Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35030) > Seite 79 nach 584
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BC547B,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: TO-92-3 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 500 mW |
Produkt ist nicht verfügbar |
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BC547C,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: TO-92-3 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 500 mW |
Produkt ist nicht verfügbar |
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BC556B,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: TO-92-3 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 65 V Power - Max: 500 mW |
Produkt ist nicht verfügbar |
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BC557B,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: TO-92-3 Part Status: Obsolete Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 500 mW |
Produkt ist nicht verfügbar |
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MC908QB8CDWER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QG4CPBE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC908QY4MDWER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Obsolete Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908QY2AVDWER | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33591FTAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33591FTAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33592FTAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33592FTAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33593FTAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 7.8mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33593FTAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 7.8mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33594FTAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC908JL16CFJER | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC68HC705L5FUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: EPROM, UV Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V Connectivity: SPI Peripherals: LCD, POR, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCR908JK1ECDWER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Part Status: Not For New Designs Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC3PHACVFAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: Serial Operating Temperature: -40°C ~ 105°C (TA) Output Configuration: Pre-Driver - Half Bridge (3) Voltage - Supply: 4.5V ~ 5.5V Applications: General Purpose Technology: IGBT Supplier Device Package: 32-LQFP (7x7) Motor Type - AC, DC: AC, Synchronous Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68HC11A1MFNE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11A1MFNER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711D3VFNE2 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08QG8CDTER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Verified |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC705X32MFUE4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 32KB (32K x 8) RAM Size: 528 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 256 x 8 Core Processor: HC05 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI Peripherals: POR, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHC705B16NVFNE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC705B16NCFNER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 15KB (15K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 256 x 8 Core Processor: HC05 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12C96CFUER | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S12GC128MFAE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S12DP512CPVER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 512KB (512K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC68HC16Z1VEH16 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU16 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68SEC000AA16R2 | NXP USA Inc. |
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MC912DG128ACPVER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 69 DigiKey Programmable: Not Verified |
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MC9S12H256VFVER | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S12C128CFAE | NXP USA Inc. |
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auf Bestellung 1005 Stücke: Lieferzeit 10-14 Tag (e) |
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MRFG35002N6R5 | NXP USA Inc. |
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MRFG35010ANR5 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ NI360HF Packaging: Tape & Reel (TR) Package / Case: NI-360HF Mounting Type: Chassis Mount Frequency: 3.55GHz Power - Output: 1W Gain: 10dB Technology: pHEMT FET Supplier Device Package: NI-360HF Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 130 mA |
Produkt ist nicht verfügbar |
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MC908QB8CDWER | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Verified |
auf Bestellung 2748 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908QY4MDWER | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Obsolete Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908JL16CFJER | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S08QG8CDTER | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Verified |
auf Bestellung 9644 Stücke: Lieferzeit 10-14 Tag (e) |
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MC705X32MFUE4R | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 32KB (32K x 8) RAM Size: 528 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 256 x 8 Core Processor: HC05 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI Peripherals: POR, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12C96CFUER | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S12DP512CPVER | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 512KB (512K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Verified |
auf Bestellung 193 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68SEC000AA16R2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC912DG128ACPVER | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 69 DigiKey Programmable: Not Verified |
auf Bestellung 347 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S12H256VFVER | NXP USA Inc. |
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MRFG35002N6R5 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MRFG35010ANR5 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ NI360HF Packaging: Cut Tape (CT) Package / Case: NI-360HF Mounting Type: Chassis Mount Frequency: 3.55GHz Power - Output: 1W Gain: 10dB Technology: pHEMT FET Supplier Device Package: NI-360HF Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 130 mA |
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MC9S12C96CFUER | NXP USA Inc. |
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DSP56301VF80 | NXP USA Inc. |
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DSP56301VF80B1 | NXP USA Inc. |
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DSP56303VF100B1 | NXP USA Inc. |
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DSP56303VF100R2 | NXP USA Inc. |
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DSP56303VL100B1 | NXP USA Inc. |
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DSP56311VF150B1 | NXP USA Inc. |
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DSP56311VF150R2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 196-LBGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 100°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 384KB Voltage - I/O: 3.30V Voltage - Core: 1.80V Clock Rate: 150MHz Supplier Device Package: 196-LBGA (15x15) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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DSP56321VF200R2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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DSP56321VF275 | NXP USA Inc. |
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auf Bestellung 378 Stücke: Lieferzeit 10-14 Tag (e) |
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DSPB56367AG150 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Interface: Host Interface, I2C, SAI, SPI Type: Audio Processor Operating Temperature: 0°C ~ 70°C (TA) Non-Volatile Memory: ROM (240kB) On-Chip RAM: 69kB Voltage - I/O: 3.30V Voltage - Core: 1.80V Clock Rate: 150MHz Supplier Device Package: 144-LQFP (20x20) |
Produkt ist nicht verfügbar |
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DSPB56371AF180 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
BC547B,112 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Description: TRANS NPN 45V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
BC547C,112 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Description: TRANS NPN 45V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
BC556B,112 |
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Hersteller: NXP USA Inc.
Description: TRANS PNP 65V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 500 mW
Description: TRANS PNP 65V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
BC557B,112 |
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Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Description: TRANS PNP 45V 0.1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
MC908QB8CDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 6.72 EUR |
2000+ | 6.47 EUR |
MC9S08QG4CPBE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Description: IC MCU 8BIT 4KB FLASH 16DIP
Produkt ist nicht verfügbar
MC908QY4MDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QY2AVDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Produkt ist nicht verfügbar
MC33591FTAE |
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Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33591FTAER2 |
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Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33592FTAE |
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Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33592FTAER2 |
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Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33593FTAE |
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Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33593FTAER2 |
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Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33594FTAER2 |
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Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC908JL16CFJER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
MC68HC705L5FUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB EPROM/UV 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EPROM, UV
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
Connectivity: SPI
Peripherals: LCD, POR, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB EPROM/UV 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EPROM, UV
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
Connectivity: SPI
Peripherals: LCD, POR, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCR908JK1ECDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC3PHACVFAE |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Serial
Operating Temperature: -40°C ~ 105°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: IGBT
Supplier Device Package: 32-LQFP (7x7)
Motor Type - AC, DC: AC, Synchronous
Part Status: Obsolete
Description: IC MOTOR DRIVER 4.5V-5.5V 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Serial
Operating Temperature: -40°C ~ 105°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: IGBT
Supplier Device Package: 32-LQFP (7x7)
Motor Type - AC, DC: AC, Synchronous
Part Status: Obsolete
Produkt ist nicht verfügbar
MC68HC11A1MFNE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC11A1MFNER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC711D3VFNE2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08QG8CDTER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5000+ | 4.06 EUR |
MC705X32MFUE4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 528 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI
Peripherals: POR, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 528 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI
Peripherals: POR, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCHC705B16NVFNE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Description: IC MCU 8BIT 15KB OTP 52PLCC
Produkt ist nicht verfügbar
MC705B16NCFNER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12C96CFUER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Description: IC MCU 16BIT 96KB FLASH 80QFP
Produkt ist nicht verfügbar
MC9S12GC128MFAE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Produkt ist nicht verfügbar
MC9S12DP512CPVER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
MC68HC16Z1VEH16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68SEC000AA16R2 |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Description: IC MPU M680X0 16MHZ 64QFP
Produkt ist nicht verfügbar
MC912DG128ACPVER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12H256VFVER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
MC9S12C128CFAE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Description: IC MCU 16BIT 128KB FLASH 48LQFP
auf Bestellung 1005 Stücke:
Lieferzeit 10-14 Tag (e)MRFG35010ANR5 |
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ NI360HF
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Description: FET RF 15V 3.55GHZ NI360HF
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
MC908QB8CDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2748 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 11.83 EUR |
10+ | 9.3 EUR |
100+ | 7.7 EUR |
MC908QY4MDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908JL16CFJER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
MC9S08QG8CDTER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
auf Bestellung 9644 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.4 EUR |
10+ | 6.56 EUR |
100+ | 5.38 EUR |
500+ | 5.26 EUR |
1000+ | 4.44 EUR |
2500+ | 4.22 EUR |
MC705X32MFUE4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 528 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI
Peripherals: POR, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 528 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI
Peripherals: POR, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12C96CFUER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Description: IC MCU 16BIT 96KB FLASH 80QFP
Produkt ist nicht verfügbar
MC9S12DP512CPVER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
auf Bestellung 193 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 84.87 EUR |
10+ | 68.85 EUR |
100+ | 59.78 EUR |
MC68SEC000AA16R2 |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Description: IC MPU M680X0 16MHZ 64QFP
Produkt ist nicht verfügbar
MC912DG128ACPVER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 347 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 113.19 EUR |
10+ | 92.46 EUR |
100+ | 83.52 EUR |
MC9S12H256VFVER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
MRFG35010ANR5 |
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ NI360HF
Packaging: Cut Tape (CT)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Description: FET RF 15V 3.55GHZ NI360HF
Packaging: Cut Tape (CT)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
MC9S12C96CFUER |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Description: IC MCU 16BIT 96KB FLASH 80QFP
Produkt ist nicht verfügbar
DSP56301VF80 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 80MHZ 252-BGA
Description: IC DSP 24BIT 80MHZ 252-BGA
Produkt ist nicht verfügbar
DSP56301VF80B1 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 80MHZ 252-BGA
Description: IC DSP 24BIT 80MHZ 252-BGA
Produkt ist nicht verfügbar
DSP56303VF100B1 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-BGA
Description: IC DSP 24BIT 100MHZ 196-BGA
Produkt ist nicht verfügbar
DSP56303VF100R2 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-BGA
Description: IC DSP 24BIT 100MHZ 196-BGA
Produkt ist nicht verfügbar
DSP56303VL100B1 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-BGA
Description: IC DSP 24BIT 100MHZ 196-BGA
Produkt ist nicht verfügbar
DSP56311VF150B1 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 196-BGA
Description: IC DSP 24BIT 150MHZ 196-BGA
Produkt ist nicht verfügbar
DSP56311VF150R2 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 196-BGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 384KB
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 150MHz
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Description: IC DSP 24BIT 150MHZ 196-BGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 384KB
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 150MHz
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Produkt ist nicht verfügbar
DSP56321VF200R2 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 200MHZ 196MAPBGA
Description: IC DSP 24BIT 200MHZ 196MAPBGA
Produkt ist nicht verfügbar
DSP56321VF275 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 275MHZ 196MAPBGA
Description: IC DSP 24BIT 275MHZ 196MAPBGA
auf Bestellung 378 Stücke:
Lieferzeit 10-14 Tag (e)DSPB56367AG150 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 144-LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (240kB)
On-Chip RAM: 69kB
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 150MHz
Supplier Device Package: 144-LQFP (20x20)
Description: IC DSP 24BIT 150MHZ 144-LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (240kB)
On-Chip RAM: 69kB
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 150MHz
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
DSPB56371AF180 |
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Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 180MHZ 80-LQFP
Description: IC DSP 24BIT 180MHZ 80-LQFP
Produkt ist nicht verfügbar