Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35282) > Seite 37 nach 589
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MC68882CEI25A | NXP USA Inc. |
 Description: IC FLOATING-POINT CO-PROC 68PLCCPackaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Type: Floating-Point Co-Processor Supplier Device Package: 68-PLCC (24.21x24.21) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68882CEI33A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Type: Floating-Point Co-Processor Supplier Device Package: 68-PLCC (24.21x24.21) Part Status: Obsolete DigiKey Programmable: Not Verified |
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MC68882EI25A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Type: Floating-Point Co-Processor Supplier Device Package: 68-PLCC (24.21x24.21) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68882EI33A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Type: Floating-Point Co-Processor Supplier Device Package: 68-PLCC (24.21x24.21) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68882EI40A | NXP USA Inc. |
Description: IC FLOATING-POINT CO-PROC 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Type: Floating-Point Co-Processor Supplier Device Package: 68-PLCC (24.21x24.21) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68908GR16MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC68908GR16VFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
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MC68908GZ8MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFP |
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MC68908GZ8VFAE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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MC68EN360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68en360ai33l | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
Produkt ist nicht verfügbar |
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MC68EN360CVR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA |
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MC68EN360VR25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA |
Produkt ist nicht verfügbar |
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MC68HC11A0CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11A1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
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MC68HC11D0CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 26 DigiKey Programmable: Not Verified |
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MC68HC11E0CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tray Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
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MC68HC11E0CFNE2R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11E0CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11E1CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11E1CFNE2R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11E1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC16Z1CAG25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
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MC68HC16Z1CEH16 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU16 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Part Status: Not For New Designs Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC16Z1CEH25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 25MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU16 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Part Status: Not For New Designs Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC705C8ACFNE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 24 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC68HC705C9AVFNE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 16KB (16K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711D3CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711D3CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9VFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HSC705J1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-DIP Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68LC302CAF16CT | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 100LQFP |
Produkt ist nicht verfügbar |
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MC68LK332ACEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16.78MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
auf Bestellung 309 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68MH360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: SCC, SMC, SPI |
Produkt ist nicht verfügbar |
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MC68MH360AI25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 3.3V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360CVR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR25LR2 | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tape & Reel (TR) Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR33LR2 | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA Packaging: Tape & Reel (TR) Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68SEC000AA10R2 | NXP USA Inc. |
Description: IC MPU M680X0 10MHZ 64QFP |
Produkt ist nicht verfügbar |
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MC68SEC000AA20B1 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFP |
Produkt ist nicht verfügbar |
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MC68SEC000AE10 | NXP USA Inc. |
Description: IC MPU M680X0 10MHZ 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 10MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-LQFP (10x10) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68SEC000CAA16 | NXP USA Inc. |
Description: IC MPU M680X0 16MHZ 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-QFP (14x14) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68SEC000CAA20 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFP |
Produkt ist nicht verfügbar |
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MC705J1ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-SOIC Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC705JP7CPE | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 28DIP |
Produkt ist nicht verfügbar |
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MC705P6ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 4.5KB OTP 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 4.5KB (4.5K x 8) RAM Size: 176 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SIO Peripherals: POR, WDT Supplier Device Package: 28-SOIC Part Status: Not For New Designs Number of I/O: 21 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC711K4CFUE3 | NXP USA Inc. |
Description: IC MCU 8BIT 24KB OTP 80QFP |
Produkt ist nicht verfügbar |
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MC908AZ60AMFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AZ60AVFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908GR16AMFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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MC908GR16AVFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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MC908GR32AMFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Not For New Designs Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908GZ32MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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MC908GZ32MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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MC908GZ32VFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP |
Produkt ist nicht verfügbar |
| MC68882CEI25A |
|
Hersteller: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68882CEI33A |
|
Hersteller: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68882EI25A |
|
Hersteller: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68882EI33A |
|
Hersteller: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68882EI40A |
|
Hersteller: NXP USA Inc.
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
DigiKey Programmable: Not Verified
Description: IC FLOATING-POINT CO-PROC 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Floating-Point Co-Processor
Supplier Device Package: 68-PLCC (24.21x24.21)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68908GR16MFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC68908GR16VFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC68908GZ8MFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC68908GZ8VFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Produkt ist nicht verfügbar
| MC68EN360AI25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Description: IC MPU M683XX 25MHZ 240FQFP
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)| MC68en360ai33l |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
| MC68EN360CVR25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
Produkt ist nicht verfügbar
| MC68EN360VR25VL |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
Produkt ist nicht verfügbar
| MC68HC11A0CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11A1CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11D0CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E0CFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tray
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tray
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E0CFNE2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E0CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E1CFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E1CFNE2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E1CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC16Z1CAG25 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Description: IC MCU 16BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
| MC68HC16Z1CEH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC16Z1CEH25 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC705C8ACFNE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC68HC705C9AVFNE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711D3CFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711D3CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9CFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9MFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9VFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HSC705J1ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68LC302CAF16CT |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Description: IC MPU M683XX 16MHZ 100LQFP
Produkt ist nicht verfügbar
| MC68LK332ACEH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 99.74 EUR |
| 10+ | 80.92 EUR |
| 180+ | 70.26 EUR |
| MC68MH360AI25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: SCC, SMC, SPI
Produkt ist nicht verfügbar
| MC68MH360AI25VL |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360CVR25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR25LR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR33L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR33LR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68SEC000AA10R2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 10MHZ 64QFP
Description: IC MPU M680X0 10MHZ 64QFP
Produkt ist nicht verfügbar
| MC68SEC000AA20B1 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Description: IC MPU M680X0 20MHZ 64QFP
Produkt ist nicht verfügbar
| MC68SEC000AE10 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 10MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 10MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
| MC68SEC000CAA16 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68SEC000CAA20 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Description: IC MPU M680X0 20MHZ 64QFP
Produkt ist nicht verfügbar
| MC705J1ACDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC705JP7CPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 28DIP
Description: IC MCU 8BIT 6KB OTP 28DIP
Produkt ist nicht verfügbar
| MC705P6ACDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC711K4CFUE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 80QFP
Description: IC MCU 8BIT 24KB OTP 80QFP
Produkt ist nicht verfügbar
| MC908AZ60AMFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908AZ60AVFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908GR16AMFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908GR16AVFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908GR32AMFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908GZ32MFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
| MC908GZ32MFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908GZ32VFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Description: IC MCU 8BIT 32KB FLASH 64QFP
Produkt ist nicht verfügbar