Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35279) > Seite 110 nach 588
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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MRF282ZR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-200Z Mounting Type: Chassis Mount Frequency: 2GHz Power - Output: 10W Gain: 11.5dB Technology: LDMOS Supplier Device Package: NI-200Z Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 75 mA |
Produkt ist nicht verfügbar |
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MRF282SR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-200S Mounting Type: Chassis Mount Frequency: 2GHz Power - Output: 10W Gain: 11.5dB Technology: LDMOS Supplier Device Package: NI-200S Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 75 mA |
Produkt ist nicht verfügbar |
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MRF6S27050HSR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.62GHz Power - Output: 7W Gain: 16dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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MRF6V2300NBR1 | NXP USA Inc. |
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MRF6V2150NBR1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MRF6V2010NR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 220MHz Power - Output: 10W Gain: 23.9dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 30 mA |
Produkt ist nicht verfügbar |
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MRF6V2010NBR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-272BC Mounting Type: Chassis Mount Frequency: 220MHz Power - Output: 10W Gain: 23.9dB Technology: LDMOS Supplier Device Package: TO-272-2 Part Status: Obsolete Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 30 mA |
Produkt ist nicht verfügbar |
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MRF19030LSR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-400S Mounting Type: Chassis Mount Frequency: 1.96GHz Power - Output: 30W Gain: 13dB Technology: LDMOS Supplier Device Package: NI-400S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 300 mA |
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MRF19085LSR3 | NXP USA Inc. |
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MRF19085LR5 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MRF19045LSR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-400S Frequency: 1.93GHz Power - Output: 9.5W Gain: 14.5dB Technology: LDMOS Supplier Device Package: NI-400S-240 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 550 mA |
Produkt ist nicht verfügbar |
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MRF19125R3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-880 Frequency: 1.93GHz Power - Output: 24W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-880 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 1.3 A |
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MRF19045LR5 | NXP USA Inc. |
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MRF19045LR3 | NXP USA Inc. |
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MRF19030LSR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-400S Mounting Type: Chassis Mount Frequency: 1.96GHz Power - Output: 30W Gain: 13dB Technology: LDMOS Supplier Device Package: NI-400S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 300 mA |
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MRF19090SR3 | NXP USA Inc. |
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MRF19125R5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-880 Frequency: 1.93GHz Power - Output: 24W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-880 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 1.3 A |
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MRF21045LR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-400 Frequency: 2.17GHz Power - Output: 10W Gain: 15dB Technology: LDMOS Supplier Device Package: NI-400-240 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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MRF21045LSR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-400S Mounting Type: Chassis Mount Frequency: 2.16GHz ~ 2.17GHz Power - Output: 10W Gain: 15dB Technology: LDMOS Supplier Device Package: NI-400S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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MRF21045LSR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-400S Mounting Type: Chassis Mount Frequency: 2.17GHz Power - Output: 10W Gain: 15dB Technology: LDMOS Supplier Device Package: NI-400S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
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MRF21045LR5 | NXP USA Inc. |
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MRF21030LR5 | NXP USA Inc. |
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MRF21010LSR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-360S Mounting Type: Chassis Mount Frequency: 2.17GHz Power - Output: 10W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-360S Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 100 mA |
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MPC8548EVUAQG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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MPC8548EVUATG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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mpc8349vvalfb | NXP USA Inc. |
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auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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MM908E624ACDWBR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MPC8360ECVVAJDG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
Produkt ist nicht verfügbar |
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MPC8548EHXAUJ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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MPC8548EHXATG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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MPC8548EHXAQG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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13192DSK-A0E | NXP USA Inc. |
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MM908E624ACDWB | NXP USA Inc. |
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MM908E622ACDWB | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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KMPC8548EHXAQG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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MC33385VWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Low Side Rds On (Typ): 250mOhm Voltage - Load: 4.5V ~ 5.5V Current - Output (Max): 2A Ratio - Input:Output: 1:1 Supplier Device Package: 20-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33395DWBR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33395DWB | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33389DDW | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33385DHR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Low Side Rds On (Typ): 250mOhm Voltage - Load: 4.5V ~ 5.5V Current - Output (Max): 2A Ratio - Input:Output: 1:1 Supplier Device Package: 20-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33689DDWB | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Mirror Control Supplier Device Package: 32-SOIC Grade: Automotive |
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MC33288DDHR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 20mOhm Voltage - Load: 8V ~ 35V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-HSOP Fault Protection: Open Load Detect, Over Temperature |
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MC33288DDH | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 20mOhm Voltage - Load: 8V ~ 35V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-HSOP Fault Protection: Open Load Detect, Over Temperature |
Produkt ist nicht verfügbar |
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MC33395TDWBR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33689DDWBR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Mirror Control Supplier Device Package: 32-SOIC Grade: Automotive |
Produkt ist nicht verfügbar |
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MC33186DH2R2 | NXP USA Inc. |
![]() Features: Status Flag Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Interface: Logic Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Rds On (Typ): 150mOhm Applications: DC Motors, General Purpose, Solenoids Current - Output / Channel: 5A Technology: Bi-CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Load Type: Inductive Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33742SDWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC |
Produkt ist nicht verfügbar |
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MC33794DWB | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 54-SOIC Current - Supply: 7 mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33780EGR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33780EG | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33742SDW | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC |
Produkt ist nicht verfügbar |
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MC33689DWB | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Automotive Mirror Control Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
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MC33742DWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC |
Produkt ist nicht verfügbar |
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MC33742DW | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC |
Produkt ist nicht verfügbar |
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MC33689DWBR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Mirror Control Supplier Device Package: 32-SOIC Grade: Automotive |
Produkt ist nicht verfügbar |
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MC33186DH2 | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 5A 20HSOP Features: Status Flag Packaging: Tube Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Interface: Logic Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Rds On (Typ): 150mOhm Applications: DC Motors, General Purpose, Solenoids Current - Output / Channel: 5A Technology: Bi-CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Load Type: Inductive Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KMPC8548EVUAQG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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KMPC8548EVUATG | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
Produkt ist nicht verfügbar |
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KMSC7116VM1000 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I²C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 400kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 266MHz Supplier Device Package: 400-LFBGA (17x17) |
Produkt ist nicht verfügbar |
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MC33186DH1R2 | NXP USA Inc. |
![]() Features: Status Flag Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Interface: Logic Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Rds On (Typ): 150mOhm Applications: DC Motors, General Purpose, Solenoids Current - Output / Channel: 5A Technology: Bi-CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Load Type: Inductive Part Status: Obsolete |
Produkt ist nicht verfügbar |
MRF282ZR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI200
Packaging: Tape & Reel (TR)
Package / Case: NI-200Z
Mounting Type: Chassis Mount
Frequency: 2GHz
Power - Output: 10W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: NI-200Z
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 75 mA
Description: RF MOSFET LDMOS 26V NI200
Packaging: Tape & Reel (TR)
Package / Case: NI-200Z
Mounting Type: Chassis Mount
Frequency: 2GHz
Power - Output: 10W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: NI-200Z
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 75 mA
Produkt ist nicht verfügbar
MRF282SR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI200
Packaging: Tape & Reel (TR)
Package / Case: NI-200S
Mounting Type: Chassis Mount
Frequency: 2GHz
Power - Output: 10W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: NI-200S
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 75 mA
Description: RF MOSFET LDMOS 26V NI200
Packaging: Tape & Reel (TR)
Package / Case: NI-200S
Mounting Type: Chassis Mount
Frequency: 2GHz
Power - Output: 10W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: NI-200S
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 75 mA
Produkt ist nicht verfügbar
MRF6S27050HSR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.62GHz
Power - Output: 7W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.62GHz
Power - Output: 7W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
MRF6V2300NBR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
MRF6V2150NBR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
MRF6V2010NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
MRF6V2010NBR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Description: RF MOSFET LDMOS 50V TO272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
MRF19030LSR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.96GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 300 mA
Description: FET RF 65V 1.96GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
MRF19085LSR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ NI-780S
Description: FET RF 65V 1.99GHZ NI-780S
Produkt ist nicht verfügbar
MRF19085LR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ NI-780
Description: FET RF 65V 1.99GHZ NI-780
Produkt ist nicht verfügbar
MRF19045LSR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.93GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Frequency: 1.93GHz
Power - Output: 9.5W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-400S-240
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 550 mA
Description: FET RF 65V 1.93GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Frequency: 1.93GHz
Power - Output: 9.5W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-400S-240
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 550 mA
Produkt ist nicht verfügbar
MRF19125R3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.93GHZ NI-880
Packaging: Tape & Reel (TR)
Package / Case: NI-880
Frequency: 1.93GHz
Power - Output: 24W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-880
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1.3 A
Description: FET RF 65V 1.93GHZ NI-880
Packaging: Tape & Reel (TR)
Package / Case: NI-880
Frequency: 1.93GHz
Power - Output: 24W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-880
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1.3 A
Produkt ist nicht verfügbar
MRF19045LR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.93GHZ NI-400
Description: FET RF 65V 1.93GHZ NI-400
Produkt ist nicht verfügbar
MRF19045LR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.93GHZ NI-400
Description: FET RF 65V 1.93GHZ NI-400
Produkt ist nicht verfügbar
MRF19030LSR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.96GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 300 mA
Description: FET RF 65V 1.96GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
MRF19090SR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.93GHZ NI-880S
Description: FET RF 65V 1.93GHZ NI-880S
Produkt ist nicht verfügbar
MRF19125R5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.93GHZ NI-880
Packaging: Tape & Reel (TR)
Package / Case: NI-880
Frequency: 1.93GHz
Power - Output: 24W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-880
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1.3 A
Description: FET RF 65V 1.93GHZ NI-880
Packaging: Tape & Reel (TR)
Package / Case: NI-880
Frequency: 1.93GHz
Power - Output: 24W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-880
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1.3 A
Produkt ist nicht verfügbar
MRF21045LR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400-240
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400-240
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
MRF21045LSR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 2.16GHz ~ 2.17GHz
Power - Output: 10W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: FET RF 65V 2.17GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 2.16GHz ~ 2.17GHz
Power - Output: 10W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
MRF21045LSR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: FET RF 65V 2.17GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
MRF21045LR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI-400
Description: FET RF 65V 2.17GHZ NI-400
Produkt ist nicht verfügbar
MRF21030LR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 2.14GHZ NI-400
Description: FET RF 65V 2.14GHZ NI-400
Produkt ist nicht verfügbar
MRF21010LSR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360S
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-360S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 28V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360S
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-360S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MPC8548EVUAQG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
MPC8548EVUATG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
mpc8349vvalfb |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 672TBGA
Description: IC MPU MPC83XX 667MHZ 672TBGA
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)MM908E624ACDWBR2 |
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Hersteller: NXP USA Inc.
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Produkt ist nicht verfügbar
MPC8360ECVVAJDG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
MPC8548EHXAUJ |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
MPC8548EHXATG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
MPC8548EHXAQG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
13192DSK-A0E |
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Hersteller: NXP USA Inc.
Description: KIT DEV STARTER FOR 13191/92
Description: KIT DEV STARTER FOR 13191/92
Produkt ist nicht verfügbar
MM908E624ACDWB |
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Hersteller: NXP USA Inc.
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Produkt ist nicht verfügbar
MM908E622ACDWB |
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Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Produkt ist nicht verfügbar
KMPC8548EHXAQG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
MC33385VWR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33395DWBR2 |
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Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Produkt ist nicht verfügbar
MC33395DWB |
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Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Produkt ist nicht verfügbar
MC33389DDW |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33385DHR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33689DDWB |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
MC33288DDHR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR DRIVER 1:1 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 20mOhm
Voltage - Load: 8V ~ 35V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR DRIVER 1:1 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 20mOhm
Voltage - Load: 8V ~ 35V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
MC33288DDH |
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Hersteller: NXP USA Inc.
Description: IC PWR DRIVER 1:1 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 20mOhm
Voltage - Load: 8V ~ 35V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR DRIVER 1:1 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 20mOhm
Voltage - Load: 8V ~ 35V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-HSOP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
MC33395TDWBR2 |
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Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Produkt ist nicht verfügbar
MC33689DDWBR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
MC33186DH2R2 |
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Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33742SDWR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Produkt ist nicht verfügbar
MC33794DWB |
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Hersteller: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54-SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Description: IC SENSOR ELECTRIC FIELD 54-SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33780EGR2 |
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Hersteller: NXP USA Inc.
Description: IC DIFF DBUS MASTER 16SOIC
Description: IC DIFF DBUS MASTER 16SOIC
Produkt ist nicht verfügbar
MC33780EG |
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Hersteller: NXP USA Inc.
Description: IC DIFF DBUS MASTER 16SOIC
Description: IC DIFF DBUS MASTER 16SOIC
Produkt ist nicht verfügbar
MC33742SDW |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tray
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tray
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Produkt ist nicht verfügbar
MC33689DWB |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive Mirror Control
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive Mirror Control
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
MC33742DWR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Produkt ist nicht verfügbar
MC33742DW |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tray
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tray
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Produkt ist nicht verfügbar
MC33689DWBR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
MC33186DH2 |
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar
KMPC8548EVUAQG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
KMPC8548EVUATG |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Produkt ist nicht verfügbar
KMSC7116VM1000 |
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Hersteller: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
Produkt ist nicht verfügbar
MC33186DH1R2 |
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Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar