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S9S12C64J2CFAE S9S12C64J2CFAE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS128J1MAA S9S12XS128J1MAA NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
S9S12XS128J1MAL S9S12XS128J1MAL NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.7 EUR
10+ 11.73 EUR
80+ 10.7 EUR
Mindestbestellmenge: 2
SPC5516EAMMG66 SPC5516EAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5517EAMMG66 SPC5517EAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5517GAMMG66 SPC5517GAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5534MVM80 SPC5534MVM80 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Produkt ist nicht verfügbar
TWR-S08JE128 TWR-S08JE128 NXP USA Inc. Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JE
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-S08JE128-KIT TWR-S08JE128-KIT NXP USA Inc. www.nxp.com Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Produkt ist nicht verfügbar
TWR-WIFI-G1011MI TWR-WIFI-G1011MI NXP USA Inc. Description: TOWER WIFI MOD- GAINSPAN
Produkt ist nicht verfügbar
LPC1114FHN33/302,5 LPC1114FHN33/302,5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PK40X256VMD100 PK40X256VMD100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144BGA
Produkt ist nicht verfügbar
PK40X256VLQ100 PK40X256VLQ100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
PK60N256VMD100 PK60N256VMD100 NXP USA Inc. Description: IC MCU 32B 256KB FLASH 144MAPBGA
Produkt ist nicht verfügbar
SPC5634MF1MLQ80 SPC5634MF1MLQ80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
1+49.7 EUR
10+ 39.85 EUR
80+ 34.03 EUR
SPC5634MF1MMG80 SPC5634MF1MMG80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08SG16E1MTJR S9S08SG16E1MTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+4 EUR
Mindestbestellmenge: 2500
S9S08SG4E2VTGR S9S08SG4E2VTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
MC9S08QB8CTGR MC9S08QB8CTGR NXP USA Inc. 9S08QB84FS.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+2.93 EUR
Mindestbestellmenge: 5000
MRF8S23120HR3 MRF8S23120HR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
MRF8S23120HR5 MRF8S23120HR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
MRF8S23120HSR3 MRF8S23120HSR3 NXP USA Inc. Description: FET RF 65V 2.3GHZ NI-780S
Produkt ist nicht verfügbar
MRFE6VP61K25HR6 MRFE6VP61K25HR6 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
150+318.65 EUR
Mindestbestellmenge: 150
MRFE6VP61K25HSR5 MRFE6VP61K25HSR5 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MRFE6VP61K25HSR6 MRFE6VP61K25HSR6 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MPXV2050GP MPXV2050GP NXP USA Inc. MPXV2050.pdf Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.3%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.51 EUR
10+ 25.74 EUR
25+ 24.38 EUR
125+ 21 EUR
MPVZ5150GC7U MPVZ5150GC7U NXP USA Inc. MPVZ5150.pdf Description: PRESSURE SENSOR VERT 8-DIP
Produkt ist nicht verfügbar
MPVZ7025DP MPVZ7025DP NXP USA Inc. MPXV7025.pdf Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: ±3.63PSI (±25kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±29.01PSI (±200kPa)
Produkt ist nicht verfügbar
TWR-ADCDAC-LTC TWR-ADCDAC-LTC NXP USA Inc. Description: MOD ADC DAC TOWER LINEAR TECH
Packaging: Box
Function: ADC, DAC
Type: Data Acquisition
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Embedded: No
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+236.3 EUR
TRK-MPC5604B NXP USA Inc. MPC5604BQSG.pdf Description: STARTERTRAK MPC5604B EVAL BRD
Produkt ist nicht verfügbar
LPC1224FBD48/121,1 LPC1224FBD48/121,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 6085 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.33 EUR
10+ 8.85 EUR
80+ 7.25 EUR
500+ 7.1 EUR
1000+ 5.99 EUR
2500+ 5.69 EUR
Mindestbestellmenge: 2
LPC1224FBD64/101,1 LPC1224FBD64/101,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
LPC1225FBD48/301,1 LPC1225FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1225FBD64/301,1 LPC1225FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.21 EUR
10+ 9.55 EUR
160+ 7.82 EUR
480+ 7.66 EUR
960+ 6.46 EUR
Mindestbestellmenge: 2
LPC1225FBD64/321,1 LPC1225FBD64/321,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 80KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1226FBD48/301,1 LPC1226FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.2 EUR
10+ 9.59 EUR
80+ 7.94 EUR
Mindestbestellmenge: 2
LPC1226FBD64/301,1 LPC1226FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1227FBD48/301,1 LPC1227FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)
LPC1227FBD64/301,1 LPC1227FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 320 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.85 EUR
10+ 10.89 EUR
160+ 9.02 EUR
Mindestbestellmenge: 2
JN5139/001,531 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
JN5139/001,518 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
JN5139/Z01,531 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
JN5148/001,515 JN5148/001,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5148/001,518 JN5148/001,518 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NX3DV3899GU,115 NX3DV3899GU,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
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NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
Produkt ist nicht verfügbar
NX3DV3899GU,115 NX3DV3899GU,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
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NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Packaging: Cut Tape (CT)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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PBSS3515E,135 PBSS3515E,135 NXP USA Inc. DS_568_PBSS3515E.pdf Description: TRANS PNP 15V 0.5A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
BGX885N,112 BGX885N,112 NXP USA Inc. BGX885N.pdf Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 860MHz
RF Type: General Purpose
Voltage - Supply: 26V
Gain: 17.3dB
Current - Supply: 240mA
Noise Figure: 8dB
Test Frequency: 750MHz
Supplier Device Package: SFM9
Part Status: Obsolete
Produkt ist nicht verfügbar
S9S12C64J2CFAE MC9S12C128V1.pdf
S9S12C64J2CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS128J1MAA S12XSFS.pdf
S9S12XS128J1MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
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S9S12XS128J1MAL MC9S12XS256RMV1.pdf
S9S12XS128J1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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2+14.7 EUR
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80+ 10.7 EUR
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SPC5516EAMMG66 MPC5510PB.pdf
SPC5516EAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5517EAMMG66 MPC5510PB.pdf
SPC5517EAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5517GAMMG66 MPC5510PB.pdf
SPC5517GAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5534MVM80
SPC5534MVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Produkt ist nicht verfügbar
TWR-S08JE128
TWR-S08JE128
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JE
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-S08JE128-KIT www.nxp.com
TWR-S08JE128-KIT
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Produkt ist nicht verfügbar
TWR-WIFI-G1011MI
TWR-WIFI-G1011MI
Hersteller: NXP USA Inc.
Description: TOWER WIFI MOD- GAINSPAN
Produkt ist nicht verfügbar
LPC1114FHN33/302,5 LPC111X.pdf
LPC1114FHN33/302,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PK40X256VMD100
PK40X256VMD100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144BGA
Produkt ist nicht verfügbar
PK40X256VLQ100
PK40X256VLQ100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
PK60N256VMD100
PK60N256VMD100
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Produkt ist nicht verfügbar
SPC5634MF1MLQ80 MPC5634M.pdf
SPC5634MF1MLQ80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
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1+49.7 EUR
10+ 39.85 EUR
80+ 34.03 EUR
SPC5634MF1MMG80 MPC5634M.pdf
SPC5634MF1MMG80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08SG16E1MTJR MC9S08SG32.pdf
S9S08SG16E1MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+4 EUR
Mindestbestellmenge: 2500
S9S08SG4E2VTGR MC9S08SG8.pdf
S9S08SG4E2VTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
MC9S08QB8CTGR 9S08QB84FS.pdf
MC9S08QB8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+2.93 EUR
Mindestbestellmenge: 5000
MRF8S23120HR3
MRF8S23120HR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
MRF8S23120HR5
MRF8S23120HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
MRF8S23120HSR3
MRF8S23120HSR3
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.3GHZ NI-780S
Produkt ist nicht verfügbar
MRFE6VP61K25HR6 MRFE6VP61K25H.pdf
MRFE6VP61K25HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
150+318.65 EUR
Mindestbestellmenge: 150
MRFE6VP61K25HSR5 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MRFE6VP61K25HSR6 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MPXV2050GP MPXV2050.pdf
MPXV2050GP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.3%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.51 EUR
10+ 25.74 EUR
25+ 24.38 EUR
125+ 21 EUR
MPVZ5150GC7U MPVZ5150.pdf
MPVZ5150GC7U
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR VERT 8-DIP
Produkt ist nicht verfügbar
MPVZ7025DP MPXV7025.pdf
MPVZ7025DP
Hersteller: NXP USA Inc.
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: ±3.63PSI (±25kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±29.01PSI (±200kPa)
Produkt ist nicht verfügbar
TWR-ADCDAC-LTC
TWR-ADCDAC-LTC
Hersteller: NXP USA Inc.
Description: MOD ADC DAC TOWER LINEAR TECH
Packaging: Box
Function: ADC, DAC
Type: Data Acquisition
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Embedded: No
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+236.3 EUR
TRK-MPC5604B MPC5604BQSG.pdf
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5604B EVAL BRD
Produkt ist nicht verfügbar
LPC1224FBD48/121,1 LPC122X.pdf
LPC1224FBD48/121,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 6085 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.33 EUR
10+ 8.85 EUR
80+ 7.25 EUR
500+ 7.1 EUR
1000+ 5.99 EUR
2500+ 5.69 EUR
Mindestbestellmenge: 2
LPC1224FBD64/101,1 LPC122X.pdf
LPC1224FBD64/101,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
LPC1225FBD48/301,1 LPC122X.pdf
LPC1225FBD48/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1225FBD64/301,1 LPC122X.pdf
LPC1225FBD64/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.21 EUR
10+ 9.55 EUR
160+ 7.82 EUR
480+ 7.66 EUR
960+ 6.46 EUR
Mindestbestellmenge: 2
LPC1225FBD64/321,1 LPC122X.pdf
LPC1225FBD64/321,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1226FBD48/301,1 LPC122X.pdf
LPC1226FBD48/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.2 EUR
10+ 9.59 EUR
80+ 7.94 EUR
Mindestbestellmenge: 2
LPC1226FBD64/301,1 LPC122X.pdf
LPC1226FBD64/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1227FBD48/301,1 LPC122X.pdf
LPC1227FBD48/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)
LPC1227FBD64/301,1 LPC122X.pdf
LPC1227FBD64/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 320 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.85 EUR
10+ 10.89 EUR
160+ 9.02 EUR
Mindestbestellmenge: 2
JN5139/001,531 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
JN5139/001,518 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
JN5139/Z01,531 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
JN5148/001,515 JN5148-001.pdf
JN5148/001,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5148/001,518 JN5148-001.pdf
JN5148/001,518
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+0.49 EUR
Mindestbestellmenge: 5000
NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
auf Bestellung 3681 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.53 EUR
13+ 1.36 EUR
25+ 1.3 EUR
100+ 1.06 EUR
250+ 0.99 EUR
500+ 0.88 EUR
1000+ 0.69 EUR
Mindestbestellmenge: 12
NX3DV3899GU,115 NX3DV3899.pdf
NX3DV3899GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 11555 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+1.97 EUR
10+ 1.77 EUR
25+ 1.67 EUR
100+ 1.38 EUR
250+ 1.29 EUR
500+ 1.14 EUR
1000+ 0.9 EUR
Mindestbestellmenge: 9
NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 56000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+0.88 EUR
8000+ 0.83 EUR
12000+ 0.8 EUR
Mindestbestellmenge: 4000
NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+0.37 EUR
Mindestbestellmenge: 5000
NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
Produkt ist nicht verfügbar
NX3DV3899GU,115 NX3DV3899.pdf
NX3DV3899GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+0.84 EUR
8000+ 0.8 EUR
Mindestbestellmenge: 4000
NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Hersteller: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 6379 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13+1.37 EUR
15+ 1.2 EUR
25+ 1.13 EUR
100+ 0.92 EUR
250+ 0.86 EUR
500+ 0.73 EUR
1000+ 0.58 EUR
2500+ 0.53 EUR
Mindestbestellmenge: 13
NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 57240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+2.06 EUR
10+ 1.85 EUR
25+ 1.76 EUR
100+ 1.44 EUR
250+ 1.35 EUR
500+ 1.19 EUR
1000+ 0.94 EUR
Mindestbestellmenge: 9
NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 5807 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
18+1.02 EUR
20+ 0.9 EUR
25+ 0.85 EUR
100+ 0.69 EUR
250+ 0.64 EUR
500+ 0.55 EUR
1000+ 0.44 EUR
2500+ 0.4 EUR
Mindestbestellmenge: 18
NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13+1.36 EUR
15+ 1.21 EUR
25+ 1.15 EUR
100+ 0.94 EUR
250+ 0.88 EUR
Mindestbestellmenge: 13
NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Hersteller: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Cut Tape (CT)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
auf Bestellung 4616 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+2.16 EUR
10+ 1.93 EUR
25+ 1.83 EUR
100+ 1.51 EUR
250+ 1.41 EUR
500+ 1.24 EUR
1000+ 0.98 EUR
2500+ 0.92 EUR
Mindestbestellmenge: 9
PBSS3515E,135 DS_568_PBSS3515E.pdf
PBSS3515E,135
Hersteller: NXP USA Inc.
Description: TRANS PNP 15V 0.5A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
BGX885N,112 BGX885N.pdf
BGX885N,112
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 860MHz
RF Type: General Purpose
Voltage - Supply: 26V
Gain: 17.3dB
Current - Supply: 240mA
Noise Figure: 8dB
Test Frequency: 750MHz
Supplier Device Package: SFM9
Part Status: Obsolete
Produkt ist nicht verfügbar
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