Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 456 nach 591
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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FRDMGD3160DSBHB | NXP USA Inc. |
Description: GD3160 HALF-BRIDGE EVAL KIT Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Secondary Attributes: Graphical User Interface (GUI) Embedded: Yes, MCU, 32-Bit |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA2771,115 | NXP USA Inc. |
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 20MHz ~ 2.5GHz RF Type: ISM Voltage - Supply: 3V ~ 4V Gain: 21.4dB Current - Supply: 33.3mA Noise Figure: 4.5dB P1dB: 12.1dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74AUP2G07GX147 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6X2SON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-X2SON (1.0x0.8) Part Status: Active |
auf Bestellung 80000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT162245ADL653 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V Packaging: Bulk Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Part Status: Active |
Produkt ist nicht verfügbar |
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LPC11E67JBD48K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 1060 Stücke: Lieferzeit 10-14 Tag (e) |
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SCIMX6S6AVM083C | NXP USA Inc. |
Description: I.MX 6 SERIES 32-BIT MPU ARM COR Packaging: Tray |
Produkt ist nicht verfügbar |
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8CH-DMIC | NXP USA Inc. |
Description: SPH0641lM4H MICROPHONE BOARD Packaging: Box Function: Microphone Type: Audio Utilized IC / Part: SPH0641LM4H-1 Supplied Contents: Board(s) Primary Attributes: 8-Channel (Octal) Embedded: Yes Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836TD/21P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.1V 300MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.1V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.2V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 21000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/22P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.2V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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P1014NSE5HFB557 | NXP USA Inc. |
Description: QORIQ RISC MICROPROCESSOR 32-BI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLS8962AFR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-16G 10DFN Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Mounting Type: Surface Mount Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Supplier Device Package: 10-DFN (2x2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FXLS8962AFR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-16G 10DFN Packaging: Cut Tape (CT) Package / Case: 10-VFDFN Mounting Type: Surface Mount Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Supplier Device Package: 10-DFN (2x2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PEMI8QFN/LP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/18.5PF SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 19dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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BF1102,115 | NXP USA Inc. | Description: FET RF 7V 800MHZ 6TSSOP |
auf Bestellung 5780 Stücke: Lieferzeit 10-14 Tag (e) |
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A2I09VD015GNR1 | NXP USA Inc. |
Description: IC AMP GPS 575-960MHZ TO270WBG Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 575MHz ~ 960MHz RF Type: General Purpose Voltage - Supply: 48V ~ 55V Gain: 34dB Current - Supply: 84mA Test Frequency: 920MHz Supplier Device Package: TO-270WBG-15 |
Produkt ist nicht verfügbar |
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MC33FS6510NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC07XSF517BEK | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 54HSOP |
Produkt ist nicht verfügbar |
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P5040NSE72QC | NXP USA Inc. | Description: QORIQ, 64-BIT POWER ARCH SOC, 4 |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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T2081NSE8PTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Bulk Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G20LS-180RN112 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BLF6G10LS-160RN112 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G10LS-135RN112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT502 Packaging: Bulk Part Status: Active |
auf Bestellung 92 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6S5EVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 295 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F27D,623 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 3 |
auf Bestellung 22500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1463AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJA1463AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2479 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85063TP-ARD | NXP USA Inc. |
Description: RTC W/ CAL&ALARM EVAL BOARD Packaging: Box Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF85063TP Platform: Arduino Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATT1/AZ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 10TSSOP Features: Alarm, Leap Year, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATT1/AZ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 10TSSOP Features: Alarm, Leap Year, Watchdog Timer Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 6648 Stücke: Lieferzeit 10-14 Tag (e) |
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PMCM6501VNE023 | NXP USA Inc. | Description: PMCM6501 N-CHANNEL, MOSFET |
Produkt ist nicht verfügbar |
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PMCM6501VPE023 | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
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74LVC138APW/AU118 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 49760 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC138APW-Q100118 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 22994 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT573AN,112 | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: Tri-State Mounting Type: Through Hole Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 3.3ns Supplier Device Package: 20-DIP Part Status: Obsolete |
auf Bestellung 1332 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT1011CFM | NXP USA Inc. |
Description: 15W SINGLE-COIL CONSUMER STAND Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.7V ~ 3.6V Applications: General Purpose Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 86238 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX256VMC7R | NXP USA Inc. | Description: KINETIS K20 - 72MHZ CORTEX-M4 P |
Produkt ist nicht verfügbar |
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MCIMX7D5EVM10SC | NXP USA Inc. | Description: NO EPDC 2 ETH CAN 2 OTG 1 HSIC P |
Produkt ist nicht verfügbar |
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74HCT423DB,112 | NXP USA Inc. |
Description: IC MULTIVIBRATOR 22NS 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 22 ns Independent Circuits: 2 Current - Output High, Low: 4mA, 4mA Schmitt Trigger Input: No Supplier Device Package: 16-SSOP Voltage - Supply: 4.5 V ~ 5.5 V |
auf Bestellung 15359 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2244AD,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 20-SO Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUJ103AX,127 | NXP USA Inc. | Description: NOW WEEN - BUJ103AX - POWER BIPO |
auf Bestellung 10483 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U1AVM08ACR | NXP USA Inc. |
Description: IC MPU 800MHZ 624MAPBGA Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Not For New Designs |
auf Bestellung 934 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVHY32F1VLQ | NXP USA Inc. | Description: MAGNIV 16-BIT MCU, S12Z CORE, 32 |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W-001-T10 | NXP USA Inc. |
Description: K32W061/41 UPGRADE BOARD Packaging: Bulk For Use With/Related Products: K32W061 Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W061Z | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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K32W061Z | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 986 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W061Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C24/LF1R | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 70 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V |
Produkt ist nicht verfügbar |
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PSMN028-100YS115 | NXP USA Inc. | Description: NOW NEXPERIA 30A, 100V, 0.0275OH |
Produkt ist nicht verfügbar |
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S9S12XS256J0CAL,557 | NXP USA Inc. | Description: 16 BIT MCU, S12X CORE, 256KB FLA |
Produkt ist nicht verfügbar |
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S912XET256J2CAL557 | NXP USA Inc. | Description: 16-BIT MCU, S12X CORE, 256KB FLA |
Produkt ist nicht verfügbar |
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S9S12XS128J1CAL557 | NXP USA Inc. | Description: 16-BIT MCU, S12X CORE, 128KB FLA |
Produkt ist nicht verfügbar |
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LPC5536JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100HLQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 23x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 568 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 100HLQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 23x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 185 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JHI48/00E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 515 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5536JHI48/00E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JHI48/00K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5536JHI48/00K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08DZ16ACLF | NXP USA Inc. | Description: IC MCU 8BIT 16KB FLASH 48LQFP |
auf Bestellung 591 Stücke: Lieferzeit 10-14 Tag (e) |
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NT4H2421G0DUD/02Z | NXP USA Inc. | Description: CLHW |
Produkt ist nicht verfügbar |
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NT4H2421G0DUD/02V | NXP USA Inc. | Description: CLHW |
Produkt ist nicht verfügbar |
FRDMGD3160DSBHB |
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1222.72 EUR |
BGA2771,115 |
Hersteller: NXP USA Inc.
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
74AUP2G07GX147 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1152+ | 0.42 EUR |
74ABT162245ADL653 |
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V
Packaging: Bulk
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Part Status: Active
Description: IC TXRX NON-INVERT 5.5V
Packaging: Bulk
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Part Status: Active
Produkt ist nicht verfügbar
LPC11E67JBD48K |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1060 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.62 EUR |
10+ | 6.74 EUR |
80+ | 5.52 EUR |
500+ | 5.41 EUR |
1000+ | 4.99 EUR |
SCIMX6S6AVM083C |
Produkt ist nicht verfügbar
8CH-DMIC |
Hersteller: NXP USA Inc.
Description: SPH0641lM4H MICROPHONE BOARD
Packaging: Box
Function: Microphone
Type: Audio
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: Yes
Part Status: Active
Description: SPH0641lM4H MICROPHONE BOARD
Packaging: Box
Function: Microphone
Type: Audio
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: Yes
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 159.07 EUR |
LD6836TD/21P,125 |
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.1V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.1V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2664+ | 0.18 EUR |
LD6806TD/22P,125 |
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2959+ | 0.16 EUR |
P1014NSE5HFB557 |
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 75.42 EUR |
FXLS8962AFR1 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
FXLS8962AFR1 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
PEMI8QFN/LP,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1567+ | 0.31 EUR |
BF1102,115 |
Hersteller: NXP USA Inc.
Description: FET RF 7V 800MHZ 6TSSOP
Description: FET RF 7V 800MHZ 6TSSOP
auf Bestellung 5780 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1202+ | 0.45 EUR |
A2I09VD015GNR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Produkt ist nicht verfügbar
MC33FS6510NAER2 |
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC07XSF517BEK |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Produkt ist nicht verfügbar
P5040NSE72QC |
Hersteller: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 835.91 EUR |
T2081NSE8PTB |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 535.6 EUR |
BLF6G20LS-180RN112 |
Produkt ist nicht verfügbar
BLF6G10LS-160RN112 |
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 147.97 EUR |
BLF6G10LS-135RN112 |
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 127.17 EUR |
MCIMX6S5EVM10AD |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 295 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 66.35 EUR |
10+ | 50.61 EUR |
60+ | 43.56 EUR |
120+ | 41.62 EUR |
240+ | 41.55 EUR |
N74F27D,623 |
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2420+ | 0.19 EUR |
TJA1463AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1463AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2479 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.85 EUR |
10+ | 2.57 EUR |
25+ | 2.43 EUR |
100+ | 2.07 EUR |
250+ | 1.94 EUR |
500+ | 1.7 EUR |
1000+ | 1.41 EUR |
PCF85063TP-ARD |
Hersteller: NXP USA Inc.
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 174.29 EUR |
PCF85263ATT1/AZ |
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 0.97 EUR |
5000+ | 0.92 EUR |
PCF85263ATT1/AZ |
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 6648 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.29 EUR |
10+ | 2.04 EUR |
25+ | 1.93 EUR |
100+ | 1.59 EUR |
250+ | 1.48 EUR |
500+ | 1.31 EUR |
1000+ | 1.04 EUR |
PMCM6501VNE023 |
Hersteller: NXP USA Inc.
Description: PMCM6501 N-CHANNEL, MOSFET
Description: PMCM6501 N-CHANNEL, MOSFET
Produkt ist nicht verfügbar
PMCM6501VPE023 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
74LVC138APW/AU118 |
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 49760 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2959+ | 0.18 EUR |
74LVC138APW-Q100118 |
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 22994 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2228+ | 0.23 EUR |
74ABT573AN,112 |
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-DIP
Part Status: Obsolete
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 1332 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
567+ | 0.86 EUR |
MWCT1011CFM |
Hersteller: NXP USA Inc.
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 86238 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
77+ | 6.35 EUR |
MK20DX256VMC7R |
Hersteller: NXP USA Inc.
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Produkt ist nicht verfügbar
MCIMX7D5EVM10SC |
Hersteller: NXP USA Inc.
Description: NO EPDC 2 ETH CAN 2 OTG 1 HSIC P
Description: NO EPDC 2 ETH CAN 2 OTG 1 HSIC P
Produkt ist nicht verfügbar
74HCT423DB,112 |
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR 22NS 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Description: IC MULTIVIBRATOR 22NS 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
auf Bestellung 15359 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1066+ | 0.46 EUR |
74LVC2244AD,118 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 20-SO
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 20-SO
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1347+ | 0.36 EUR |
BUJ103AX,127 |
Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJ103AX - POWER BIPO
Description: NOW WEEN - BUJ103AX - POWER BIPO
auf Bestellung 10483 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
760+ | 0.66 EUR |
MCIMX6U1AVM08ACR |
Hersteller: NXP USA Inc.
Description: IC MPU 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Description: IC MPU 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
auf Bestellung 934 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 130.42 EUR |
S912ZVHY32F1VLQ |
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
39+ | 12.87 EUR |
K32W-001-T10 |
Hersteller: NXP USA Inc.
Description: K32W061/41 UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Description: K32W061/41 UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 56 EUR |
K32W061Z |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
K32W061Z |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 986 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.82 EUR |
10+ | 13.57 EUR |
25+ | 12.34 EUR |
100+ | 11.11 EUR |
250+ | 10.18 EUR |
500+ | 9.25 EUR |
K32W061Y |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4000+ | 7.64 EUR |
BZX84-C24/LF1R |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Description: DIODE ZENER 24V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Produkt ist nicht verfügbar
PSMN028-100YS115 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 30A, 100V, 0.0275OH
Description: NOW NEXPERIA 30A, 100V, 0.0275OH
Produkt ist nicht verfügbar
S9S12XS256J0CAL,557 |
Hersteller: NXP USA Inc.
Description: 16 BIT MCU, S12X CORE, 256KB FLA
Description: 16 BIT MCU, S12X CORE, 256KB FLA
Produkt ist nicht verfügbar
S912XET256J2CAL557 |
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 256KB FLA
Description: 16-BIT MCU, S12X CORE, 256KB FLA
Produkt ist nicht verfügbar
S9S12XS128J1CAL557 |
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 128KB FLA
Description: 16-BIT MCU, S12X CORE, 128KB FLA
Produkt ist nicht verfügbar
LPC5536JBD100E |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 568 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 17.71 EUR |
10+ | 12.4 EUR |
25+ | 11.03 EUR |
90+ | 9.6 EUR |
270+ | 8.71 EUR |
450+ | 8.38 EUR |
LPC5534JBD100E |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 185 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.36 EUR |
10+ | 14.42 EUR |
90+ | 11.94 EUR |
LPC5534JHI48/00E |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 515 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.08 EUR |
10+ | 7.93 EUR |
80+ | 6.57 EUR |
LPC5536JHI48/00E |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.72 EUR |
10+ | 12.35 EUR |
80+ | 10.22 EUR |
LPC5534JHI48/00K |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.36 EUR |
10+ | 11.28 EUR |
80+ | 9.34 EUR |
1300+ | 8.15 EUR |
LPC5536JHI48/00K |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.66 EUR |
10+ | 12.3 EUR |
80+ | 10.18 EUR |
1300+ | 8.88 EUR |
MC9S08DZ16ACLF |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Description: IC MCU 8BIT 16KB FLASH 48LQFP
auf Bestellung 591 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
20+ | 23.49 EUR |