Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35280) > Seite 394 nach 588
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| P87C51X2FA, 512 | NXP USA Inc. |
 Description: IC MCU 8BIT 4KB OTP 44PLCC |
Produkt ist nicht verfügbar |
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PMST5088,115 | NXP USA Inc. |
Description: NOW NEXPERIA PMST5088 - SMALL SI Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 200 mW |
auf Bestellung 581293 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE14F512VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 449 Stücke: Lieferzeit 10-14 Tag (e) |
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HEF4030BT-Q100J | NXP USA Inc. |
Description: IC GATE XOR 4CH 2-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 15.5V Current - Output High, Low: 2.4mA, 2.4mA Number of Inputs: 2 Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF Part Status: Active Number of Circuits: 4 |
auf Bestellung 2930 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS21SW115 | NXP USA Inc. |
Description: NOW NEXPERIA BAS21SW - RECTIFIER Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74AHC1G08GW165 | NXP USA Inc. |
Description: AND GATE, HC/UH SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74AHC1G08GW/C2125 | NXP USA Inc. |
Description: AND GATE, HC/UH SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74AHC1G08GW132 | NXP USA Inc. |
Description: AND GATE, HC/UH SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MIMXRT1064DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 2085 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1064CVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 2117 Stücke: Lieferzeit 10-14 Tag (e) |
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T1042NSE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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| BT132-600D,116 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A TO92-3 Packaging: Bulk Part Status: Active |
auf Bestellung 16749 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54113J256UK49012 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 49WLCSP Packaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.44x3.44) Part Status: Active Number of I/O: 39 |
Produkt ist nicht verfügbar |
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MK20DX256VLH7557 | NXP USA Inc. |
Description: KINETIS K20: 72MHZ CORTEX-M4 PER |
Produkt ist nicht verfügbar |
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74HC4538PW-Q100118 | NXP USA Inc. |
Description: IC MULTIVIBRATOR Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 25 ns Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Schmitt Trigger Input: No Supplier Device Package: 16-TSSOP Part Status: Active Voltage - Supply: 2 V ~ 6 V |
Produkt ist nicht verfügbar |
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PBSS3540E,115 | NXP USA Inc. |
Description: TRANS PNP 40V 0.5A SC75 Packaging: Bulk Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V Frequency - Transition: 300MHz Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW |
auf Bestellung 95574 Stücke: Lieferzeit 10-14 Tag (e) |
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FRWY-LS1046A-TP | NXP USA Inc. |
Description: LS1046A EVAL BOARD CORAL TPU Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A72 Board Type: Evaluation Platform Utilized IC / Part: LS1046A Platform: Layerscape LS1046A Freeway Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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NE57811S/N1,518 | NXP USA Inc. |
Description: IC REG CONV DDR 1OUT 5SPAK Packaging: Bulk Package / Case: SPak-5 (5 leads + Tab) Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 1.6V ~ 3.6V Operating Temperature: 0°C ~ 70°C Applications: Converter, DDR Supplier Device Package: 5-SPAK |
auf Bestellung 5501 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68HCP11E1CFNE3,574 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC11 CPU |
auf Bestellung 1355 Stücke: Lieferzeit 10-14 Tag (e) |
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PMF87EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 1.7A SOT323-3 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta) Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V Power Dissipation (Max): 275mW (Ta) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SC-70 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V |
auf Bestellung 103313 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5747CBK0ACKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 |
Produkt ist nicht verfügbar |
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PCA9536D118 | NXP USA Inc. |
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908QT2ACDWER-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, FLASH, H Packaging: Bulk Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Part Status: Active Number of I/O: 5 DigiKey Programmable: Not Verified |
auf Bestellung 326 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908QB4CDWE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 1645 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z64VFP4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I²C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 40-HVQFN (5x5) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
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TJF1051T/CM118 | NXP USA Inc. |
Description: GALVANICALLY ISOLATED HIGH-SPEED Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX384-B6V8/ZLX | NXP USA Inc. |
Description: DIODE ZENER 6.8V 300MW SOD323 Tolerance: ±2% Packaging: Tape & Reel (TR) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOD-323 Part Status: Obsolete Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 4 V |
Produkt ist nicht verfügbar |
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PMEG045V150EPD139 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active |
auf Bestellung 1005000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMEG045T150EPD139 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
Produkt ist nicht verfügbar |
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| PMEG060V100EPD139 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
Produkt ist nicht verfügbar |
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SLN-VIZNAS-IOT | NXP USA Inc. |
Description: DEV I.MXRT106F FACE RECOGNITION Packaging: Box Function: Face Recognition Utilized IC / Part: i.MX RT1060 Supplied Contents: Board(s) Embedded: Yes |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMXRT1061DVJ6A | NXP USA Inc. |
Description: I.MXRT1060 |
Produkt ist nicht verfügbar |
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LD6816CX4/C13P,315 | NXP USA Inc. |
Description: IC REG LINEAR FIXED LDO REG Packaging: Bulk Part Status: Active Package / Case: 4-UFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12P96J0CFT | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48QFN Packaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVCH8T245PW | NXP USA Inc. |
Description: IC TRANSLATION TXRX 5.5V 24TSSOP |
Produkt ist nicht verfügbar |
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_SOT226%20Pkg.jpg "BUK9E1R9-40E,127") |
BUK9E1R9-40E,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V I2PAK Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tj) Supplier Device Package: I2PAK Part Status: Obsolete Drain to Source Voltage (Vdss): 40 V |
auf Bestellung 5048 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK762R9-40E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK762R9-40E 100A, |
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PDTA114YU/L115 | NXP USA Inc. |
Description: PDTA114Y SERIES - PNP RESISTOR-E Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PN5180A0ET/C4QL | NXP USA Inc. |
Description: PN5180 TFBGA64 TRAY Packaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC Supplier Device Package: 64-TFBGA (5.5x5.5) Part Status: Active |
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| TEF8101EN/N1E | NXP USA Inc. |
Description: RADAR |
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| TEF8101EN/N1Y | NXP USA Inc. |
Description: RADAR |
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NVT2001GM,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Features: Auto-Direction Sensing Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
auf Bestellung 463205 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT2001GMZ | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Grade: Automotive Number of Circuits: 1 Qualification: AEC-Q100 |
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NVT2001GM,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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PCA9306GF,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8XSON Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-XSON, SOT1089 (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Last Time Buy Number of Circuits: 1 |
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BCP56H115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Part Status: Active |
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BAP64-06W,115 | NXP USA Inc. |
Description: RF DIODE PIN 100V 240MW SOT323-3 Packaging: Bulk Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Common Anode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 100V Supplier Device Package: SC-70 Current - Max: 100 mA Power Dissipation (Max): 240 mW |
auf Bestellung 327071 Stücke: Lieferzeit 10-14 Tag (e) |
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| BAP64-04W | NXP USA Inc. |
Description: DIODE PIN 175V 100MA SOT-23 |
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BAP64-06W,115 | NXP USA Inc. |
Description: RF DIODE PIN 100V 240MW SOT323-3 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Common Anode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 100V Supplier Device Package: SC-70 Current - Max: 100 mA Power Dissipation (Max): 240 mW |
Produkt ist nicht verfügbar |
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| BAP64-02115 | NXP USA Inc. |
Description: PIN DIODE 175V Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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A7102CHTK2/T0BC2AJ | NXP USA Inc. |
Description: SECURE AUTHENTICATION Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 18427 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX585-C15135 | NXP USA Inc. |
Description: DIODE ZENER 15V 300MW SOD523 Tolerance: ±5% Packaging: Bulk Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C (TJ) Voltage - Zener (Nom) (Vz): 15 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOD-523 Part Status: Active Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V |
Produkt ist nicht verfügbar |
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BA591115 | NXP USA Inc. |
Description: BA591 - MIXER DIODE, VERY HIGH F Packaging: Bulk Package / Case: SC-76, SOD-323 Diode Type: Standard - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz Resistance @ If, F: 500mOhm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-323 Current - Max: 100 mA Power Dissipation (Max): 500 mW |
Produkt ist nicht verfügbar |
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SPC5741PK1AMLQ5 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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| SPC5741PK1AMMM5 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SPC5741PK1AMMM5R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5741PK1AMLQ9 | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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SPC5741PK1AMLQ9R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5741PK1AKLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 135°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BFU768F115 | NXP USA Inc. |
Description: NPN WIDEBAND SILICON GERMANIUM R Packaging: Bulk Part Status: Active Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.1dB Power - Max: 220mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz Supplier Device Package: 4-DFP |
Produkt ist nicht verfügbar |
| P87C51X2FA, 512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Description: IC MCU 8BIT 4KB OTP 44PLCC
Produkt ist nicht verfügbar
| PMST5088,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMST5088 - SMALL SI
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
Description: NOW NEXPERIA PMST5088 - SMALL SI
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
auf Bestellung 581293 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.033 EUR |
| MKE14F512VLL16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 449 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.8 EUR |
| 10+ | 10.06 EUR |
| 90+ | 8.33 EUR |
| HEF4030BT-Q100J |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
auf Bestellung 2930 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1547+ | 0.31 EUR |
| BAS21SW115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAS21SW - RECTIFIER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BAS21SW - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74AHC1G08GW165 |
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Produkt ist nicht verfügbar
| 74AHC1G08GW/C2125 |
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Produkt ist nicht verfügbar
| 74AHC1G08GW132 |
|
Produkt ist nicht verfügbar
| MIMXRT1064DVL6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 2085 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 30.47 EUR |
| 10+ | 24.34 EUR |
| 80+ | 20.55 EUR |
| 480+ | 20.43 EUR |
| MIMXRT1064CVL5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 2117 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 33.49 EUR |
| 10+ | 26.77 EUR |
| 80+ | 22.61 EUR |
| 480+ | 22.47 EUR |
| T1042NSE7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 192.88 EUR |
| BT132-600D,116 |
|
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Part Status: Active
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Part Status: Active
auf Bestellung 16749 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2323+ | 0.21 EUR |
| LPC54113J256UK49012 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Part Status: Active
Number of I/O: 39
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
| MK20DX256VLH7557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K20: 72MHZ CORTEX-M4 PER
Description: KINETIS K20: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
| 74HC4538PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Description: IC MULTIVIBRATOR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Produkt ist nicht verfügbar
| PBSS3540E,115 |
|
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.5A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Description: TRANS PNP 40V 0.5A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
auf Bestellung 95574 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6662+ | 0.081 EUR |
| FRWY-LS1046A-TP |
|
Hersteller: NXP USA Inc.
Description: LS1046A EVAL BOARD CORAL TPU
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway
Part Status: Active
Description: LS1046A EVAL BOARD CORAL TPU
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1871.9 EUR |
| NE57811S/N1,518 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 5SPAK
Packaging: Bulk
Package / Case: SPak-5 (5 leads + Tab)
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 1.6V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Applications: Converter, DDR
Supplier Device Package: 5-SPAK
Description: IC REG CONV DDR 1OUT 5SPAK
Packaging: Bulk
Package / Case: SPak-5 (5 leads + Tab)
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 1.6V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Applications: Converter, DDR
Supplier Device Package: 5-SPAK
auf Bestellung 5501 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 329+ | 1.48 EUR |
| MC68HCP11E1CFNE3,574 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC11 CPU
Description: MICROCONTROLLER, 8 BIT, HC11 CPU
auf Bestellung 1355 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 19+ | 27.33 EUR |
| PMF87EN,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
auf Bestellung 103313 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.16 EUR |
| SPC5747CBK0ACKU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Produkt ist nicht verfügbar
| PCA9536D118 |
|
Hersteller: NXP USA Inc.
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908QT2ACDWER-NXP |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, FLASH, H
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, FLASH, H
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
auf Bestellung 326 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 114+ | 4.3 EUR |
| MC908QB4CDWE-NXP |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 1645 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 82+ | 6.04 EUR |
| MKE15Z64VFP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 8.15 EUR |
| 10+ | 6.37 EUR |
| 80+ | 5.22 EUR |
| TJF1051T/CM118 |
|
Hersteller: NXP USA Inc.
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Part Status: Active
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BZX384-B6V8/ZLX |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.8V 300MW SOD323
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Description: DIODE ZENER 6.8V 300MW SOD323
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Produkt ist nicht verfügbar
| PMEG045V150EPD139 |
|
auf Bestellung 1005000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 838+ | 0.63 EUR |
| PMEG045T150EPD139 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
| PMEG060V100EPD139 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
| SLN-VIZNAS-IOT |
|
Hersteller: NXP USA Inc.
Description: DEV I.MXRT106F FACE RECOGNITION
Packaging: Box
Function: Face Recognition
Utilized IC / Part: i.MX RT1060
Supplied Contents: Board(s)
Embedded: Yes
Description: DEV I.MXRT106F FACE RECOGNITION
Packaging: Box
Function: Face Recognition
Utilized IC / Part: i.MX RT1060
Supplied Contents: Board(s)
Embedded: Yes
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 399.06 EUR |
| LD6816CX4/C13P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Part Status: Active
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR FIXED LDO REG
Packaging: Bulk
Part Status: Active
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| S9S12P96J0CFT |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVCH8T245PW |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 5.5V 24TSSOP
Description: IC TRANSLATION TXRX 5.5V 24TSSOP
Produkt ist nicht verfügbar
| BUK9E1R9-40E,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
auf Bestellung 5048 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 317+ | 1.67 EUR |
| BUK762R9-40E118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK762R9-40E 100A,
Description: NOW NEXPERIA BUK762R9-40E 100A,
Produkt ist nicht verfügbar
| PDTA114YU/L115 |
|
Hersteller: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PN5180A0ET/C4QL |
Hersteller: NXP USA Inc.
Description: PN5180 TFBGA64 TRAY
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Description: PN5180 TFBGA64 TRAY
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Produkt ist nicht verfügbar
| NVT2001GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 463205 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 792+ | 0.62 EUR |
| NVT2001GMZ |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| NVT2001GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
| PCA9306GF,115 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Produkt ist nicht verfügbar
| BCP56H115 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BAP64-06W,115 |
|
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Anode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Description: RF DIODE PIN 100V 240MW SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Anode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
auf Bestellung 327071 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3286+ | 0.15 EUR |
| BAP64-04W |
|
Hersteller: NXP USA Inc.
Description: DIODE PIN 175V 100MA SOT-23
Description: DIODE PIN 175V 100MA SOT-23
Produkt ist nicht verfügbar
| BAP64-06W,115 |
|
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Anode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Description: RF DIODE PIN 100V 240MW SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Anode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
| BAP64-02115 |
Produkt ist nicht verfügbar
| A7102CHTK2/T0BC2AJ |
|
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 18427 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.28 EUR |
| 10+ | 4.91 EUR |
| 100+ | 4.02 EUR |
| 500+ | 3.93 EUR |
| 1000+ | 3.32 EUR |
| 2500+ | 3.15 EUR |
| BZX585-C15135 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 300MW SOD523
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Description: DIODE ZENER 15V 300MW SOD523
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
| BA591115 |
|
Hersteller: NXP USA Inc.
Description: BA591 - MIXER DIODE, VERY HIGH F
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Description: BA591 - MIXER DIODE, VERY HIGH F
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
| SPC5741PK1AMLQ5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
| SPC5741PK1AMMM5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5741PK1AMMM5R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5741PK1AMLQ9 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
| SPC5741PK1AMLQ9R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5741PK1AKLQ8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BFU768F115 |
|
Hersteller: NXP USA Inc.
Description: NPN WIDEBAND SILICON GERMANIUM R
Packaging: Bulk
Part Status: Active
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Description: NPN WIDEBAND SILICON GERMANIUM R
Packaging: Bulk
Part Status: Active
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar