OM13496UL NXP USA Inc.
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 28
Quantity: 23 Pieces (4 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: QSOP, TSSOP28, XFBGA, XQFN
Part Status: Active
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 28
Quantity: 23 Pieces (4 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: QSOP, TSSOP28, XFBGA, XQFN
Part Status: Active
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Technische Details OM13496UL NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION, Packaging: Bulk, Number of Positions: 16, 28, Quantity: 23 Pieces (4 Values - Mixed Quantities), Kit Type: Adapter, Breakout Boards, Specifications: SMD to DIP, Package Accepted: QSOP, TSSOP28, XFBGA, XQFN, Part Status: Active.
Weitere Produktangebote OM13496UL
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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OM13496UL | Hersteller : NXP Semiconductors | Daughter Cards & OEM Boards Surface Mount to DIP Evaluation Board |
Produkt ist nicht verfügbar |