Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 390 nach 591
Foto | Bezeichnung | Hersteller | Beschreibung |
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BUK9640-100A118 | NXP USA Inc. | Description: NOW NEXPERIA BUK9640-100A - POWE |
Produkt ist nicht verfügbar |
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PN5331B3HN/C270518 | NXP USA Inc. |
Description: USB NFC INTEGRATED SOLUTION Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1815JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 768KB (768K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P1025NSN5DFB557 | NXP USA Inc. |
Description: QORIQ, POWER ARCH 32-BIT SOC, 2 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P1014NSE5DFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA Packaging: Bulk Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, SPI Part Status: Obsolete |
auf Bestellung 79 Stücke: Lieferzeit 10-14 Tag (e) |
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MC22XSD200BEK-NXP | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO Packaging: Bulk Part Status: Active |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN36221AHX128 | NXP USA Inc. |
Description: SINGLE-CHANNEL SUPERSPEED USB 3. Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PTN36221AHX147 | NXP USA Inc. |
Description: SINGLE-CHANNEL SUPERSPEED USB 3. Packaging: Bulk Part Status: Active |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP2G126GS/S500115 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 8-XSON (1.35x1) Part Status: Active |
auf Bestellung 35000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF2100CT/F1118 | NXP USA Inc. | Description: IC LCD DRIVER 40SEG 28SOIC |
Produkt ist nicht verfügbar |
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BC847CW/ZL115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 200 mW |
Produkt ist nicht verfügbar |
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MC56F81668VLH | NXP USA Inc. |
Description: IC DSC 128KB/20KB LQFP64 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: I2C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 2.7V, 3.6V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
auf Bestellung 479 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F81768VLH | NXP USA Inc. |
Description: IC DSC 128KB/20KB LQFP64 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: I2C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 2.7V, 3.6V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F81648VLH | NXP USA Inc. |
Description: IC DSC 64KB/12KB LQFP64 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: I2C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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MC56F81748VLH | NXP USA Inc. |
Description: IC DSC 64KB/12KB LQFP64 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: I²C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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MC56F81868VLH | NXP USA Inc. |
Description: IC DSC 128KB/20KB LQFP64 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: I²C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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74ABT74D/L112 | NXP USA Inc. |
Description: D FLIP-FLOP, ABT SERIES Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 50 µA Current - Output High, Low: 15mA, 20mA Trigger Type: Positive Edge Clock Frequency: 250 MHz Input Capacitance: 3 pF Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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74ABT74N,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: Complementary Mounting Type: Through Hole Number of Elements: 2 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 50 µA Current - Output High, Low: 15mA, 20mA Trigger Type: Positive Edge Clock Frequency: 250 MHz Input Capacitance: 3 pF Supplier Device Package: 14-DIP Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 1 |
auf Bestellung 900 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11C14FBD48/30EL | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1211 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11C24FBD48/30EL | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 1667 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVTH125D,112 | NXP USA Inc. |
Description: IC BUFF TRI-ST QD N-INV 14SOIC Packaging: Bulk |
auf Bestellung 9559 Stücke: Lieferzeit 10-14 Tag (e) |
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74CBTLVD3861DK,118 | NXP USA Inc. |
Description: IC BUS SWITCH 10 X 1:1 24SSOP Packaging: Bulk Package / Case: 24-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 24-SSOP Part Status: Obsolete |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2131FBD64/01151 | NXP USA Inc. |
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2131FBD64/01118 | NXP USA Inc. |
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2132FBD64/01118 | NXP USA Inc. |
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2114FBD64/01151 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 |
Produkt ist nicht verfügbar |
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LPC2114FBD6401151 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 |
Produkt ist nicht verfügbar |
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LPC2119FBD64/01151 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2138FBD64/01151 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2138FBD64/01118 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2131FBD64/01 | NXP USA Inc. |
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2131FBD640115 | NXP USA Inc. |
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2132FBD64/01EL | NXP USA Inc. |
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
auf Bestellung 1651 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2134FBD64/01EL | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 16x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 47 DigiKey Programmable: Not Verified |
auf Bestellung 289 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2119FBD64/01EL | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 DigiKey Programmable: Not Verified |
auf Bestellung 752 Stücke: Lieferzeit 10-14 Tag (e) |
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P332G004A4/T0BC243 | NXP USA Inc. | Description: IC SMART E-ID PLMC SOT500-2 |
Produkt ist nicht verfügbar |
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BZV49-C33115 | NXP USA Inc. |
Description: DIODE ZENER 30V 1W 5% UNIDIR Tolerance: ±5% Packaging: Bulk Package / Case: TO-243AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 33 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-89 Grade: Automotive Part Status: Active Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V Qualification: AEC-Q100 |
auf Bestellung 1760 Stücke: Lieferzeit 10-14 Tag (e) |
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NPS3001DVT1 | NXP USA Inc. | Description: DIFFP 0 - 1KPA |
Produkt ist nicht verfügbar |
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PNPS3000VVT1 | NXP USA Inc. | Description: DIFF P +/- 0.5KPA |
Produkt ist nicht verfügbar |
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PNPS3001DVT1 | NXP USA Inc. | Description: DIFFP 0 - 1KPA |
Produkt ist nicht verfügbar |
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PNPS3002VVT1 | NXP USA Inc. | Description: DIFFP +/- 2KPA |
Produkt ist nicht verfügbar |
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8MNANOLPD4-EVK | NXP USA Inc. |
Description: EVAL KIT I.MX8M NANO Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-A53, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX 8M Nano Operating System: Android, FreeRTOS, Linux Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTD3306D,118 | NXP USA Inc. |
Description: IC BUS SWITCH 1 X 1:1 8SO Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 8-SO |
auf Bestellung 5434 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3126D,118 | NXP USA Inc. |
Description: IC BUS SWITCH 1 X 1:1 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 4 Voltage Supply Source: Single Supply Supplier Device Package: 14-SO Part Status: Obsolete |
auf Bestellung 4740 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTD3306D,112 | NXP USA Inc. |
Description: IC BUS SWITCH 1 X 1:1 8SO Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 8-SO |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9646D118 | NXP USA Inc. |
Description: IC BUS SWITCH 4CH 2WIRE 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Delay Time: 100ns Number of Channels: 4 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I²C Current - Supply: 1µA Data Rate (Max): 1MHz Supplier Device Package: 16-SO Part Status: Active |
auf Bestellung 2447 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT244APW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-TSSOP Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 5589 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT244APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-TSSOP Part Status: Obsolete |
auf Bestellung 7415 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT244BPW/AU118 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 3.6V 20TSSOP Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-TSSOP |
auf Bestellung 2799 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT244AD | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 2-FUNC, Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LVT244BD118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVT244BD BUS DRIV Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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MMRF5300NR5 | NXP USA Inc. |
Description: 2700-3500 MHZ 60 W PEAK 50V WI Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 2.7GHz ~ 3.5GHz Power - Output: 60W Gain: 17dB Technology: HEMT Supplier Device Package: OM-270-2 Part Status: Obsolete Voltage - Rated: 125 V Voltage - Test: 50 V Current - Test: 70 mA |
Produkt ist nicht verfügbar |
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74AHC04PW-Q100118 | NXP USA Inc. |
Description: INVERTER, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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UJA1131HW/FD/5V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE Packaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC652D,112 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 6V 24SO Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 8 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 24-SO |
auf Bestellung 1200 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1086HNJ | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 44HVQFN Packaging: Cut Tape (CT) Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: FlexRay Supplier Device Package: 44-HVQFN (9x9) Duplex: Full |
Produkt ist nicht verfügbar |
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TJA1085GHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 4/4 44HVQFN Packaging: Tape & Reel (TR) Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75 ~ 5.25V Number of Drivers/Receivers: 4/4 Protocol: FlexRay Supplier Device Package: 44-HVQFN (9x9) Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1085GHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 4/4 44HVQFN Packaging: Cut Tape (CT) Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75 ~ 5.25V Number of Drivers/Receivers: 4/4 Protocol: FlexRay Supplier Device Package: 44-HVQFN (9x9) Part Status: Active |
auf Bestellung 1813 Stücke: Lieferzeit 10-14 Tag (e) |
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PMPB12UN,115 | NXP USA Inc. |
Description: MOSFET N-CH 20V 7.9A 6DFN Packaging: Bulk Package / Case: 6-UDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta) Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: 6-DFN2020MD (2x2) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V |
auf Bestellung 65963 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8544ASD/N2,112 | NXP USA Inc. | Description: IC AMP AUDIO BTL CLASS AB 36HSOP |
Produkt ist nicht verfügbar |
BUK9640-100A118 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9640-100A - POWE
Description: NOW NEXPERIA BUK9640-100A - POWE
Produkt ist nicht verfügbar
PN5331B3HN/C270518 |
Hersteller: NXP USA Inc.
Description: USB NFC INTEGRATED SOLUTION
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: USB NFC INTEGRATED SOLUTION
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1815JBD144551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P1025NSN5DFB557 |
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ, POWER ARCH 32-BIT SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P1014NSE5DFB |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 58.02 EUR |
MC22XSD200BEK-NXP |
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO
Packaging: Bulk
Part Status: Active
Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO
Packaging: Bulk
Part Status: Active
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
42+ | 13.07 EUR |
PTN36221AHX128 |
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Packaging: Bulk
Part Status: Active
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PTN36221AHX147 |
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Packaging: Bulk
Part Status: Active
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Packaging: Bulk
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
411+ | 1.21 EUR |
74AUP2G126GS/S500115 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.35x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.35x1)
Part Status: Active
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2623+ | 0.19 EUR |
PCF2100CT/F1118 |
Hersteller: NXP USA Inc.
Description: IC LCD DRIVER 40SEG 28SOIC
Description: IC LCD DRIVER 40SEG 28SOIC
Produkt ist nicht verfügbar
BC847CW/ZL115 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Produkt ist nicht verfügbar
MC56F81668VLH |
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 479 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.56 EUR |
10+ | 11.54 EUR |
25+ | 10.25 EUR |
160+ | 8.42 EUR |
320+ | 7.94 EUR |
MC56F81768VLH |
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.44 EUR |
10+ | 12.94 EUR |
25+ | 11.53 EUR |
160+ | 9.53 EUR |
MC56F81648VLH |
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: IC DSC 64KB/12KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
MC56F81748VLH |
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: IC DSC 64KB/12KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
MC56F81868VLH |
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
74ABT74D/L112 |
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, ABT SERIES
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 50 µA
Current - Output High, Low: 15mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 250 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Number of Bits per Element: 1
Description: D FLIP-FLOP, ABT SERIES
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 50 µA
Current - Output High, Low: 15mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 250 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
74ABT74N,112 |
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 50 µA
Current - Output High, Low: 15mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 250 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 50 µA
Current - Output High, Low: 15mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 250 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
300+ | 1.65 EUR |
LPC11C14FBD48/30EL |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1211 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.7 EUR |
10+ | 6.55 EUR |
25+ | 5.73 EUR |
80+ | 4.94 EUR |
250+ | 4.37 EUR |
500+ | 4.1 EUR |
1000+ | 3.87 EUR |
LPC11C24FBD48/30EL |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1667 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.53 EUR |
10+ | 8.59 EUR |
25+ | 7.57 EUR |
80+ | 6.59 EUR |
250+ | 5.88 EUR |
500+ | 5.54 EUR |
1000+ | 5.26 EUR |
74LVTH125D,112 |
auf Bestellung 9559 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1839+ | 0.25 EUR |
74CBTLVD3861DK,118 |
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
Part Status: Obsolete
Description: IC BUS SWITCH 10 X 1:1 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
Part Status: Obsolete
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1069+ | 0.49 EUR |
LPC2131FBD64/01151 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2131FBD64/01118 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2132FBD64/01118 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2114FBD64/01151 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
Produkt ist nicht verfügbar
LPC2114FBD6401151 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
Produkt ist nicht verfügbar
LPC2119FBD64/01151 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2138FBD64/01151 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2138FBD64/01118 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2131FBD64/01 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2131FBD640115 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC2132FBD64/01EL |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1651 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.77 EUR |
10+ | 18.48 EUR |
25+ | 16.61 EUR |
160+ | 13.96 EUR |
320+ | 13.27 EUR |
480+ | 12.92 EUR |
960+ | 12.76 EUR |
LPC2134FBD64/01EL |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 289 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.23 EUR |
10+ | 17.76 EUR |
160+ | 16.2 EUR |
LPC2119FBD64/01EL |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 752 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.97 EUR |
10+ | 25.58 EUR |
25+ | 23.18 EUR |
80+ | 20.86 EUR |
230+ | 19.3 EUR |
440+ | 18.79 EUR |
P332G004A4/T0BC243 |
Hersteller: NXP USA Inc.
Description: IC SMART E-ID PLMC SOT500-2
Description: IC SMART E-ID PLMC SOT500-2
Produkt ist nicht verfügbar
BZV49-C33115 |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 30V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-89
Grade: Automotive
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q100
Description: DIODE ZENER 30V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-89
Grade: Automotive
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q100
auf Bestellung 1760 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1760+ | 0.29 EUR |
8MNANOLPD4-EVK |
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX8M NANO
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Description: EVAL KIT I.MX8M NANO
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Operating System: Android, FreeRTOS, Linux
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 757.84 EUR |
CBTD3306D,118 |
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 5434 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1776+ | 0.28 EUR |
CBT3126D,118 |
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
auf Bestellung 4740 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1776+ | 0.28 EUR |
CBTD3306D,112 |
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
Description: IC BUS SWITCH 1 X 1:1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2000+ | 0.31 EUR |
PCA9646D118 |
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 4CH 2WIRE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-SO
Part Status: Active
Description: IC BUS SWITCH 4CH 2WIRE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 2447 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
74+ | 7.18 EUR |
74LVT244APW-Q100118 |
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5589 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1205+ | 0.4 EUR |
74LVT244APW/AU118 |
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
auf Bestellung 7415 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1210+ | 0.4 EUR |
74LVT244BPW/AU118 |
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Description: IC BUFF NON-INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
auf Bestellung 2799 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1210+ | 0.4 EUR |
74LVT244AD |
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 2-FUNC,
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, LVT SERIES, 2-FUNC,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVT244BD118 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVT244BD BUS DRIV
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Description: NOW NEXPERIA 74LVT244BD BUS DRIV
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
MMRF5300NR5 |
Hersteller: NXP USA Inc.
Description: 2700-3500 MHZ 60 W PEAK 50V WI
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.5GHz
Power - Output: 60W
Gain: 17dB
Technology: HEMT
Supplier Device Package: OM-270-2
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 70 mA
Description: 2700-3500 MHZ 60 W PEAK 50V WI
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.5GHz
Power - Output: 60W
Gain: 17dB
Technology: HEMT
Supplier Device Package: OM-270-2
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 70 mA
Produkt ist nicht verfügbar
74AHC04PW-Q100118 |
Hersteller: NXP USA Inc.
Description: INVERTER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: INVERTER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
UJA1131HW/FD/5V/4Y |
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1500+ | 6.34 EUR |
74HC652D,112 |
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
auf Bestellung 1200 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
468+ | 1.05 EUR |
TJA1086HNJ |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Duplex: Full
Produkt ist nicht verfügbar
TJA1085GHN/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
Produkt ist nicht verfügbar
TJA1085GHN/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
auf Bestellung 1813 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.2 EUR |
10+ | 22.23 EUR |
25+ | 21.31 EUR |
100+ | 18.77 EUR |
250+ | 17.85 EUR |
500+ | 16.7 EUR |
PMPB12UN,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 7.9A 6DFN
Packaging: Bulk
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
Description: MOSFET N-CH 20V 7.9A 6DFN
Packaging: Bulk
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
auf Bestellung 65963 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1268+ | 0.39 EUR |
TDF8544ASD/N2,112 |
Hersteller: NXP USA Inc.
Description: IC AMP AUDIO BTL CLASS AB 36HSOP
Description: IC AMP AUDIO BTL CLASS AB 36HSOP
Produkt ist nicht verfügbar