Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35029) > Seite 309 nach 584
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| OM13329,598 | NXP USA Inc. |
 Description: PCA9952 LED DEMO BOARDPackaging: Bulk Features: Dimmable Utilized IC / Part: PCA9952 Supplied Contents: Board(s) Outputs and Type: 16, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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| OM13330,598 | NXP USA Inc. |
Description: PCA9955 LED DEMO BOARD |
Produkt ist nicht verfügbar |
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| OM13332,598 | NXP USA Inc. |
Description: PCA9685 PWM DEMO BOARD Packaging: Bulk Features: Dimmable Utilized IC / Part: PCA9685 Supplied Contents: Board(s) Outputs and Type: 16, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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| OM13333,598 | NXP USA Inc. |
Description: PCA9635 PWM DEMO BOARD Packaging: Bulk Utilized IC / Part: PCA9635 Supplied Contents: Board(s) Outputs and Type: 16, Non-Isolated |
Produkt ist nicht verfügbar |
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| OM13481UL | NXP USA Inc. |
Description: NVT4555BS SIM CARD LT/LDO HVQFN1 |
Produkt ist nicht verfügbar |
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OM13488UL | NXP USA Inc. |
Description: UNIVERSAL 8-BIT GPIO DAUGHTER CA Packaging: Bulk Function: GPIO Type: Interface Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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OM13489UL | NXP USA Inc. |
Description: UNIVERSAL 16-BIT GPIO DAUGHTER C Packaging: Bulk Function: GPIO Type: Interface Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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OM13491UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 8 Quantity: 42 Pieces (5 Values - Mixed Quantities) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN Part Status: Active |
Produkt ist nicht verfügbar |
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OM13492UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 6, 8, 10 Quantity: 42 Pieces (7 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP |
Produkt ist nicht verfügbar |
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OM13493UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 14, 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: DHVQFN |
Produkt ist nicht verfügbar |
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| OM13494UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HVQFN |
Produkt ist nicht verfügbar |
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| OM13495UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 14, 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: TSSOP |
Produkt ist nicht verfügbar |
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| OM13496UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 16, 28 Quantity: 23 Pieces (4 Values - Mixed Quantities) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: QSOP, TSSOP28, XFBGA, XQFN Part Status: Active |
Produkt ist nicht verfügbar |
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| OM13497UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 24 Quantity: 18 Pieces (3 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HTSSOP, VFBGA, XFBGA |
Produkt ist nicht verfügbar |
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| OM13506UL | NXP USA Inc. |
Description: PCF8553 LCD DEMO BOARD |
Produkt ist nicht verfügbar |
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| OM13511UL | NXP USA Inc. |
Description: PCF8523 DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF8523 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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OM13513UL | NXP USA Inc. |
Description: PCF2127 PCF2129AT DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF2127T, PCF2129AT Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| OM13516UL | NXP USA Inc. |
Description: PCF85263B EVALUATION BOARD |
Produkt ist nicht verfügbar |
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| OM13517UL | NXP USA Inc. |
Description: PCA21125 DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCA21125 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| OM13519UL | NXP USA Inc. |
Description: PCA8565 DEMOBOARD |
Produkt ist nicht verfügbar |
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| OM13536UL | NXP USA Inc. |
Description: SA639DH DEMOBOARD Packaging: Bulk For Use With/Related Products: SA639 Type: Mixer Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| OM13537UL | NXP USA Inc. |
Description: SA630D DEMOBOARD Packaging: Bulk For Use With/Related Products: SA630 Frequency: 0Hz ~ 1GHz Type: Switch, SPDT Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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OM13561JP | NXP USA Inc. |
Description: DP-LVDS EVALUATION KIT FOR PTN34 Packaging: Bulk Function: Video Processing Type: Video Utilized IC / Part: PTN3460 Supplied Contents: Board(s) Primary Attributes: DisplayPort to LVDS Part Status: Active |
Produkt ist nicht verfügbar |
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| OM40004UL | NXP USA Inc. |
Description: LPC845 CAPACITIVE TOUCH DEV. KIT Packaging: Bulk Sensor Type: Touch, Capacitive Utilized IC / Part: LPC845 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL6408AEX1Z | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16X2QFN Packaging: Tape & Reel (TR) Features: POR Package / Case: 16-XFLGA Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-X2QFN (1.6x1.6) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K148EVB-Q176 | NXP USA Inc. |
Description: S32K148 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K148 Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12G128ACLH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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S9S12G128ACLHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
Produkt ist nicht verfügbar |
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S9S12G96ACLHR | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12G96ACLL | NXP USA Inc. | Description: IC MCU 16BIT 96KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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S9S12GN32ACFT | NXP USA Inc. | Description: IC MCU 16BIT 32KB FLASH 48QFN |
Produkt ist nicht verfügbar |
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S9S12GN32ACFTR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12VRP64F0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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SP5744BBK1AMKU6R | NXP USA Inc. | Description: IC MCU 32BIT 1.5MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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TFA9891UK/N1AZ | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.6W 49WLCSP Packaging: Tape & Reel (TR) Features: Depop, Short-Circuit and Thermal Protection Package / Case: 49-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm Supplier Device Package: 49-WLCSP (3.43x2.98) Part Status: Active |
Produkt ist nicht verfügbar |
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TFA9892AUK/N1BZ | NXP USA Inc. |
Description: IC AMP CLASS D MONO 6.6W 49WLCSP Packaging: Tape & Reel (TR) Features: Depop, Short-Circuit and Thermal Protection Package / Case: 49-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm Supplier Device Package: 49-WLCSP (3.63x3.13) Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1044T/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 300 mV Duplex: Half Part Status: Active |
Produkt ist nicht verfügbar |
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A1006TL/TA1NXZ | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 6HXSON Packaging: Cut Tape (CT) Package / Case: 6-XDFN Exposed Pad Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 6-HXSON (2x2) DigiKey Programmable: Not Verified |
auf Bestellung 28000 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1012ARDB-PC | NXP USA Inc. |
Description: LS1012A EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: LS1012A Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MC33MR2001TVKR2 | NXP USA Inc. |
Description: IC TX 77GHZ RADAR AUTO 89VFBGA |
Produkt ist nicht verfügbar |
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NVT2006BSHP | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16DHVQFN Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 16-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 16-DHVQFN (2.5x3.5) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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| PC33MR2001RVKR2 | NXP USA Inc. | Description: IC RX 77GHZ RADAR AUTO |
Produkt ist nicht verfügbar |
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| PC33MR2001VVKR2 | NXP USA Inc. | Description: IC VCO 77GHZ RADAR AUTO |
Produkt ist nicht verfügbar |
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| PMMA1210KEGR2 | NXP USA Inc. |
Description: IC ACCEL Z- AXIS 100G |
Produkt ist nicht verfügbar |
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| PMMA1220KEGR2 | NXP USA Inc. |
Description: IC ACCEL LOW G Z-AXIS Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PMMA1251KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS |
Produkt ist nicht verfügbar |
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| PMMA1252KEGR2 | NXP USA Inc. |
Description: IC ACCEL 5G Z-AXIS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| PMMA2204KEGR2 | NXP USA Inc. |
Description: IC ACCEL X-AXIS 100G ROHS Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PMMA2244KEGR2 | NXP USA Inc. |
Description: IC ACCEL 20G X-AXIS Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PMMA2300KEGR2 | NXP USA Inc. | Description: IC ACCEL X-AXIS 250G NOMINAL |
Produkt ist nicht verfügbar |
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| PMMA3201KEGR2 | NXP USA Inc. | Description: IC ACCEL XY AXIS 40G ROHS |
Produkt ist nicht verfügbar |
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| PMMA3202KEGR2 | NXP USA Inc. |
Description: IC ACCEL SMT LN XY SOIC-20 Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PMMA3204KEGR2 | NXP USA Inc. |
Description: IC ACCEL XY 100 / 30G SOIC-20 Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PMMA9553LR1 | NXP USA Inc. |
Description: IC ACCEL 3-AXIS LOW G PEDOMETER Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PSX1507AKEGT1 | NXP USA Inc. | Description: IC ACCEL ZEUS II Z-AXIS 200G |
Produkt ist nicht verfügbar |
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| PSX1508AKEGT1 | NXP USA Inc. |
Description: IC ACCEL ZEUS 11 Z-AXIS 50G Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF3555HV/N151,518 | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED HD RAD |
Produkt ist nicht verfügbar |
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| SAF5000EL/V100/S2Y | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED MULTI |
Produkt ist nicht verfügbar |
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| TDA18256HN/C1Y | NXP USA Inc. | Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
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| TEF5000EL/V1/S20Y | NXP USA Inc. | Description: WISPA-ITS |
Produkt ist nicht verfügbar |
| OM13329,598 |
|
Hersteller: NXP USA Inc.
Description: PCA9952 LED DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9952
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Description: PCA9952 LED DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9952
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| OM13332,598 |
|
Hersteller: NXP USA Inc.
Description: PCA9685 PWM DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9685
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Description: PCA9685 PWM DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9685
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| OM13333,598 |
|
Hersteller: NXP USA Inc.
Description: PCA9635 PWM DEMO BOARD
Packaging: Bulk
Utilized IC / Part: PCA9635
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Description: PCA9635 PWM DEMO BOARD
Packaging: Bulk
Utilized IC / Part: PCA9635
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Produkt ist nicht verfügbar
| OM13481UL |
|
Hersteller: NXP USA Inc.
Description: NVT4555BS SIM CARD LT/LDO HVQFN1
Description: NVT4555BS SIM CARD LT/LDO HVQFN1
Produkt ist nicht verfügbar
| OM13488UL |
|
Hersteller: NXP USA Inc.
Description: UNIVERSAL 8-BIT GPIO DAUGHTER CA
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
Description: UNIVERSAL 8-BIT GPIO DAUGHTER CA
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| OM13489UL |
|
Hersteller: NXP USA Inc.
Description: UNIVERSAL 16-BIT GPIO DAUGHTER C
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
Description: UNIVERSAL 16-BIT GPIO DAUGHTER C
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| OM13491UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 8
Quantity: 42 Pieces (5 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN
Part Status: Active
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 8
Quantity: 42 Pieces (5 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN
Part Status: Active
Produkt ist nicht verfügbar
| OM13492UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 6, 8, 10
Quantity: 42 Pieces (7 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 6, 8, 10
Quantity: 42 Pieces (7 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP
Produkt ist nicht verfügbar
| OM13493UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: DHVQFN
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: DHVQFN
Produkt ist nicht verfügbar
| OM13494UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVQFN
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVQFN
Produkt ist nicht verfügbar
| OM13495UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: TSSOP
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
| OM13496UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 28
Quantity: 23 Pieces (4 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: QSOP, TSSOP28, XFBGA, XQFN
Part Status: Active
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 28
Quantity: 23 Pieces (4 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: QSOP, TSSOP28, XFBGA, XQFN
Part Status: Active
Produkt ist nicht verfügbar
| OM13497UL |
|
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 24
Quantity: 18 Pieces (3 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HTSSOP, VFBGA, XFBGA
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 24
Quantity: 18 Pieces (3 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HTSSOP, VFBGA, XFBGA
Produkt ist nicht verfügbar
| OM13511UL |
|
Hersteller: NXP USA Inc.
Description: PCF8523 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF8523
Supplied Contents: Board(s)
Part Status: Active
Description: PCF8523 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF8523
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| OM13513UL |
|
Hersteller: NXP USA Inc.
Description: PCF2127 PCF2129AT DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2127T, PCF2129AT
Supplied Contents: Board(s)
Description: PCF2127 PCF2129AT DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2127T, PCF2129AT
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| OM13516UL |
|
Hersteller: NXP USA Inc.
Description: PCF85263B EVALUATION BOARD
Description: PCF85263B EVALUATION BOARD
Produkt ist nicht verfügbar
| OM13517UL |
Hersteller: NXP USA Inc.
Description: PCA21125 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCA21125
Supplied Contents: Board(s)
Description: PCA21125 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCA21125
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| OM13536UL |
|
Hersteller: NXP USA Inc.
Description: SA639DH DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA639
Type: Mixer
Supplied Contents: Board(s)
Description: SA639DH DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA639
Type: Mixer
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| OM13537UL |
|
Hersteller: NXP USA Inc.
Description: SA630D DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA630
Frequency: 0Hz ~ 1GHz
Type: Switch, SPDT
Supplied Contents: Board(s)
Description: SA630D DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA630
Frequency: 0Hz ~ 1GHz
Type: Switch, SPDT
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| OM13561JP |
Hersteller: NXP USA Inc.
Description: DP-LVDS EVALUATION KIT FOR PTN34
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Part Status: Active
Description: DP-LVDS EVALUATION KIT FOR PTN34
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Part Status: Active
Produkt ist nicht verfügbar
| OM40004UL |
|
Hersteller: NXP USA Inc.
Description: LPC845 CAPACITIVE TOUCH DEV. KIT
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: LPC845
Supplied Contents: Board(s)
Part Status: Active
Description: LPC845 CAPACITIVE TOUCH DEV. KIT
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: LPC845
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 130.87 EUR |
| PCAL6408AEX1Z |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16X2QFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-X2QFN (1.6x1.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16X2QFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-X2QFN (1.6x1.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5000+ | 0.93 EUR |
| S32K148EVB-Q176 |
|
Hersteller: NXP USA Inc.
Description: S32K148 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K148
Part Status: Active
Description: S32K148 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K148
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 343.55 EUR |
| S9S12G128ACLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
| S9S12G128ACLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Produkt ist nicht verfügbar
| S9S12G96ACLHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12G96ACLL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 100LQFP
Description: IC MCU 16BIT 96KB FLASH 100LQFP
Produkt ist nicht verfügbar
| S9S12GN32ACFT |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Description: IC MCU 16BIT 32KB FLASH 48QFN
Produkt ist nicht verfügbar
| S9S12GN32ACFTR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12VRP64F0VLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
| SP5744BBK1AMKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
| TFA9891UK/N1AZ |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
Produkt ist nicht verfügbar
| TFA9892AUK/N1BZ |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.63x3.13)
Part Status: Active
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.63x3.13)
Part Status: Active
Produkt ist nicht verfügbar
| TJA1044T/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
| A1006TL/TA1NXZ |
Hersteller: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XDFN Exposed Pad
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 6-HXSON (2x2)
DigiKey Programmable: Not Verified
Description: IC SECURE AUTHENTICATOR 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XDFN Exposed Pad
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 6-HXSON (2x2)
DigiKey Programmable: Not Verified
auf Bestellung 28000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.83 EUR |
| 11+ | 1.67 EUR |
| 25+ | 1.65 EUR |
| 50+ | 1.64 EUR |
| 100+ | 1.47 EUR |
| 250+ | 1.45 EUR |
| 500+ | 1.43 EUR |
| 1000+ | 1.38 EUR |
| LS1012ARDB-PC |
|
Hersteller: NXP USA Inc.
Description: LS1012A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Part Status: Obsolete
Description: LS1012A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC33MR2001TVKR2 |
|
Hersteller: NXP USA Inc.
Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
| NVT2006BSHP |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16DHVQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 16DHVQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
| PC33MR2001RVKR2 |
Hersteller: NXP USA Inc.
Description: IC RX 77GHZ RADAR AUTO
Description: IC RX 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
| PC33MR2001VVKR2 |
Hersteller: NXP USA Inc.
Description: IC VCO 77GHZ RADAR AUTO
Description: IC VCO 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
| PMMA1210KEGR2 |
|
Hersteller: NXP USA Inc.
Description: IC ACCEL Z- AXIS 100G
Description: IC ACCEL Z- AXIS 100G
Produkt ist nicht verfügbar
| PMMA1220KEGR2 |
|
Hersteller: NXP USA Inc.
Description: IC ACCEL LOW G Z-AXIS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL LOW G Z-AXIS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PMMA1252KEGR2 |
Produkt ist nicht verfügbar
| PMMA2204KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X-AXIS 100G ROHS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL X-AXIS 100G ROHS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PMMA2244KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL 20G X-AXIS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL 20G X-AXIS
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PMMA2300KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X-AXIS 250G NOMINAL
Description: IC ACCEL X-AXIS 250G NOMINAL
Produkt ist nicht verfügbar
| PMMA3201KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL XY AXIS 40G ROHS
Description: IC ACCEL XY AXIS 40G ROHS
Produkt ist nicht verfügbar
| PMMA3202KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL SMT LN XY SOIC-20
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL SMT LN XY SOIC-20
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PMMA3204KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PMMA9553LR1 |
Hersteller: NXP USA Inc.
Description: IC ACCEL 3-AXIS LOW G PEDOMETER
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL 3-AXIS LOW G PEDOMETER
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PSX1507AKEGT1 |
Hersteller: NXP USA Inc.
Description: IC ACCEL ZEUS II Z-AXIS 200G
Description: IC ACCEL ZEUS II Z-AXIS 200G
Produkt ist nicht verfügbar
| PSX1508AKEGT1 |
Hersteller: NXP USA Inc.
Description: IC ACCEL ZEUS 11 Z-AXIS 50G
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC ACCEL ZEUS 11 Z-AXIS 50G
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF3555HV/N151,518 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED HD RAD
Description: IC INTERFACE SPECIALIZED HD RAD
Produkt ist nicht verfügbar
| SAF5000EL/V100/S2Y |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED MULTI
Description: IC INTERFACE SPECIALIZED MULTI
Produkt ist nicht verfügbar
| TDA18256HN/C1Y |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar