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MHT1002NR3 MHT1002NR3 NXP USA Inc. Description: IC RF AMP 915MHZ OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 915MHz
Voltage - Supply: 48V
Gain: 20.7dB
P1dB: 55.9dBm
Test Frequency: 915MHz
Supplier Device Package: OM-780-4L
Part Status: Obsolete
Produkt ist nicht verfügbar
MHT1000HR5 MHT1000HR5 NXP USA Inc. MHT1000HR5.pdf Description: IC RF AMP 2.45GHZ NI-880H-2L
Produkt ist nicht verfügbar
M82170G13 NXP USA Inc. Description: IC MPU 1.2GHZ 672TEPBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 672-TEPBGA (27x27)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
MKM33Z128CLH5R MKM33Z128CLH5R NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64CLL5R MKM33Z64CLL5R NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BRKT-STBC-AGM01 BRKT-STBC-AGM01 NXP USA Inc. BRKT-STBC-AGM01-QRC.pdf Description: BREAKOUT BOARD LEON2 GAUSS
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXAS21002, FXOS8700
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
DLD-MCTB-MKVXX-N NXP USA Inc. Motor%20Control%20Dev%20Toolbox.pdf Description: DEV TOOLBOX LIC MATLAB/SIMULINK
Produkt ist nicht verfügbar
EVB-VF522R3 NXP USA Inc. EVBVF522R3QSG.pdf Description: VF5XX EVAL BRD
Produkt ist nicht verfügbar
FRDM-17511EP-EVB NXP USA Inc. KTFRDM17511EPUG.pdf Description: FREEDOM EVAL BOARD MPC17511
Produkt ist nicht verfügbar
FRDM-17531EP-EVB NXP USA Inc. MPC17531A.pdf Description: FREEDOM EVAL BOARD MPC17531
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-17533EV-EVB NXP USA Inc. MPC17533.pdf Description: FREEDOM EVAL BOARD MPC17533
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17533
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-17C724-EVB NXP USA Inc. MPC17C724.pdf Description: FREEDOM EVAL BOARD MPC17C524
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17C724
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-34933EP-EVB NXP USA Inc. KTFRDM34933EPUG.pdf Description: FREEDOM EVAL BOARD MC34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Produkt ist nicht verfügbar
FRDM-K22F-AGM01 FRDM-K22F-AGM01 NXP USA Inc. frdm-k22f-agm01-reference-card.pdf Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K22, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+110.6 EUR
FRDM-K64F-AGM01 FRDM-K64F-AGM01 NXP USA Inc. FXOS8700CQ.pdf Description: EVB KIT FRDM-K64F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
FRDM-KL27Z FRDM-KL27Z NXP USA Inc. LSERIESKL2FS.pdf Description: FREEDOM KL17/KL27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27
Platform: Freedom
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
1+82.23 EUR
FRDM-SFUSION NXP USA Inc. Description: KIT FRDM-K64F FRDM-FXS-MULTI-B
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
FRDM-SFUSION-S NXP USA Inc. Description: KIT FRDM-K64F FRDM-FXS-MULTI-BHW
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
KIT12XS6EVM NXP USA Inc. Description: EVAL KIT MC12XS6 BULB DRIVER
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT33664EVB NXP USA Inc. MC33771,MC33664.pdf Description: EVAL KIT MC33664 ISO NTWK TXRX
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
KIT33882EKEVB NXP USA Inc. KT33882UG.pdf Description: EVAL KIT MC33882 SW SPI PAR INP
Produkt ist nicht verfügbar
KIT33907LAEEVB NXP USA Inc. Description: EVAL KIT MC33907 SBC BUCK BOOST
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33907
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
KIT33908LAEEVB NXP USA Inc. KT33907-33908LUG.pdf Description: EVAL KIT MC33908 SBC BUCK BOOST
Produkt ist nicht verfügbar
KIT33978EKEVB NXP USA Inc. Description: EVAL KIT MC33978 SWITCH DETECT
Packaging: Bulk
Function: Switch Detection
Type: Interface
Utilized IC / Part: MC33978
Supplied Contents: Board(s)
Primary Attributes: 22-Channel
Part Status: Active
Produkt ist nicht verfügbar
KIT34CM0902EFEVB NXP USA Inc. KIT3xCM0902EFEVB.pdf Description: EVAL KIT MC34CM0902 CAN TXRX
Packaging: Bulk
Type: Interface
Utilized IC / Part: MC34CM0902
Supplied Contents: Board(s)
Primary Attributes: 2-Channel (Dual)
Part Status: Obsolete
Produkt ist nicht verfügbar
KITPT2000FRDM3C NXP USA Inc. Description: FREEDOM PLATFORM PT2000 DRIVER
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
KITPT2000FRDM6C NXP USA Inc. Description: KIT FREEDOM PT2000
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
KITVALVECNTLEVM NXP USA Inc. KTVALVECNTLEVMUG.pdf Description: EVAL KIT ABS ESP PWR MGMT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34SB0800 MC34SB0410
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
RAPPID5748GSW-N NXP USA Inc. MPC5748G.pdf Description: SOFTWARE MPC5748G SHIPPED W/LIC
Packaging: Bulk
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Produkt ist nicht verfügbar
RDAIRBAGPSI5 NXP USA Inc. www.nxp.com Description: REF DESIGN PSI5 AIRBAG SPC560X
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
RDAIRBAGPSI5-1 NXP USA Inc. Description: REF DESIGN AIRBAG SPC560X MCU
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
T2080RDB-PB NXP USA Inc. T2080FS.pdf Description: T2080 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Obsolete
Produkt ist nicht verfügbar
T4240PCIE-PB NXP USA Inc. T4240_PB.pdf Description: T4240 EVAL BRD
Produkt ist nicht verfügbar
TWR-34933EVB NXP USA Inc. MC34933.pdf Description: EVALUATION BOARD TWR-34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Produkt ist nicht verfügbar
TWR-KM34Z50MV3 NXP USA Inc. KNTSKM3XFS.pdf Description: TOWER SYSTEM KM1X/KM3X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KM1x, KM3x
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-MC-MVHB1EVB NXP USA Inc. Description: TOWER SYSTEM KIT MC33932 MC33926
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926, MC33932
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
MK22FN128CAK10R NXP USA Inc. K22P49M100SF9.pdf Description: IC MCU 32BIT 128KB FLASH 49WLCSP
Produkt ist nicht verfügbar
MK22FN256CAP12R MK22FN256CAP12R NXP USA Inc. K22P80M120SF7.pdf Description: IC MCU 32BIT 256KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN512CAP12R MK22FN512CAP12R NXP USA Inc. K22P80M120SF7.pdf Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NT3H1101W0FHKH NT3H1101W0FHKH NXP USA Inc. NT3H1101_NT3H1201_DS.pdf Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
NT3H1201W0FHKH NT3H1201W0FHKH NXP USA Inc. NT3H1101_NT3H1201_DS.pdf Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MC14489BDWER2 MC14489BDWER2 NXP USA Inc. MC14489B.pdf Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
auf Bestellung 11708 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.52 EUR
10+ 13.11 EUR
25+ 12.5 EUR
100+ 10.86 EUR
250+ 10.37 EUR
500+ 9.45 EUR
Mindestbestellmenge: 2
MC33660EFR2 MC33660EFR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Obsolete
Produkt ist nicht verfügbar
BB171X BB171X NXP USA Inc. BB171.pdf Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22
Produkt ist nicht verfügbar
BB172X BB172X NXP USA Inc. BB172.pdf Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
auf Bestellung 18006 Stücke:
Lieferzeit 10-14 Tag (e)
21+0.86 EUR
27+ 0.67 EUR
100+ 0.4 EUR
500+ 0.37 EUR
1000+ 0.25 EUR
Mindestbestellmenge: 21
BB174X BB174X NXP USA Inc. BB174.pdf Description: DIODE VHF VAR CAP 30V SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-523
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
auf Bestellung 23858 Stücke:
Lieferzeit 10-14 Tag (e)
21+0.86 EUR
27+ 0.66 EUR
100+ 0.4 EUR
500+ 0.37 EUR
1000+ 0.25 EUR
Mindestbestellmenge: 21
BFU768F,115 BFU768F,115 NXP USA Inc. BFU768F.pdf Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Part Status: Active
auf Bestellung 311 Stücke:
Lieferzeit 10-14 Tag (e)
25+0.72 EUR
29+ 0.62 EUR
100+ 0.43 EUR
Mindestbestellmenge: 25
BGA2714,115 BGA2714,115 NXP USA Inc. BGA2714_Rev1.pdf Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.7GHz
Voltage - Supply: 4V
Gain: 22dB
Current - Supply: 10mA
Noise Figure: 3dB
P1dB: -9dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
GTL2003PW,118 GTL2003PW,118 NXP USA Inc. GTL2003.pdf Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
GTL2014PW,118 GTL2014PW,118 NXP USA Inc. GTL2014.pdf Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
Produkt ist nicht verfügbar
GTL2107PW,118 GTL2107PW,118 NXP USA Inc. GTL2107.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 2245 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.36 EUR
10+ 3.02 EUR
25+ 2.85 EUR
100+ 2.43 EUR
250+ 2.28 EUR
500+ 1.99 EUR
1000+ 1.65 EUR
Mindestbestellmenge: 6
KMZ41,118 KMZ41,118 NXP USA Inc. KMZ41.pdf Description: SENSOR MR ANALOG 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: X, Y
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
KTY82/220,215 KTY82/220,215 NXP USA Inc. KTY82_SER.pdf Description: SENSOR PTC 2KOHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2 kOhms
Produkt ist nicht verfügbar
KTY82/222,215 KTY82/222,215 NXP USA Inc. KTY82_SER.pdf Description: SENSOR PTC 2.02KOHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2.02 kOhms
Produkt ist nicht verfügbar
LPC1114FDH28/102:5 LPC1114FDH28/102:5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Verified
auf Bestellung 17501 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.21 EUR
10+ 3.28 EUR
100+ 2.69 EUR
500+ 2.63 EUR
1000+ 2.43 EUR
Mindestbestellmenge: 5
LPC812M101JD20J LPC812M101JD20J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SO
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.01 EUR
10+ 3.13 EUR
100+ 2.51 EUR
500+ 2.38 EUR
1000+ 1.97 EUR
Mindestbestellmenge: 5
MF1S5030XDA4/V1J MF1S5030XDA4/V1J NXP USA Inc. MF1S50yyX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 16834 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.41 EUR
10+ 2.15 EUR
25+ 2.05 EUR
100+ 1.68 EUR
250+ 1.57 EUR
500+ 1.39 EUR
1000+ 1.1 EUR
2500+ 1.02 EUR
5000+ 0.97 EUR
Mindestbestellmenge: 8
N74F273AD,623 N74F273AD,623 NXP USA Inc. 74F273A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
NT2H0301F0DTL,125 NT2H0301F0DTL,125 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Cut Tape (CT)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
auf Bestellung 4040 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.83 EUR
11+ 1.63 EUR
25+ 1.55 EUR
100+ 1.27 EUR
250+ 1.19 EUR
500+ 1.05 EUR
1000+ 0.83 EUR
Mindestbestellmenge: 10
NT3H1101W0FHKH NT3H1101W0FHKH NXP USA Inc. NT3H1101_NT3H1201_DS.pdf Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
auf Bestellung 8549 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.55 EUR
10+ 2.27 EUR
25+ 2.16 EUR
100+ 1.77 EUR
250+ 1.66 EUR
500+ 1.47 EUR
1000+ 1.16 EUR
Mindestbestellmenge: 7
MHT1002NR3
MHT1002NR3
Hersteller: NXP USA Inc.
Description: IC RF AMP 915MHZ OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 915MHz
Voltage - Supply: 48V
Gain: 20.7dB
P1dB: 55.9dBm
Test Frequency: 915MHz
Supplier Device Package: OM-780-4L
Part Status: Obsolete
Produkt ist nicht verfügbar
MHT1000HR5 MHT1000HR5.pdf
MHT1000HR5
Hersteller: NXP USA Inc.
Description: IC RF AMP 2.45GHZ NI-880H-2L
Produkt ist nicht verfügbar
M82170G13
Hersteller: NXP USA Inc.
Description: IC MPU 1.2GHZ 672TEPBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 672-TEPBGA (27x27)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
MKM33Z128CLH5R MKMxxZxxCxx5.pdf
MKM33Z128CLH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64CLL5R MKMxxZxxCxx5.pdf
MKM33Z64CLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BRKT-STBC-AGM01 BRKT-STBC-AGM01-QRC.pdf
BRKT-STBC-AGM01
Hersteller: NXP USA Inc.
Description: BREAKOUT BOARD LEON2 GAUSS
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXAS21002, FXOS8700
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
DLD-MCTB-MKVXX-N Motor%20Control%20Dev%20Toolbox.pdf
Hersteller: NXP USA Inc.
Description: DEV TOOLBOX LIC MATLAB/SIMULINK
Produkt ist nicht verfügbar
EVB-VF522R3 EVBVF522R3QSG.pdf
Hersteller: NXP USA Inc.
Description: VF5XX EVAL BRD
Produkt ist nicht verfügbar
FRDM-17511EP-EVB KTFRDM17511EPUG.pdf
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MPC17511
Produkt ist nicht verfügbar
FRDM-17531EP-EVB MPC17531A.pdf
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MPC17531
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-17533EV-EVB MPC17533.pdf
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MPC17533
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17533
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-17C724-EVB MPC17C724.pdf
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MPC17C524
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17C724
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-34933EP-EVB KTFRDM34933EPUG.pdf
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MC34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Produkt ist nicht verfügbar
FRDM-K22F-AGM01 frdm-k22f-agm01-reference-card.pdf
FRDM-K22F-AGM01
Hersteller: NXP USA Inc.
Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K22, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+110.6 EUR
FRDM-K64F-AGM01 FXOS8700CQ.pdf
FRDM-K64F-AGM01
Hersteller: NXP USA Inc.
Description: EVB KIT FRDM-K64F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
FRDM-KL27Z LSERIESKL2FS.pdf
FRDM-KL27Z
Hersteller: NXP USA Inc.
Description: FREEDOM KL17/KL27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27
Platform: Freedom
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+82.23 EUR
FRDM-SFUSION
Hersteller: NXP USA Inc.
Description: KIT FRDM-K64F FRDM-FXS-MULTI-B
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
FRDM-SFUSION-S
Hersteller: NXP USA Inc.
Description: KIT FRDM-K64F FRDM-FXS-MULTI-BHW
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
KIT12XS6EVM
Hersteller: NXP USA Inc.
Description: EVAL KIT MC12XS6 BULB DRIVER
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT33664EVB MC33771,MC33664.pdf
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33664 ISO NTWK TXRX
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
KIT33882EKEVB KT33882UG.pdf
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33882 SW SPI PAR INP
Produkt ist nicht verfügbar
KIT33907LAEEVB
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33907 SBC BUCK BOOST
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33907
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
KIT33908LAEEVB KT33907-33908LUG.pdf
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33908 SBC BUCK BOOST
Produkt ist nicht verfügbar
KIT33978EKEVB
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33978 SWITCH DETECT
Packaging: Bulk
Function: Switch Detection
Type: Interface
Utilized IC / Part: MC33978
Supplied Contents: Board(s)
Primary Attributes: 22-Channel
Part Status: Active
Produkt ist nicht verfügbar
KIT34CM0902EFEVB KIT3xCM0902EFEVB.pdf
Hersteller: NXP USA Inc.
Description: EVAL KIT MC34CM0902 CAN TXRX
Packaging: Bulk
Type: Interface
Utilized IC / Part: MC34CM0902
Supplied Contents: Board(s)
Primary Attributes: 2-Channel (Dual)
Part Status: Obsolete
Produkt ist nicht verfügbar
KITPT2000FRDM3C
Hersteller: NXP USA Inc.
Description: FREEDOM PLATFORM PT2000 DRIVER
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
KITPT2000FRDM6C
Hersteller: NXP USA Inc.
Description: KIT FREEDOM PT2000
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
KITVALVECNTLEVM KTVALVECNTLEVMUG.pdf
Hersteller: NXP USA Inc.
Description: EVAL KIT ABS ESP PWR MGMT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34SB0800 MC34SB0410
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
RAPPID5748GSW-N MPC5748G.pdf
Hersteller: NXP USA Inc.
Description: SOFTWARE MPC5748G SHIPPED W/LIC
Packaging: Bulk
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Produkt ist nicht verfügbar
RDAIRBAGPSI5 www.nxp.com
Hersteller: NXP USA Inc.
Description: REF DESIGN PSI5 AIRBAG SPC560X
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
RDAIRBAGPSI5-1
Hersteller: NXP USA Inc.
Description: REF DESIGN AIRBAG SPC560X MCU
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
T2080RDB-PB T2080FS.pdf
Hersteller: NXP USA Inc.
Description: T2080 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Obsolete
Produkt ist nicht verfügbar
T4240PCIE-PB T4240_PB.pdf
Hersteller: NXP USA Inc.
Description: T4240 EVAL BRD
Produkt ist nicht verfügbar
TWR-34933EVB MC34933.pdf
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD TWR-34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Produkt ist nicht verfügbar
TWR-KM34Z50MV3 KNTSKM3XFS.pdf
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KM1X/KM3X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KM1x, KM3x
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-MC-MVHB1EVB
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KIT MC33932 MC33926
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926, MC33932
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
MK22FN128CAK10R K22P49M100SF9.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 49WLCSP
Produkt ist nicht verfügbar
MK22FN256CAP12R K22P80M120SF7.pdf
MK22FN256CAP12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN512CAP12R K22P80M120SF7.pdf
MK22FN512CAP12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NT3H1101W0FHKH NT3H1101_NT3H1201_DS.pdf
NT3H1101W0FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
NT3H1201W0FHKH NT3H1101_NT3H1201_DS.pdf
NT3H1201W0FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MC14489BDWER2 MC14489B.pdf
MC14489BDWER2
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
auf Bestellung 11708 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.52 EUR
10+ 13.11 EUR
25+ 12.5 EUR
100+ 10.86 EUR
250+ 10.37 EUR
500+ 9.45 EUR
Mindestbestellmenge: 2
MC33660EFR2
MC33660EFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Obsolete
Produkt ist nicht verfügbar
BB171X BB171.pdf
BB171X
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22
Produkt ist nicht verfügbar
BB172X BB172.pdf
BB172X
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
auf Bestellung 18006 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
21+0.86 EUR
27+ 0.67 EUR
100+ 0.4 EUR
500+ 0.37 EUR
1000+ 0.25 EUR
Mindestbestellmenge: 21
BB174X BB174.pdf
BB174X
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 30V SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-523
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
auf Bestellung 23858 Stücke:
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21+0.86 EUR
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BFU768F,115 BFU768F.pdf
BFU768F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Part Status: Active
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25+0.72 EUR
29+ 0.62 EUR
100+ 0.43 EUR
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BGA2714,115 BGA2714_Rev1.pdf
BGA2714,115
Hersteller: NXP USA Inc.
Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.7GHz
Voltage - Supply: 4V
Gain: 22dB
Current - Supply: 10mA
Noise Figure: 3dB
P1dB: -9dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
GTL2003PW,118 GTL2003.pdf
GTL2003PW,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
GTL2014PW,118 GTL2014.pdf
GTL2014PW,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
Produkt ist nicht verfügbar
GTL2107PW,118 GTL2107.pdf
GTL2107PW,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 2245 Stücke:
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6+3.36 EUR
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25+ 2.85 EUR
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500+ 1.99 EUR
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KMZ41,118 KMZ41.pdf
KMZ41,118
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: X, Y
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
KTY82/220,215 KTY82_SER.pdf
KTY82/220,215
Hersteller: NXP USA Inc.
Description: SENSOR PTC 2KOHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2 kOhms
Produkt ist nicht verfügbar
KTY82/222,215 KTY82_SER.pdf
KTY82/222,215
Hersteller: NXP USA Inc.
Description: SENSOR PTC 2.02KOHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2.02 kOhms
Produkt ist nicht verfügbar
LPC1114FDH28/102:5 LPC111X.pdf
LPC1114FDH28/102:5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Verified
auf Bestellung 17501 Stücke:
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5+4.21 EUR
10+ 3.28 EUR
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LPC812M101JD20J LPC81XM.pdf
LPC812M101JD20J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SO
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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5+4.01 EUR
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MF1S5030XDA4/V1J MF1S50yyX_V1.pdf
MF1S5030XDA4/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
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N74F273AD,623 74F273A.pdf
N74F273AD,623
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
NT2H0301F0DTL,125
NT2H0301F0DTL,125
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Cut Tape (CT)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
auf Bestellung 4040 Stücke:
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10+1.83 EUR
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NT3H1101W0FHKH NT3H1101_NT3H1201_DS.pdf
NT3H1101W0FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
auf Bestellung 8549 Stücke:
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7+2.55 EUR
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