°C: 89A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: SP3F |
Produkt ist nicht verfügbar |
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MSCSM120AM11CT3AG | Microchip Technology |
Description: SIC 2N-CH 1200V 254A SP3F Packaging: Tube Package / Case: Module Mounting Type: Chassis Mount Configuration: 2 N Channel (Phase Leg) Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 1.067kW (Tc) Drain to Source Voltage (Vdss): 1200V (1.2kV) Current - Continuous Drain (Id) @ 25°C: 254A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 9060pF @ 1000V Rds On (Max) @ Id, Vgs: 10.4mOhm @ 120A, 20V Gate Charge (Qg) (Max) @ Vgs: 696nC @ 20V Vgs(th) (Max) @ Id: 2.8V @ 3mA Supplier Device Package: SP3F |
Produkt ist nicht verfügbar |
| SY88063CLMG-TR |
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Hersteller: Microchip Technology
Description: IC LIMITING AMP 16QFN
Description: IC LIMITING AMP 16QFN
Produkt ist nicht verfügbar
| SY88993ALKG-TR |
|
Hersteller: Microchip Technology
Description: IC LIMIT AMP 10MSOP
Description: IC LIMIT AMP 10MSOP
auf Bestellung 992 Stücke:
Lieferzeit 10-14 Tag (e)| SY88053CLMG-TR |
|
Hersteller: Microchip Technology
Description: IC LIMITING AMP 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Limiting Amplifier
Applications: Optical Networks
Supplier Device Package: 16-QFN (3x3)
Description: IC LIMITING AMP 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Limiting Amplifier
Applications: Optical Networks
Supplier Device Package: 16-QFN (3x3)
auf Bestellung 6998 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.07 EUR |
| 25+ | 13.38 EUR |
| 100+ | 12.16 EUR |
| DSC6122CI2A-00AVT |
|
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Description: MEMS OSC XO 1.71V-3.63V 4SMD
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| DSC6122CI2A-00AVT |
|
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Description: MEMS OSC XO 1.71V-3.63V 4SMD
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| DSC6021CI2A-009VT |
|
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 1.08 EUR |
| DSC6021CI2A-009VT |
|
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
auf Bestellung 1954 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.41 EUR |
| 25+ | 1.17 EUR |
| 100+ | 1.08 EUR |
| DSC6021CI2A-009V |
|
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 1.3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.43 EUR |
| DSC6122CI2A-00AV |
|
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
Description: MEMS OSC XO 1.71V-3.63V 4SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 3mA (Typ)
Frequency - Output 1: 74.1758MHz, 74.25MHz
Base Resonator: MEMS
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.44 EUR |
| JANS1N4468US |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1.5W D5A
Description: DIODE ZENER 13V 1.5W D5A
auf Bestellung 494 Stücke:
Lieferzeit 10-14 Tag (e)| JAN1N4468 |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1.5W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.4 V
Qualification: MIL-PRF-19500/406
Description: DIODE ZENER 13V 1.5W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.4 V
Qualification: MIL-PRF-19500/406
Produkt ist nicht verfügbar
| JAN1N5186 |
|
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 120 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
Description: DIODE GEN PURP 100V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 120 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
Produkt ist nicht verfügbar
| PL138-48OC-R |
|
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Produkt ist nicht verfügbar
| PL138-48OC-R |
|
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
auf Bestellung 389 Stücke:
Lieferzeit 10-14 Tag (e)| PIC18LF45K40-I/MV |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 40UQFN
Packaging: Tube
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 40-UQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 40UQFN
Packaging: Tube
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 40-UQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PIC18LF45K40T-I/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PIC18LF45K40T-I/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44QFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44QFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PIC18LF45K40-E/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44QFN
Packaging: Tube
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44QFN
Packaging: Tube
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PIC32MM0064GPL028-I/SS |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 2631 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.01 EUR |
| 25+ | 2.74 EUR |
| 100+ | 2.48 EUR |
| PIC32MM0064GPL028-E/SS |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 470 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.64 EUR |
| 25+ | 3.29 EUR |
| 100+ | 3.01 EUR |
| PIC32MM0064GPL028-E/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1891 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.41 EUR |
| 25+ | 3.11 EUR |
| 100+ | 2.8 EUR |
| PIC32MM0064GPL028-I/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.12 EUR |
| 25+ | 2.8 EUR |
| 100+ | 2.58 EUR |
| PIC32MM0064GPL028-E/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 22
Description: IC MCU 32BIT 64KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
| PIC32MM0064GPL028-I/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 22
Description: IC MCU 32BIT 64KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
| PIC32MM0064GPL028T-I/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28UQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 22
Description: IC MCU 32BIT 64KB FLASH 28UQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
| PIC32MM0064GPL028T-I/SS |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 22
Description: IC MCU 32BIT 64KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
| PIC32MM0064GPL028T-I/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 22
Description: IC MCU 32BIT 64KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
| PIC32MM0032GPL028-E/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 455 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.01 EUR |
| 25+ | 2.75 EUR |
| 100+ | 2.48 EUR |
| PIC32MM0032GPL028-I/SS |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.75 EUR |
| 25+ | 2.48 EUR |
| 100+ | 2.25 EUR |
| PIC32MM0032GPL028-I/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 457 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.8 EUR |
| 25+ | 2.58 EUR |
| 100+ | 2.3 EUR |
| PIC32MM0032GPL028-E/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.12 EUR |
| 25+ | 2.8 EUR |
| 100+ | 2.58 EUR |
| PIC32MM0032GPL028-I/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28UQFN
Description: IC MCU 32BIT 32KB FLASH 28UQFN
Produkt ist nicht verfügbar
| PIC32MM0032GPL028T-I/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28UQFN
Description: IC MCU 32BIT 32KB FLASH 28UQFN
Produkt ist nicht verfügbar
| PIC32MM0032GPL028T-I/SS |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Produkt ist nicht verfügbar
| PIC32MM0032GPL028T-I/ML |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28QFN
Description: IC MCU 32BIT 32KB FLASH 28QFN
Produkt ist nicht verfügbar
| PIC32MM0032GPL028-E/SS |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Produkt ist nicht verfügbar
| ATSAMG55G19B-UNT |
|
Hersteller: Microchip Technology
Description: WLCSP MRL B 105C TEMP T&R
Description: WLCSP MRL B 105C TEMP T&R
Produkt ist nicht verfügbar
| PIC32MM0256GPM028-I/M6 |
|
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x10/12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: IrDA, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 585 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 4.29 EUR |
| 25+ | 3.9 EUR |
| 100+ | 3.53 EUR |
| MCP14E4-E/SN |
|
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 18V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, N-Channel, P-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4A, 4A
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 18V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, N-Channel, P-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4A, 4A
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 711 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 4.03 EUR |
| 25+ | 3.36 EUR |
| 100+ | 3.07 EUR |
| SST25VF010A-33-4C-QAE |
|
Hersteller: Microchip Technology
Description: IC FLASH 1MBIT SPI 33MHZ 8WSON
Packaging: Tube
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 33 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON
Part Status: Active
Write Cycle Time - Word, Page: 20µs
Memory Interface: SPI
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1MBIT SPI 33MHZ 8WSON
Packaging: Tube
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 33 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON
Part Status: Active
Write Cycle Time - Word, Page: 20µs
Memory Interface: SPI
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SST25VF010A-33-4I-ZAE |
|
Hersteller: Microchip Technology
Description: IC FLASH 1MBIT SPI 33MHZ 8CSP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, CSPBGA
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 33 MHz
Memory Format: FLASH
Supplier Device Package: 8-CSP
Part Status: Active
Write Cycle Time - Word, Page: 20µs
Memory Interface: SPI
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1MBIT SPI 33MHZ 8CSP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, CSPBGA
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 33 MHz
Memory Format: FLASH
Supplier Device Package: 8-CSP
Part Status: Active
Write Cycle Time - Word, Page: 20µs
Memory Interface: SPI
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PIC18F23K22T-I/SO |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PIC18F23K22T-I/SO |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 1255 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.66 EUR |
| 25+ | 4.27 EUR |
| 100+ | 3.94 EUR |
| DSPIC33CK64MP202-I/2N |
|
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 3x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 28-UQFN (6x6)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 28UQFN
Packaging: Tube
Package / Case: 28-UQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 3x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 28-UQFN (6x6)
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 305 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.02 EUR |
| 25+ | 4.6 EUR |
| 100+ | 4.16 EUR |
| MSCSM120AM50CT1AG |
|
Hersteller: Microchip Technology
Description: SIC 2N-CH 1200V 55A SP1F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 245W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 1990pF @ 1000V
Rds On (Max) @ Id, Vgs: 50mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 137nC @ 20V
Vgs(th) (Max) @ Id: 2.7V @ 1mA
Supplier Device Package: SP1F
Part Status: Active
Description: SIC 2N-CH 1200V 55A SP1F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 245W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 1990pF @ 1000V
Rds On (Max) @ Id, Vgs: 50mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 137nC @ 20V
Vgs(th) (Max) @ Id: 2.7V @ 1mA
Supplier Device Package: SP1F
Part Status: Active
Produkt ist nicht verfügbar
| MSCSM70AM19CT1AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP1F
Description: PM-MOSFET-SIC-SBD~-SP1F
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 218.77 EUR |
| MSCSM120AM31CT1AG |
|
Hersteller: Microchip Technology
Description: SIC 2N-CH 1200V 89A SP1F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 395W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: SP1F
Description: SIC 2N-CH 1200V 89A SP1F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 395W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: SP1F
Produkt ist nicht verfügbar
| MSCSM70VM19C3AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP3F
Description: PM-MOSFET-SIC-SBD~-SP3F
Produkt ist nicht verfügbar
| MSCSM120HM50CT3AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP3F
Description: PM-MOSFET-SIC-SBD~-SP3F
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| MSCSM120AM16CT1AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP1F
Description: PM-MOSFET-SIC-SBD~-SP1F
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 416.19 EUR |
| MSCSM120SKM11CT3AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Type: MOSFET
Configuration: 1 Phase
Voltage - Isolation: 4000Vrms
Part Status: Active
Current: 254 A
Voltage: 1.2 kV
Description: PM-MOSFET-SIC-SBD~-SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Type: MOSFET
Configuration: 1 Phase
Voltage - Isolation: 4000Vrms
Part Status: Active
Current: 254 A
Voltage: 1.2 kV
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 412.44 EUR |
| MSCSM120DAM11CT3AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Type: MOSFET
Configuration: 1 Phase
Voltage - Isolation: 4000Vrms
Current: 254 A
Voltage: 1.2 kV
Description: PM-MOSFET-SIC-SBD~-SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Type: MOSFET
Configuration: 1 Phase
Voltage - Isolation: 4000Vrms
Current: 254 A
Voltage: 1.2 kV
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 423.74 EUR |
| MSCSM70HM19CT3AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP3F
Description: PM-MOSFET-SIC-SBD~-SP3F
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 463.36 EUR |
| MSCSM70AM10CT3AG |
|
Hersteller: Microchip Technology
Description: SIC 2N-CH 700V 241A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 690W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 241A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA
Supplier Device Package: SP3F
Part Status: Active
Description: SIC 2N-CH 700V 241A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 690W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 241A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA
Supplier Device Package: SP3F
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 412.3 EUR |
| MSCSM120HM31CT3AG |
Hersteller: Microchip Technology
Description: SIC 4N-CH 1200V 89A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 4 N-Channel
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 395W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: SP3F
Part Status: Active
Description: SIC 4N-CH 1200V 89A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 4 N-Channel
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 395W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: SP3F
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 439.4 EUR |
| MSCSM70VM10C4AG |
|
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD~-SP4
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 674W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 238A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA
Supplier Device Package: SP4
Part Status: Active
Description: PM-MOSFET-SIC-SBD~-SP4
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 674W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 238A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA
Supplier Device Package: SP4
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 548.12 EUR |
| MSCSM70TAM19CT3AG |
|
Hersteller: Microchip Technology
Description: SIC 6N-CH 700V 124A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (3-Phase Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 365W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 124A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 4500pF @ 700V
Rds On (Max) @ Id, Vgs: 19mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 215nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 4mA
Supplier Device Package: SP3F
Description: SIC 6N-CH 700V 124A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (3-Phase Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 365W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 124A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 4500pF @ 700V
Rds On (Max) @ Id, Vgs: 19mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 215nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 4mA
Supplier Device Package: SP3F
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 591.38 EUR |
| MSCSM70AM07CT3AG |
|
Hersteller: Microchip Technology
Description: SIC 2N-CH 700V 353A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 988W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 353A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 13500pF @ 700V
Rds On (Max) @ Id, Vgs: 6.4mOhm @ 120A, 20V
Gate Charge (Qg) (Max) @ Vgs: 645nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 12mA
Supplier Device Package: SP3F
Description: SIC 2N-CH 700V 353A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 988W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 353A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 13500pF @ 700V
Rds On (Max) @ Id, Vgs: 6.4mOhm @ 120A, 20V
Gate Charge (Qg) (Max) @ Vgs: 645nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 12mA
Supplier Device Package: SP3F
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 597.33 EUR |
| MSCSM120TAM31CT3AG |
|
Hersteller: Microchip Technology
Description: SIC 6N-CH 1200V 89A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (3-Phase Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 395W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: SP3F
Description: SIC 6N-CH 1200V 89A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (3-Phase Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 395W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: SP3F
Produkt ist nicht verfügbar
| MSCSM120AM11CT3AG |
|
Hersteller: Microchip Technology
Description: SIC 2N-CH 1200V 254A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 1.067kW (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 254A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9060pF @ 1000V
Rds On (Max) @ Id, Vgs: 10.4mOhm @ 120A, 20V
Gate Charge (Qg) (Max) @ Vgs: 696nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 3mA
Supplier Device Package: SP3F
Description: SIC 2N-CH 1200V 254A SP3F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 1.067kW (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 254A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9060pF @ 1000V
Rds On (Max) @ Id, Vgs: 10.4mOhm @ 120A, 20V
Gate Charge (Qg) (Max) @ Vgs: 696nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 3mA
Supplier Device Package: SP3F
Produkt ist nicht verfügbar