Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35021) > Seite 454 nach 584
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BZB84-C6V8,215 | NXP USA Inc. | Description: NOW NEXPERIA BZB84-C6V8 - ZENER |
Produkt ist nicht verfügbar |
||||||||||||||||||
BZB84-C39,215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C39 - ZENER D Tolerance: ±5% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 39 V Impedance (Max) (Zzt): 130 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V |
auf Bestellung 13644 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
BGD702N,112 | NXP USA Inc. | Description: IC AMP CATV SOT115J |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
BZA862AVL,115 | NXP USA Inc. |
Description: TVS DIODE 6.2VWM SOT353 Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Type: Zener Applications: General Purpose Capacitance @ Frequency: 200pF @ 1MHz Voltage - Reverse Standoff (Typ): 6.2V Supplier Device Package: SOT-353 Unidirectional Channels: 4 Power - Peak Pulse: 6W Power Line Protection: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||||||||
BZA862AVL,115 | NXP USA Inc. |
Description: TVS DIODE 6.2VWM SOT353 Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Type: Zener Applications: General Purpose Capacitance @ Frequency: 200pF @ 1MHz Voltage - Reverse Standoff (Typ): 6.2V Supplier Device Package: SOT-353 Unidirectional Channels: 4 Power - Peak Pulse: 6W Power Line Protection: No Part Status: Obsolete |
auf Bestellung 134158 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
BGE788C,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J Packaging: Tube Package / Case: SOT-115J Output Type: Push-Pull Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Part Status: Obsolete Number of Circuits: 1 Current - Supply: 305 mA |
auf Bestellung 27551 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MF1P2101DUF/02V | NXP USA Inc. | Description: MIFARE PLUS EV1 |
Produkt ist nicht verfügbar |
||||||||||||||||||
MF1P4131DUD/02V | NXP USA Inc. | Description: MIFARE PLUS EV1 |
Produkt ist nicht verfügbar |
||||||||||||||||||
MF1P2101DUD/02V | NXP USA Inc. | Description: MIFARE PLUS EV1 |
Produkt ist nicht verfügbar |
||||||||||||||||||
MC908AP64CFAE,557 | NXP USA Inc. | Description: MICROCONTROLLER, 8 BIT, HC08/S08 |
Produkt ist nicht verfügbar |
||||||||||||||||||
BLF184XR112 | NXP USA Inc. |
Description: RF MOSFET LDMOS Packaging: Bulk |
auf Bestellung 80 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
PCA9614DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOP Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400kHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 7 pF |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
PCA9614DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOP Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400kHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 7 pF |
auf Bestellung 8459 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74AXP1G06GNH | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSON Features: Open Drain Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: -, 8mA Number of Inputs: 1 Supplier Device Package: 6-XSON (0.9x1) Input Logic Level - High: 1.6V Input Logic Level - Low: 0.7V Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
auf Bestellung 159500 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74AUP1G06GN,132 | NXP USA Inc. | Description: IC INVERTER OD 1CH 1-INP 6XSON |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74AUP1G06GFH | NXP USA Inc. | Description: IC INVERTER OD 1CH 1-INP 6XSON |
auf Bestellung 14656 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74AUP2G06GF,132 | NXP USA Inc. | Description: IC INVERTER OD 2CH 2-INP 6XSON |
auf Bestellung 96533 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MCF54418CMJ250R | NXP USA Inc. | Description: IC MCU 32BIT ROMLESS 256MAPBGA |
Produkt ist nicht verfügbar |
||||||||||||||||||
S912XDT384J1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 384KB (384K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||
S912XDT384J1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 384KB (384K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||
S912XDT384J1MALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 384KB (384K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||
LPC54S018JET180K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 945 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MKV31F256VLL12 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
||||||||||||||||||
LH7A404N0F092B3;55 | NXP USA Inc. | Description: IC MCU 32BIT ROMLESS 324LFBGA |
auf Bestellung 246 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
PDTD1113ET215 | NXP USA Inc. | Description: SMALL SIGNAL BIPOLAR TRANSISTOR |
Produkt ist nicht verfügbar |
||||||||||||||||||
A2T18S260W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Power - Output: 280W Gain: 18.7dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
Produkt ist nicht verfügbar |
||||||||||||||||||
BAT54/6215 | NXP USA Inc. | Description: RECTIFIER DIODE, SCHOTTKY |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MPC8321VRAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ PBGA516 Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
LS1027AXN7HNA | NXP USA Inc. |
Description: LS1027A-800 XT NO SEC Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||||
BAP50-04,215 | NXP USA Inc. |
Description: SILICON PIN DIODE Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: PIN - 1 Pair Series Connection Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz Resistance @ If, F: 5Ohm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Current - Max: 50 mA Power Dissipation (Max): 250 mW |
auf Bestellung 21195 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MC68EN360VR25VL | NXP USA Inc. | Description: IC MPU M683XX 25MHZ 357BGA |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
NX3008NBKT115 | NXP USA Inc. |
Description: SMALL SIGNAL FET Packaging: Bulk Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 350mA (Ta) Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V Power Dissipation (Max): 250mW (Ta), 770mW (Tc) Vgs(th) (Max) @ Id: 1.1V @ 250µA Supplier Device Package: SC-75 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V |
auf Bestellung 217719 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
TJA1442BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
TJA1442BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 11857 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
NCF2951BTT/T0E081J | NXP USA Inc. | Description: IC ACTIC 4G 3D 38TSSOP |
Produkt ist nicht verfügbar |
||||||||||||||||||
BGM1014,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP |
Produkt ist nicht verfügbar |
||||||||||||||||||
TL431ASDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 1% TO236AB Packaging: Cut Tape (CT) Tolerance: ±1% Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Part Status: Obsolete Current - Cathode: 600 µA Current - Output: 100 mA Voltage - Output (Max): 36 V Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
||||||||||||||||||
MMPF0100F5AZESR2 | NXP USA Inc. | Description: IC REG CONV I.MX6 12OUT 56QFN |
Produkt ist nicht verfügbar |
||||||||||||||||||
K32W061K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2439 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
PXT4403115 | NXP USA Inc. | Description: NOW NEXPERIA SMALL SIGNAL BIPOLA |
Produkt ist nicht verfügbar |
||||||||||||||||||
S9S12ZVLS1F0VFM | NXP USA Inc. | Description: IC MCU 16BIT 16KB FLASH 32QFN |
Produkt ist nicht verfügbar |
||||||||||||||||||
PCA9538PW/Q900,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP Packaging: Bulk Features: POR Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 261 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
BZA862AL,115 | NXP USA Inc. |
Description: TVS DIODE 6.2VWM 5TSSOP Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Type: Zener Applications: General Purpose Capacitance @ Frequency: 200pF @ 1MHz Voltage - Reverse Standoff (Typ): 6.2V Supplier Device Package: SOT-353 Unidirectional Channels: 4 Power - Peak Pulse: 15W Power Line Protection: No |
auf Bestellung 17108 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
PCA24S08AD,118 | NXP USA Inc. |
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 8Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 1K x 8 DigiKey Programmable: Not Verified |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||||
S912ZVMC64F3WKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||
74LVT00PW,118 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Current - Output High, Low: 20mA, 32mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 4 |
auf Bestellung 992 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74LVT00PW,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Current - Output High, Low: 20mA, 32mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 4 |
auf Bestellung 1608 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MC68SEC000CAA16 | NXP USA Inc. |
Description: IC MPU M680X0 16MHZ 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-QFP (14x14) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
auf Bestellung 1544 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
RDGD31603PSMKEVM | NXP USA Inc. |
Description: 3-PH REF DESIGN GD3160 Packaging: Box Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 6-Channel (Hex) Embedded: Yes, MCU |
Produkt ist nicht verfügbar |
||||||||||||||||||
RDGD31603PHSEVM | NXP USA Inc. | Description: 3-PHASE REF DESIGN VE-TRAC GD316 |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74AHCT123APW-Q100118 | NXP USA Inc. | Description: IC MULTIVIBRATOR |
Produkt ist nicht verfügbar |
||||||||||||||||||
TJA1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
TJA1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 11619 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MPC885CVR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
MPC875VR66-NXP | NXP USA Inc. |
Description: IC MPU 66MHZ 256BGA Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74AHC164D112 | NXP USA Inc. | Description: NOW NEXPERIA 74AHC164D - SERIAL |
Produkt ist nicht verfügbar |
||||||||||||||||||
TEA2206T/1J | NXP USA Inc. |
Description: IC ACTIVE BRIDGE CTRL SO8 Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 8-SO Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||||
TEA2206T/1J | NXP USA Inc. |
Description: IC ACTIVE BRIDGE CTRL SO8 Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 8-SO Part Status: Active |
auf Bestellung 4751 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74ABT162244DGG,112 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 5.5V 48TSSOP Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 12mA Supplier Device Package: 48-TSSOP Part Status: Active |
auf Bestellung 2482 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
74ABT162245ADL112 | NXP USA Inc. | Description: NOW NEXPERIA 74ABT162245ADL - BU |
auf Bestellung 816 Stücke: Lieferzeit 10-14 Tag (e) |
|
BZB84-C6V8,215 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C6V8 - ZENER
Description: NOW NEXPERIA BZB84-C6V8 - ZENER
Produkt ist nicht verfügbar
BZB84-C39,215 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C39 - ZENER D
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Description: NOW NEXPERIA BZB84-C39 - ZENER D
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
auf Bestellung 13644 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11632+ | 0.048 EUR |
BGD702N,112 |
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Description: IC AMP CATV SOT115J
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 54.27 EUR |
BZA862AVL,115 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
BZA862AVL,115 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM SOT353
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Description: TVS DIODE 6.2VWM SOT353
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
auf Bestellung 134158 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3806+ | 0.13 EUR |
BGE788C,112 |
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 305 mA
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 305 mA
auf Bestellung 27551 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 41.75 EUR |
MC908AP64CFAE,557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Produkt ist nicht verfügbar
PCA9614DPZ |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 3.03 EUR |
5000+ | 2.92 EUR |
PCA9614DPZ |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 8459 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.04 EUR |
10+ | 5.42 EUR |
25+ | 5.13 EUR |
100+ | 4.44 EUR |
250+ | 4.22 EUR |
500+ | 3.78 EUR |
1000+ | 3.19 EUR |
74AXP1G06GNH |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Features: Open Drain
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC INVERTER OD 1CH 1-INP 6XSON
Features: Open Drain
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 159500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2002+ | 0.25 EUR |
74AUP1G06GN,132 |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2179+ | 0.23 EUR |
74AUP1G06GFH |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 14656 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1697+ | 0.29 EUR |
74AUP2G06GF,132 |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP 6XSON
Description: IC INVERTER OD 2CH 2-INP 6XSON
auf Bestellung 96533 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2036+ | 0.25 EUR |
MCF54418CMJ250R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
S912XDT384J1MAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XDT384J1VAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XDT384J1MALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54S018JET180K |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 945 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.54 EUR |
10+ | 16.41 EUR |
189+ | 13.86 EUR |
567+ | 13.77 EUR |
945+ | 13 EUR |
MKV31F256VLL12 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
LH7A404N0F092B3;55 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Description: IC MCU 32BIT ROMLESS 324LFBGA
auf Bestellung 246 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
18+ | 23.89 EUR |
PDTD1113ET215 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
A2T18S260W12NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
BAT54/6215 |
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
18000+ | 0.036 EUR |
MPC8321VRAFDCA |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 65.17 EUR |
LS1027AXN7HNA |
Hersteller: NXP USA Inc.
Description: LS1027A-800 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Description: LS1027A-800 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
BAP50-04,215 |
Hersteller: NXP USA Inc.
Description: SILICON PIN DIODE
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
Description: SILICON PIN DIODE
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
auf Bestellung 21195 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2464+ | 0.2 EUR |
MC68EN360VR25VL |
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 214.43 EUR |
NX3008NBKT115 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
auf Bestellung 217719 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9616+ | 0.049 EUR |
TJA1442BT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.18 EUR |
TJA1442BT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 11857 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 1.97 EUR |
10+ | 1.77 EUR |
25+ | 1.67 EUR |
100+ | 1.43 EUR |
250+ | 1.34 EUR |
500+ | 1.18 EUR |
NCF2951BTT/T0E081J |
Hersteller: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
BGM1014,115 |
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Produkt ist nicht verfügbar
TL431ASDT,215 |
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MMPF0100F5AZESR2 |
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Description: IC REG CONV I.MX6 12OUT 56QFN
Produkt ist nicht verfügbar
K32W061K |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2439 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.31 EUR |
10+ | 8.53 EUR |
25+ | 7.75 EUR |
80+ | 6.98 EUR |
230+ | 6.82 EUR |
PXT4403115 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
S9S12ZVLS1F0VFM |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Description: IC MCU 16BIT 16KB FLASH 32QFN
Produkt ist nicht verfügbar
PCA9538PW/Q900,118 |
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 261 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
261+ | 2.22 EUR |
BZA862AL,115 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
Description: TVS DIODE 6.2VWM 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
auf Bestellung 17108 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4438+ | 0.11 EUR |
PCA24S08AD,118 |
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)S912ZVMC64F3WKH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVT00PW,118 |
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 992 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
992+ | 0.59 EUR |
74LVT00PW,112 |
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 1608 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
902+ | 0.54 EUR |
MC68SEC000CAA16 |
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 1544 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
12+ | 48 EUR |
RDGD31603PSMKEVM |
Hersteller: NXP USA Inc.
Description: 3-PH REF DESIGN GD3160
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Description: 3-PH REF DESIGN GD3160
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
RDGD31603PHSEVM |
Hersteller: NXP USA Inc.
Description: 3-PHASE REF DESIGN VE-TRAC GD316
Description: 3-PHASE REF DESIGN VE-TRAC GD316
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1756.44 EUR |
74AHCT123APW-Q100118 |
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
TJA1441BTK/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1 EUR |
TJA1441BTK/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 11619 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.5 EUR |
10+ | 2.22 EUR |
25+ | 2.11 EUR |
100+ | 1.73 EUR |
250+ | 1.62 EUR |
500+ | 1.43 EUR |
1000+ | 1.13 EUR |
2500+ | 1.06 EUR |
MPC885CVR66 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 97.41 EUR |
MPC875VR66-NXP |
Hersteller: NXP USA Inc.
Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 62.5 EUR |
74AHC164D112 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC164D - SERIAL
Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
TEA2206T/1J |
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
TEA2206T/1J |
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4751 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.75 EUR |
10+ | 7.85 EUR |
25+ | 7.43 EUR |
100+ | 6.44 EUR |
250+ | 6.11 EUR |
500+ | 5.48 EUR |
1000+ | 4.62 EUR |
74ABT162244DGG,112 |
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Active
Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Active
auf Bestellung 2482 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
644+ | 0.76 EUR |
74ABT162245ADL112 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ABT162245ADL - BU
Description: NOW NEXPERIA 74ABT162245ADL - BU
auf Bestellung 816 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
512+ | 1.02 EUR |