Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35283) > Seite 261 nach 589
Foto | Bezeichnung | Hersteller | Beschreibung |
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SSL5237TE/1Y | NXP USA Inc. |
Description: IC LED DRV OFFL TRIAC 800MA 8HSO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 1 Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 160°C (TJ) Current - Output / Channel: 800mA Internal Switch(s): Yes Topology: Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 8-HSO Dimming: Triac Voltage - Supply (Min): 9.9V Voltage - Supply (Max): 16V Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
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SSL6203TW/1J | NXP USA Inc. |
Description: IC LED DRIVER DIMMABLE 20HSSOP Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA1731LTS/1H | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: SC-74 Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 21.5 V Power (Watts): 75 W |
Produkt ist nicht verfügbar |
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TEA1731TS/1H | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: SC-74 Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 21.5 V Power (Watts): 75 W |
Produkt ist nicht verfügbar |
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TEA1832TS/1X | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 36kHz ~ 130kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V |
Produkt ist nicht verfügbar |
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TEA6850HN/V102K | NXP USA Inc. | Description: RF RCVR FM 50KHZ-500KHZ 32QFN |
Produkt ist nicht verfügbar |
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TEA6850HN/V102Y | NXP USA Inc. | Description: RF RCVR FM 50KHZ-500KHZ 32QFN |
Produkt ist nicht verfügbar |
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TEA6851HN/V102K | NXP USA Inc. |
Description: IC TUNER CAR RADIO 32QFN Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA6851HN/V102Y | NXP USA Inc. |
Description: IC TUNER CAR RADIO 32QFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA6852HN/V102K | NXP USA Inc. |
Description: IC TUNER CAR RADIO 32QFN Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA6852HN/V102Y | NXP USA Inc. |
Description: IC TUNER CAR RADIO 32QFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA6853HN/V102K | NXP USA Inc. |
Description: IC TUNER CAR RADIO 32QFN Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA6853HN/V102Y | NXP USA Inc. |
Description: IC TUNER CAR RADIO 32QFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEF6635HW/V106K | NXP USA Inc. |
Description: IC DGTL CHIP AUTO RADIO 100HTQFP Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14x14) |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF6635HW/V106Y | NXP USA Inc. | Description: IC DGTL CHIP AUTO RADIO 100HTQFP |
Produkt ist nicht verfügbar |
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TEF6638HW/V106K | NXP USA Inc. |
Description: RF RCVR 100HTQFP Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14x14) Part Status: Obsolete |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF6638HW/V106Y | NXP USA Inc. |
Description: IC DGTL CHIP AUTO RADIO 100HTQFP Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TJA1043T/1J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1043TK/1Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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VLG-MC9S12ZVC | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912ZVCA19F0MKH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 16x12b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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OM13518,598 | NXP USA Inc. |
![]() Packaging: Box Accessory Type: Interface Board Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33907NAE | NXP USA Inc. |
Description: IC REG AUTO APPL 6OUT 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33908NAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33907NAER2 | NXP USA Inc. |
Description: IC REG AUTO APPL 6OUT 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC33908NAER2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FXTH8715026T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH871502DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH8715117T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH871511DT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH8715026T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH871502DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH8715117T1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 2050 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH871511DT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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M83240G13 | NXP USA Inc. | Description: IC C1K 450MHZ VOIP 484MAPBGA |
Produkt ist nicht verfügbar |
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M83242G13 | NXP USA Inc. |
Description: IC TELECOM INTERFACE 448BGA Packaging: Tray |
Produkt ist nicht verfügbar |
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M83261G13 | NXP USA Inc. | Description: IC TELECOM INTERFACE 448BGA |
Produkt ist nicht verfügbar |
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M86262G12 | NXP USA Inc. | Description: IC TELECOM INTERFACE 625BGA |
Produkt ist nicht verfügbar |
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M86292G12 | NXP USA Inc. | Description: IC C2K 900MHZ 8CH VOIP 625FCBGA |
Produkt ist nicht verfügbar |
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M83263G13 | NXP USA Inc. | Description: IC TELECOM INTERFACE 448BGA |
Produkt ist nicht verfügbar |
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S9S12XS64J1MAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX6X1EVO10AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6X1CVO08AB | NXP USA Inc. |
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auf Bestellung 79 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X1EVK10AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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S9KEAZ64ACLK | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 71 |
Produkt ist nicht verfügbar |
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S9KEAZ64AMLK | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 71 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKW30Z160VHM4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Sensitivity: -91dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 160kB Flash, 20kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.45V ~ 3.6V Power - Output: 5dBm Protocol: Bluetooth v4.1 Current - Receiving: 6.5mA ~ 15.4mA Data Rate (Max): 1Mbps Current - Transmitting: 8.4mA ~ 18.5mA Supplier Device Package: 32-QFN (5x5) GPIO: 15 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 930 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZ128AVLK | NXP USA Inc. |
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auf Bestellung 208 Stücke: Lieferzeit 10-14 Tag (e) |
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MK12DN512VLH5R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKW40Z160VHT4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-VFLGA Sensitivity: -102dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 160kB Flash, 20kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.45V ~ 3.6V Power - Output: 5dBm Protocol: Bluetooth v4.1, ZigbeePRO® Current - Receiving: 6.5mA ~ 15.4mA Data Rate (Max): 1Mbps Current - Transmitting: 8.4mA ~ 18.5mA Supplier Device Package: 64-VFLGA (7x7) GPIO: 28 Modulation: GFSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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MK11DN512VLK5R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Obsolete Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK22DN512VDC5R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGA Packaging: Tape & Reel (TR) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 56 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK20DX256VLK10R | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MK20FN1M0VLQ12R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 58x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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T1022NSN7MQB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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T1022NSE7MQB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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T1020NSN7MQB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (12) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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T1042NSE7MQB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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T1040NSN7MQB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (12) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
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T1022NSN7PQB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
SSL5237TE/1Y |
Hersteller: NXP USA Inc.
Description: IC LED DRV OFFL TRIAC 800MA 8HSO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Current - Output / Channel: 800mA
Internal Switch(s): Yes
Topology: Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-HSO
Dimming: Triac
Voltage - Supply (Min): 9.9V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Description: IC LED DRV OFFL TRIAC 800MA 8HSO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Current - Output / Channel: 800mA
Internal Switch(s): Yes
Topology: Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-HSO
Dimming: Triac
Voltage - Supply (Min): 9.9V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
SSL6203TW/1J |
Hersteller: NXP USA Inc.
Description: IC LED DRIVER DIMMABLE 20HSSOP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC LED DRIVER DIMMABLE 20HSSOP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1731LTS/1H |
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Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: SC-74
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 21.5 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: SC-74
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 21.5 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
TEA1731TS/1H |
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Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: SC-74
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 21.5 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: SC-74
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 21.5 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
TEA1832TS/1X |
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Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 36kHz ~ 130kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 36kHz ~ 130kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Produkt ist nicht verfügbar
TEA6850HN/V102K |
Hersteller: NXP USA Inc.
Description: RF RCVR FM 50KHZ-500KHZ 32QFN
Description: RF RCVR FM 50KHZ-500KHZ 32QFN
Produkt ist nicht verfügbar
TEA6850HN/V102Y |
Hersteller: NXP USA Inc.
Description: RF RCVR FM 50KHZ-500KHZ 32QFN
Description: RF RCVR FM 50KHZ-500KHZ 32QFN
Produkt ist nicht verfügbar
TEA6851HN/V102K |
Produkt ist nicht verfügbar
TEA6851HN/V102Y |
Hersteller: NXP USA Inc.
Description: IC TUNER CAR RADIO 32QFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC TUNER CAR RADIO 32QFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA6852HN/V102K |
Produkt ist nicht verfügbar
TEA6852HN/V102Y |
Hersteller: NXP USA Inc.
Description: IC TUNER CAR RADIO 32QFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC TUNER CAR RADIO 32QFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA6853HN/V102K |
Produkt ist nicht verfügbar
TEA6853HN/V102Y |
Hersteller: NXP USA Inc.
Description: IC TUNER CAR RADIO 32QFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC TUNER CAR RADIO 32QFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
TEF6635HW/V106K |
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.21 EUR |
10+ | 20.09 EUR |
25+ | 18.51 EUR |
80+ | 16.92 EUR |
230+ | 15.86 EUR |
450+ | 14.81 EUR |
TEF6635HW/V106Y |
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Produkt ist nicht verfügbar
TEF6638HW/V106K |
Hersteller: NXP USA Inc.
Description: RF RCVR 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Obsolete
Description: RF RCVR 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Obsolete
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28.23 EUR |
10+ | 25.55 EUR |
25+ | 23.53 EUR |
80+ | 21.51 EUR |
230+ | 20.17 EUR |
450+ | 18.82 EUR |
TEF6638HW/V106Y |
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1043T/1J |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.5 EUR |
5000+ | 1.45 EUR |
TJA1043TK/1Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.47 EUR |
S912ZVCA19F0MKH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
OM13518,598 |
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Hersteller: NXP USA Inc.
Description: DEMO USB-I2C BUDS DONGLE
Packaging: Box
Accessory Type: Interface Board
Part Status: Obsolete
Description: DEMO USB-I2C BUDS DONGLE
Packaging: Box
Accessory Type: Interface Board
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33907NAE |
Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 17.2 EUR |
10+ | 15.8 EUR |
25+ | 15.15 EUR |
80+ | 13.35 EUR |
MC33908NAE |
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Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 17.71 EUR |
10+ | 16.26 EUR |
25+ | 15.59 EUR |
80+ | 13.73 EUR |
MC33907NAER2 |
Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33908NAER2 |
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Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Description: IC REG AUTO APPL 6OUT 48LQFP
Produkt ist nicht verfügbar
FXTH8715026T1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
FXTH871502DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
FXTH8715117T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2000+ | 11.12 EUR |
FXTH871511DT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
FXTH8715026T1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
FXTH871502DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
FXTH8715117T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 2050 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.85 EUR |
10+ | 15.88 EUR |
25+ | 14.69 EUR |
100+ | 12.71 EUR |
500+ | 11.91 EUR |
1000+ | 11.12 EUR |
FXTH871511DT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
M83240G13 |
Hersteller: NXP USA Inc.
Description: IC C1K 450MHZ VOIP 484MAPBGA
Description: IC C1K 450MHZ VOIP 484MAPBGA
Produkt ist nicht verfügbar
M83242G13 |
Produkt ist nicht verfügbar
M83261G13 |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 448BGA
Description: IC TELECOM INTERFACE 448BGA
Produkt ist nicht verfügbar
M86262G12 |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 625BGA
Description: IC TELECOM INTERFACE 625BGA
Produkt ist nicht verfügbar
M86292G12 |
Hersteller: NXP USA Inc.
Description: IC C2K 900MHZ 8CH VOIP 625FCBGA
Description: IC C2K 900MHZ 8CH VOIP 625FCBGA
Produkt ist nicht verfügbar
M83263G13 |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 448BGA
Description: IC TELECOM INTERFACE 448BGA
Produkt ist nicht verfügbar
S9S12XS64J1MAE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCIMX6X1EVO10AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX6X1CVO08AB |
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Hersteller: NXP USA Inc.
Description: IC MPU 32BIT I.MX6 800MHZ 400BGA
Description: IC MPU 32BIT I.MX6 800MHZ 400BGA
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)MCIMX6X1EVK10AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
S9KEAZ64ACLK |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 71
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 71
Produkt ist nicht verfügbar
S9KEAZ64AMLK |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 71
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 71
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKW30Z160VHM4 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v4.1
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 32-QFN (5x5)
GPIO: 15
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v4.1
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 32-QFN (5x5)
GPIO: 15
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 930 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.72 EUR |
10+ | 9.57 EUR |
25+ | 8.62 EUR |
80+ | 7.85 EUR |
230+ | 7.08 EUR |
490+ | 6.36 EUR |
S9KEAZ128AVLK |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Description: IC MCU 32BIT 128KB FLASH 80LQFP
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)MK12DN512VLH5R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKW40Z160VHT4 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v4.1, ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v4.1, ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.48 EUR |
10+ | 7.78 EUR |
25+ | 7.07 EUR |
80+ | 6.36 EUR |
260+ | 6.22 EUR |
MK11DN512VLK5R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Obsolete
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Obsolete
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22DN512VDC5R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK20DX256VLK10R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Produkt ist nicht verfügbar
MK20FN1M0VLQ12R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 58x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 58x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
500+ | 24.74 EUR |
T1022NSN7MQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
T1022NSE7MQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 209.21 EUR |
10+ | 172.53 EUR |
T1020NSN7MQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
T1042NSE7MQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 123.87 EUR |
10+ | 122.33 EUR |
T1040NSN7MQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (12)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
T1022NSN7PQB |
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Hersteller: NXP USA Inc.
Description: IC SOC 2CORE 1400MHZ 780FCBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC SOC 2CORE 1400MHZ 780FCBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Active
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