Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35279) > Seite 108 nach 588
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MCZ33390EFR2 | NXP USA Inc. |
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MCZ33291LEGR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 1.1Ohm Voltage - Load: 9V ~ 26.5V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 500mA Ratio - Input:Output: 1:8 Supplier Device Package: 24-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MCZ33291LEG | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 1.1Ohm Voltage - Load: 9V ~ 26.5V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 500mA Ratio - Input:Output: 1:8 Supplier Device Package: 24-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MCZ33689DEW | NXP USA Inc. |
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MCZ33689DEWR2 | NXP USA Inc. |
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MCZ33291EGR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 550mOhm Voltage - Load: 9V ~ 26.5V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 500mA Ratio - Input:Output: 1:8 Supplier Device Package: 24-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MCZ33742SEG | NXP USA Inc. |
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MCZ33742SEGR2 | NXP USA Inc. |
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MCZ33989EG | NXP USA Inc. |
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MCZ33989EGR2 | NXP USA Inc. |
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MCZ33298EGR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 350mOhm Voltage - Load: 5.5V ~ 26.5V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3A Ratio - Input:Output: 1:8 Supplier Device Package: 24-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MCZ33879AEK | NXP USA Inc. |
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MCZ33879AEKR2 | NXP USA Inc. |
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MCZ33797EK | NXP USA Inc. |
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MC33794EK | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 54-SOIC-EP Current - Supply: 7 mA DigiKey Programmable: Not Verified |
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MC33794EKR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 54-SOIC-EP Current - Supply: 7 mA DigiKey Programmable: Not Verified |
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MM908E624ACEWR2 | NXP USA Inc. |
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MC34923EGR2 | NXP USA Inc. |
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MC34923EG | NXP USA Inc. |
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MC33999EK | NXP USA Inc. |
![]() Features: PWM Input Packaging: Tube Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 16 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 550mOhm Voltage - Load: 5V ~ 27V Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V Current - Output (Max): 900mA Ratio - Input:Output: 1:16 Supplier Device Package: 54-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MC33999EKR2 | NXP USA Inc. |
![]() Features: PWM Input Packaging: Tape & Reel (TR) Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 16 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 550mOhm Voltage - Load: 5V ~ 27V Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V Current - Output (Max): 900mA Ratio - Input:Output: 1:16 Supplier Device Package: 54-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MC9S12GC32MPBE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 52-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 52-TQFP (10x10) Number of I/O: 35 DigiKey Programmable: Not Verified |
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MMA6280QT | NXP USA Inc. |
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MC9S12C64MPBE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 52-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 52-TQFP (10x10) Part Status: Active Number of I/O: 35 DigiKey Programmable: Not Verified |
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MC9S12E64MPVE | NXP USA Inc. |
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MPVZ2202GC6T1 | NXP USA Inc. |
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MCF52223CAF66 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Last Time Buy Number of I/O: 56 DigiKey Programmable: Not Verified |
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MCF52223CAF80 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Last Time Buy Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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MMA1211EG | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±169g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 13.33 Part Status: Obsolete |
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MC9S12E128MPVE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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MCF52234CAL60 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 73 DigiKey Programmable: Not Verified |
auf Bestellung 297 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF52235CAL60 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 73 DigiKey Programmable: Not Verified |
auf Bestellung 390 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8349EVVALFB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
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MPC8343ECVRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8349ECZUAJDB | NXP USA Inc. |
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MPC8349ECVVAGDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347ZUAJDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347VVAJFB | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8343CVRAGDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8347VVALFB | NXP USA Inc. |
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MPC8347VVAGDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8347CVRADDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8347ECVVAGDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347EVVAJFB | NXP USA Inc. |
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MPC8347EVVAJDB | NXP USA Inc. |
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MPC8347VRAGDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Active |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF9180R6 | NXP USA Inc. |
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MRF9180R5 | NXP USA Inc. | Description: FET RF 65V 880MHZ NI-1230 |
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MRF9135LSR5 | NXP USA Inc. | Description: FET RF 65V 880MHZ NI-780S |
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MRF9135LSR3 | NXP USA Inc. |
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MRF9120LR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 26V NI860 Packaging: Tape & Reel (TR) Package / Case: NI-860 Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 120W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-860 Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 1 A |
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MMA1211EGR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±169g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 13.33 Part Status: Obsolete |
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MRF9120LR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-860 Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 120W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-860 Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 1 A |
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MRF9085LR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 90W Gain: 17.9dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 700 mA |
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MMA1212EGR2 | NXP USA Inc. |
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MRF9060NBR1 | NXP USA Inc. | Description: FET RF 65V 945MHZ TO272-2 |
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SC9328MXSVP15 | NXP USA Inc. | Description: IC MPU I.MXS 150MHZ 225BGA |
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MM908E624AYEW | NXP USA Inc. |
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MM908E624AYEWR2 | NXP USA Inc. |
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MM908E625ACDWB | NXP USA Inc. |
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MCZ33390EFR2 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Produkt ist nicht verfügbar
MCZ33291LEGR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
MCZ33291LEG |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 1.1Ohm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
MCZ33689DEW |
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Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
Produkt ist nicht verfügbar
MCZ33689DEWR2 |
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Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
Description: IC SYSTEM BASIS CHIP LIN 32-SOIC
Produkt ist nicht verfügbar
MCZ33291EGR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
MCZ33742SEG |
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Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Produkt ist nicht verfügbar
MCZ33742SEGR2 |
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Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Produkt ist nicht verfügbar
MCZ33989EG |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
Produkt ist nicht verfügbar
MCZ33989EGR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
Produkt ist nicht verfügbar
MCZ33298EGR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 350mOhm
Voltage - Load: 5.5V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
MCZ33879AEK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Produkt ist nicht verfügbar
MCZ33879AEKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Produkt ist nicht verfügbar
MCZ33797EK |
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Hersteller: NXP USA Inc.
Description: IC SQUIB DRIVER 4-CH 32-SOIC
Description: IC SQUIB DRIVER 4-CH 32-SOIC
Produkt ist nicht verfügbar
MC33794EK |
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Hersteller: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33794EKR2 |
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Hersteller: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Description: IC SENSOR ELECTRIC FIELD 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC-EP
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MM908E624ACEWR2 |
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Hersteller: NXP USA Inc.
Description: IC SWITCH TRPL HI MCU/LIN 54SOIC
Description: IC SWITCH TRPL HI MCU/LIN 54SOIC
Produkt ist nicht verfügbar
MC34923EGR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
Produkt ist nicht verfügbar
MC34923EG |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
Description: IC MOTOR DRIVER 4.5V-5.5V 24SOIC
Produkt ist nicht verfügbar
MC33999EK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CH 1:16 54SOIC
Features: PWM Input
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CH 1:16 54SOIC
Features: PWM Input
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
MC33999EKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CH 1:16 54SOIC
Features: PWM Input
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CH 1:16 54SOIC
Features: PWM Input
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 16
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5V ~ 27V
Voltage - Supply (Vcc/Vdd): 1.5V ~ 3V
Current - Output (Max): 900mA
Ratio - Input:Output: 1:16
Supplier Device Package: 54-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
MC9S12GC32MPBE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MMA6280QT |
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Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
MC9S12C64MPBE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 52-TQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12E64MPVE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Produkt ist nicht verfügbar
MPVZ2202GC6T1 |
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Hersteller: NXP USA Inc.
Description: IC SENSOR PRESSURE 200KPA 8-SOP
Description: IC SENSOR PRESSURE 200KPA 8-SOP
Produkt ist nicht verfügbar
MCF52223CAF66 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF52223CAF80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.92 EUR |
10+ | 27.92 EUR |
80+ | 23.58 EUR |
450+ | 23.43 EUR |
MMA1211EG |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Obsolete
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Obsolete
Produkt ist nicht verfügbar
MC9S12E128MPVE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF52234CAL60 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 297 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 47.08 EUR |
10+ | 37.76 EUR |
80+ | 32.25 EUR |
MCF52235CAL60 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 390 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 49.95 EUR |
10+ | 40.06 EUR |
80+ | 34.21 EUR |
MPC8349EVVALFB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 672TBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU MPC83XX 667MHZ 672TBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC8343ECVRAGDB |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
MPC8349ECZUAJDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672TBGA
Description: IC MPU MPC83XX 533MHZ 672TBGA
Produkt ist nicht verfügbar
MPC8349ECVVAGDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
MPC8347ZUAJDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
MPC8347VVAJFB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672TBGA
Description: IC MPU MPC83XX 533MHZ 672TBGA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 243.95 EUR |
MPC8343CVRAGDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 175.68 EUR |
10+ | 144.88 EUR |
MPC8347VVALFB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 672TBGA
Description: IC MPU MPC83XX 667MHZ 672TBGA
Produkt ist nicht verfügbar
MPC8347VVAGDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 182.62 EUR |
24+ | 150.6 EUR |
96+ | 143.43 EUR |
MPC8347CVRADDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 174.64 EUR |
10+ | 144.04 EUR |
MPC8347ECVVAGDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
MPC8347EVVAJFB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672TBGA
Description: IC MPU MPC83XX 533MHZ 672TBGA
Produkt ist nicht verfügbar
MPC8347EVVAJDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672TBGA
Description: IC MPU MPC83XX 533MHZ 672TBGA
Produkt ist nicht verfügbar
MPC8347VRAGDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 126.95 EUR |
10+ | 125.39 EUR |
MRF9180R6 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 880MHZ NI-1230
Description: FET RF 65V 880MHZ NI-1230
Produkt ist nicht verfügbar
MRF9180R5 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 880MHZ NI-1230
Description: FET RF 65V 880MHZ NI-1230
Produkt ist nicht verfügbar
MRF9135LSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 880MHZ NI-780S
Description: FET RF 65V 880MHZ NI-780S
Produkt ist nicht verfügbar
MRF9135LSR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 880MHZ NI-780S
Description: FET RF 65V 880MHZ NI-780S
Produkt ist nicht verfügbar
MRF9120LR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI860
Packaging: Tape & Reel (TR)
Package / Case: NI-860
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 120W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-860
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 26V NI860
Packaging: Tape & Reel (TR)
Package / Case: NI-860
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 120W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-860
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1 A
Produkt ist nicht verfügbar
MMA1211EGR2 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Obsolete
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Obsolete
Produkt ist nicht verfügbar
MRF9120LR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI860
Packaging: Tape & Reel (TR)
Package / Case: NI-860
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 120W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-860
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 26V NI860
Packaging: Tape & Reel (TR)
Package / Case: NI-860
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 120W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-860
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 1 A
Produkt ist nicht verfügbar
MRF9085LR5 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 90W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 700 mA
Description: RF MOSFET LDMOS 26V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 90W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
MMA1212EGR2 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 225G ANALOG 16SOIC
Description: ACCELEROMETER 225G ANALOG 16SOIC
Produkt ist nicht verfügbar
MRF9060NBR1 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 945MHZ TO272-2
Description: FET RF 65V 945MHZ TO272-2
Produkt ist nicht verfügbar
SC9328MXSVP15 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MXS 150MHZ 225BGA
Description: IC MPU I.MXS 150MHZ 225BGA
Produkt ist nicht verfügbar
MM908E624AYEW |
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Hersteller: NXP USA Inc.
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Produkt ist nicht verfügbar
MM908E624AYEWR2 |
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Hersteller: NXP USA Inc.
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Description: IC TRPL SWITCH MCU/LIN 54-SOIC
Produkt ist nicht verfügbar
MM908E625ACDWB |
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Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
Produkt ist nicht verfügbar