Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35282) > Seite 35 nach 589
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MPC8280CVVUPEA | NXP USA Inc. |
 Description: IC MPU MPC82XX 450MHZ 480TBGAPackaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 450MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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MPC8280VVUPEA | NXP USA Inc. |
Description: IC MPU MPC82XX 450MHZ 480TBGA |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TVR66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
auf Bestellung 94 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC853TVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC8540CVT667JB | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MPC8540VT667LB | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MPC8541EVTAQF | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MPC855TVR80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC8560CVT667JB | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MPC8560VT667LB | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
Produkt ist nicht verfügbar |
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MPC857DSLVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MPC857TVR100B | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC859DSLCVR66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860DECVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860DECVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860DEVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860DPCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860ENCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860ENVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860PCVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860PVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860SRCVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860TCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC862PVR100B | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC862TCVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC862TVR100B | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC862TVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC866PCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC866PVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC866PVR133A | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC866TCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC866TVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC866TVR133A | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC870VR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC870VR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC870VR80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC875VR80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC880CVR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC880VR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC880VR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC880VR80 | NXP USA Inc. | Description: IC MPU MPC8XX 80MHZ 357BGA |
auf Bestellung 3300 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC885CVR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC885CVR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC885VR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MRF5S19060NBR1 | NXP USA Inc. |
Description: FET RF 65V 1.99GHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MRF5S19060NR1 | NXP USA Inc. |
Description: FET RF 65V 1.99GHZ TO-270-4 |
Produkt ist nicht verfügbar |
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MRF5S9100NBR1 | NXP USA Inc. |
Description: FET RF 68V 880MHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MRF5S9101NBR1 | NXP USA Inc. |
Description: FET RF 68V 960MHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MSC8101VT1375F | NXP USA Inc. |
Description: IC DSP 16BIT 250MHZ 332FCBGA |
Produkt ist nicht verfügbar |
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MSC8103VT1100F | NXP USA Inc. |
Description: IC DSP 16BIT 275MHZ 332FCBGA Packaging: Tray Package / Case: 332-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Communications Processor Module (CPM) Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 512KB Voltage - I/O: 3.30V Voltage - Core: 1.60V Clock Rate: 275MHz Supplier Device Package: 332-FCBGA (17x17) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MSC8122TVT6400V | NXP USA Inc. |
Description: IC DSP QUAD 16B 400MHZ 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 400MHz Supplier Device Package: 431-FCPBGA (20x20) |
Produkt ist nicht verfügbar |
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MSC8126VT8000 | NXP USA Inc. |
Description: IC DSP QUAD 16B 500MHZ 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 500MHz Supplier Device Package: 431-FCPBGA (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MW4IC2230GNBR1 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Gull Wing Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 GULL |
Produkt ist nicht verfügbar |
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MWIC930GNR1 | NXP USA Inc. |
Description: IC RF AMP CEL 900MHZ TO272 WB-16 |
Produkt ist nicht verfügbar |
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MWIC930NR1 | NXP USA Inc. |
Description: IC AMP CELLULAR 900MHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 900MHz RF Type: Cellular, GSM, EDGE, N-CDMA Voltage - Supply: 26V Gain: 30dB Current - Supply: 90mA Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MW4IC2230GNBR1 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Cut Tape (CT) Package / Case: TO-272-16 Variant, Gull Wing Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 GULL |
Produkt ist nicht verfügbar |
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MWIC930GNR1 | NXP USA Inc. |
Description: IC RF AMP CEL 900MHZ TO272 WB-16 |
Produkt ist nicht verfügbar |
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MWIC930NR1 | NXP USA Inc. |
Description: IC AMP CELLULAR 900MHZ TO272WB Packaging: Cut Tape (CT) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 900MHz RF Type: Cellular, GSM, EDGE, N-CDMA Voltage - Supply: 26V Gain: 30dB Current - Supply: 90mA Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
auf Bestellung 266 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF5S19060NBR1 | NXP USA Inc. |
Description: FET RF 65V 1.99GHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MRF5S19060NR1 | NXP USA Inc. |
Description: FET RF 65V 1.99GHZ TO-270-4 |
Produkt ist nicht verfügbar |
| MPC8280CVVUPEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
| MPC8280VVUPEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Description: IC MPU MPC82XX 450MHZ 480TBGA
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 565.89 EUR |
| MPC852TVR66A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 55.86 EUR |
| 10+ | 44.8 EUR |
| MPC853TVR100A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC8540CVT667JB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
| MPC8540VT667LB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
| MPC8541EVTAQF |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Produkt ist nicht verfügbar
| MPC855TVR80D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC8560CVT667JB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
| MPC8560VT667LB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
| MPC857DSLVR66B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
| MPC857TVR100B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Description: IC MPU MPC8XX 100MHZ 357BGA
Produkt ist nicht verfügbar
| MPC859DSLCVR66A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
| MPC860DECVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Description: IC MPU MPC8XX 50MHZ 357BGA
Produkt ist nicht verfügbar
| MPC860DECVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
| MPC860DEVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860DPCVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
| MPC860ENCVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860ENVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860PCVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Description: IC MPU MPC8XX 50MHZ 357BGA
Produkt ist nicht verfügbar
| MPC860PVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860SRCVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860TCVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
| MPC862PVR100B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC862TCVR66B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
| MPC862TVR100B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC862TVR66B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
| MPC866PCVR100A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC866PVR100A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC866PVR133A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC866TCVR100A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC866TVR100A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC866TVR133A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC870VR133 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC870VR66 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC870VR80 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
| MPC875VR80 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Description: IC MPU MPC8XX 80MHZ 256BGA
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)| MPC880CVR133 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
Produkt ist nicht verfügbar
| MPC880VR133 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC880VR66 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC880VR80 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Description: IC MPU MPC8XX 80MHZ 357BGA
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)| MPC885CVR133 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC885CVR66 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC885VR133 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MRF5S19060NBR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-272-4
Description: FET RF 65V 1.99GHZ TO-272-4
Produkt ist nicht verfügbar
| MRF5S19060NR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-270-4
Description: FET RF 65V 1.99GHZ TO-270-4
Produkt ist nicht verfügbar
| MRF5S9100NBR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ TO-272-4
Description: FET RF 68V 880MHZ TO-272-4
Produkt ist nicht verfügbar
| MRF5S9101NBR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 68V 960MHZ TO-272-4
Description: FET RF 68V 960MHZ TO-272-4
Produkt ist nicht verfügbar
| MSC8101VT1375F |
|
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Description: IC DSP 16BIT 250MHZ 332FCBGA
Produkt ist nicht verfügbar
| MSC8103VT1100F |
|
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MSC8122TVT6400V |
|
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 400MHz
Supplier Device Package: 431-FCPBGA (20x20)
Description: IC DSP QUAD 16B 400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 400MHz
Supplier Device Package: 431-FCPBGA (20x20)
Produkt ist nicht verfügbar
| MSC8126VT8000 |
|
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 500MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Description: IC DSP QUAD 16B 500MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MW4IC2230GNBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Produkt ist nicht verfügbar
| MWIC930GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Produkt ist nicht verfügbar
| MWIC930NR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Produkt ist nicht verfügbar
| MW4IC2230GNBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Produkt ist nicht verfügbar
| MWIC930GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Produkt ist nicht verfügbar
| MWIC930NR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 134.36 EUR |
| 10+ | 125.27 EUR |
| 25+ | 116.2 EUR |
| 100+ | 108.93 EUR |
| MRF5S19060NBR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-272-4
Description: FET RF 65V 1.99GHZ TO-272-4
Produkt ist nicht verfügbar
| MRF5S19060NR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-270-4
Description: FET RF 65V 1.99GHZ TO-270-4
Produkt ist nicht verfügbar