Produkte > XCZ
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis | ||||||||||||||
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| XCZ1 D87500 | Belden Wire & Cable | Multi-Conductor Cables 24AWG 1PR SOLID CAT3 500FT SPOOL BLU/WHT | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZ1 D921000 | Belden Wire & Cable | Multi-Conductor Cables 24AWG 1PR SOLID CAT3 BLUE/RED PER FOOT | Produkt ist nicht verfügbar | |||||||||||||||
| XCZ1 E031000 | Belden Wire & Cable | Multi-Conductor Cables CAT3 1PR X-CONN REEL | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU11EG-1FFVB1517E | Xilinx | SoC FPGA XCZU11EG-1FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVB1517I | Xilinx | SoC FPGA XCZU11EG-1FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVC1156E | Xilinx | SoC FPGA XCZU11EG-1FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVC1156I | AMD / Xilinx | SoC FPGA XCZU11EG-1FFVC1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU11EG-1FFVC1156I | Xilinx | SoC FPGA XCZU11EG-1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVC1760E | Xilinx | SoC FPGA XCZU11EG-1FFVC1760E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU11EG-1FFVC1760I | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVF1517E | Xilinx | SoC FPGA XCZU11EG-1FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-1FFVF1517I | Xilinx | SoC FPGA XCZU11EG-1FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVB1517E | Xilinx | SoC FPGA XCZU11EG-2FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVC1156E | Xilinx | SoC FPGA XCZU11EG-2FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVC1156I | Xilinx | SoC FPGA XCZU11EG-2FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVC1760I | Xilinx | SoC FPGA XCZU11EG-2FFVC1760I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU11EG-2FFVC1760I | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-2FFVF1517E | Xilinx | SoC FPGA XCZU11EG-2FFVF1517E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU11EG-2FFVF1517I | Xilinx | SoC FPGA XCZU11EG-2FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-3FFVC1156E | Xilinx | SoC FPGA XCZU11EG-3FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-3FFVC1156E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1156FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-3FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-3FFVF1517E | Xilinx | FPGA - Field Programmable Gate Array XCZU11EG-3FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVB1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVB1517I | Xilinx | SoC FPGA XCZU11EG-L1FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVC1156I | Xilinx | SoC FPGA XCZU11EG-L1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVC1156I4524 | Xilinx | SoC FPGA XCZU11EG-L1FFVC1156I4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVC1156I4560 | Xilinx | SoC FPGA XCZU11EG-L1FFVC1156I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVC1760I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVC1760I | Xilinx | FPGA - Field Programmable Gate Array XCZU11EG-L1FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVF1517I | Xilinx | FPGA - Field Programmable Gate Array XCZU11EG-L1FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L1FFVF1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L2FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L2FFVC1156E | Xilinx | SoC FPGA XCZU11EG-L2FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L2FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU11EG-L2FFVF1517E | Xilinx | FPGA - Field Programmable Gate Array XCZU11EG-L2FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVB1156E | Xilinx | auf Bestellung 65 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU15EG-1FFVB1156E | AMD / Xilinx | SoC FPGA XCZU15EG-1FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVB1156I | Xilinx | auf Bestellung 63 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU15EG-1FFVB1156I | AMD / Xilinx | SoC FPGA XCZU15EG-1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVC900E | AMD / Xilinx | SoC FPGA XCZU15EG-1FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-1FFVC900I | AMD / Xilinx | SoC FPGA XCZU15EG-1FFVC900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU15EG-2FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-2FFVB1156E | AMD / Xilinx | SoC FPGA XCZU15EG-2FFVB1156E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU15EG-2FFVB1156E | Xilinx | auf Bestellung 55 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU15EG-2FFVB1156I | Xilinx | auf Bestellung 238 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU15EG-2FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-2FFVB1156I | AMD / Xilinx | SoC FPGA XCZU15EG-2FFVB1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU15EG-2FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-2FFVC900E | AMD / Xilinx | SoC FPGA XCZU15EG-2FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-2FFVC900I | Xilinx | auf Bestellung 13 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU15EG-2FFVC900I | AMD / Xilinx | SoC FPGA XCZU15EG-2FFVC900I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU15EG-2FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-2FFVC900I5325 | Xilinx | Xilinx XCZU15EG-2FFVC900I5325 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-2FFVC900I5387 | Xilinx | Xilinx XCZU15EG-2FFVC900I5387 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-3FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-3FFVB1156E | AMD / Xilinx | SoC FPGA XCZU15EG-3FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L1FFVB1156I | AMD / Xilinx | SoC FPGA XCZU15EG-L1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L1FFVB1156I | Xilinx | auf Bestellung 111 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU15EG-L1FFVC900I | AMD / Xilinx | SoC FPGA XCZU15EG-L1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L1FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L2FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L2FFVB1156E | AMD / Xilinx | SoC FPGA XCZU15EG-L2FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU15EG-L2FFVB1156I | Xilinx | auf Bestellung 61 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU17EG-1FFVB1517E | Xilinx | SoC FPGA XCZU17EG-1FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVB1517I | Xilinx | SoC FPGA XCZU17EG-1FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVC1760E | Xilinx | SoC FPGA XCZU17EG-1FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVC1760I | Xilinx | SoC FPGA XCZU17EG-1FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVC1760I | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVD1760E | AMD / Xilinx | SoC FPGA XCZU17EG-1FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVD1760E | Xilinx | SoC FPGA XCZU17EG-1FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVD1760E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVD1760I | AMD / Xilinx | SoC FPGA XCZU17EG-1FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVD1760I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVD1760I | Xilinx | SoC FPGA XCZU17EG-1FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVE1924E | Xilinx | SoC FPGA XCZU17EG-1FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-1FFVE1924I | Xilinx | SoC FPGA XCZU17EG-1FFVE1924I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVB1517E | Xilinx | SoC FPGA XCZU17EG-2FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVB1517I | Xilinx | SoC FPGA XCZU17EG-2FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVC1760E | AMD / Xilinx | SoC FPGA XCZU17EG-2FFVC1760E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU17EG-2FFVC1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA | auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU17EG-2FFVC1760E | Xilinx | SoC FPGA XCZU17EG-2FFVC1760E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU17EG-2FFVC1760I | Xilinx | SoC FPGA XCZU17EG-2FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVC1760I | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVD1760E | Xilinx | SoC FPGA XCZU17EG-2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVD1760E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVD1760E | AMD / Xilinx | SoC FPGA XCZU17EG-2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVD1760I | Xilinx | SoC FPGA XCZU17EG-2FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVD1760I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVD1760I | AMD / Xilinx | SoC FPGA XCZU17EG-2FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVE1924E | Xilinx | SoC FPGA XCZU17EG-2FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-2FFVE1924I | Xilinx | SoC FPGA XCZU17EG-2FFVE1924I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-3FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-3FFVC1760E | Xilinx | SoC FPGA XCZU17EG-3FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-3FFVD1760E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-3FFVD1760E | Xilinx | SoC FPGA XCZU17EG-3FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-3FFVE1924E | Xilinx | SoC FPGA XCZU17EG-3FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVB1517I | Xilinx | SoC FPGA XCZU17EG-L1FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVB1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVC1760I | Xilinx | SoC FPGA XCZU17EG-L1FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVC1760I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVD1760I | Xilinx | SoC FPGA XCZU17EG-L1FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVD1760I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVE1924I | Xilinx | SoC FPGA XCZU17EG-L1FFVE1924I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L1FFVE1924I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1924FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L2FFVB1517E | Xilinx | SoC FPGA XCZU17EG-L2FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L2FFVC1760E | AMD Xilinx | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L2FFVC1760E | Xilinx | SoC FPGA XCZU17EG-L2FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L2FFVD1760E | Xilinx | SoC FPGA XCZU17EG-L2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L2FFVD1760E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU17EG-L2FFVE1924E | Xilinx | SoC FPGA XCZU17EG-L2FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVB1517E | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVB1517E | Xilinx | SoC FPGA XCZU19EG-1FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVB1517I | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVB1517I | Xilinx | SoC FPGA XCZU19EG-1FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVC1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVC1760E | Xilinx | SoC FPGA XCZU19EG-1FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVC1760I | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVC1760I | Xilinx | SoC FPGA XCZU19EG-1FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVD1760E | AMD / Xilinx | SoC FPGA XCZU19EG-1FFVD1760E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU19EG-1FFVD1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVD1760E | Xilinx | SoC FPGA XCZU19EG-1FFVD1760E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU19EG-1FFVD1760I | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVD1760I | AMD / Xilinx | SoC FPGA XCZU19EG-1FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVD1760I | Xilinx | SoC FPGA XCZU19EG-1FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVE1924E | Xilinx | SoC FPGA XCZU19EG-1FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-1FFVE1924I | Xilinx | SoC FPGA XCZU19EG-1FFVE1924I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVB1517E | Xilinx | SoC FPGA XCZU19EG-2FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVB1517E | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVB1517I | AMD / Xilinx | SoC FPGA ZynqUltraScale+ FPGA, 1143K+ Logic Cells | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU19EG-2FFVB1517I | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVB1517I | Xilinx | SoC FPGA XCZU19EG-2FFVB1517I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU19EG-2FFVC1760E | Xilinx | SoC FPGA XCZU19EG-2FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVC1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU19EG-2FFVC1760I | Xilinx | SoC FPGA XCZU19EG-2FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVC1760I | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVC1760I4863 | Xilinx | SoC FPGA XCZU19EG-2FFVC1760I4863 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVD1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVD1760E | AMD / Xilinx | SoC FPGA XCZU19EG-2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVD1760E | Xilinx | SoC FPGA XCZU19EG-2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVD1760I | AMD / Xilinx | SoC FPGA XCZU19EG-2FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVD1760I | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVD1760I | Xilinx | SoC FPGA XCZU19EG-2FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVE1924E | Xilinx | SoC FPGA XCZU19EG-2FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVE1924E | AMD | Description: IC SOC CORTEX-A53 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1924-FCBGA (45x45) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVE1924I | AMD | Description: IC SOC CORTEX-A53 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1924-FCBGA (45x45) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-2FFVE1924I | Xilinx | SoC FPGA XCZU19EG-2FFVE1924I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVB1517E | Xilinx | SoC FPGA XCZU19EG-3FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVB1517E | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVC1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVC1760E | Xilinx | SoC FPGA XCZU19EG-3FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVD1760E | Xilinx | SoC FPGA XCZU19EG-3FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVD1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVD1760E4869 | Xilinx | SoC FPGA XCZU19EG-3FFVD1760E4869 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVE1924E | AMD | Description: IC SOC CORTEX-A53 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1924-FCBGA (45x45) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-3FFVE1924E | Xilinx | SoC FPGA XCZU19EG-3FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVB1517I | Xilinx | SoC FPGA XCZU19EG-L1FFVB1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVB1517I | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVC1760I | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVC1760I | Xilinx | auf Bestellung 20 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU19EG-L1FFVC1760I | Xilinx | SoC FPGA XCZU19EG-L1FFVC1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVD1760I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1760FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVD1760I | Xilinx | SoC FPGA XCZU19EG-L1FFVD1760I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVE1924I | Xilinx | SoC FPGA XCZU19EG-L1FFVE1924I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L1FFVE1924I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1924FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVB1517E | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVB1517E | Xilinx | SoC FPGA XCZU19EG-L2FFVB1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVC1760E | Xilinx | SoC FPGA XCZU19EG-L2FFVC1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVC1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVC1760E4524 | Xilinx | SoC FPGA XCZU19EG-L2FFVC1760E4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVD1760E | AMD / Xilinx | SoC FPGA XCZU19EG-L2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVD1760E | Xilinx | SoC FPGA XCZU19EG-L2FFVD1760E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVD1760E | AMD | Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU19EG-L2FFVE1924E | Xilinx | SoC FPGA XCZU19EG-L2FFVE1924E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU1CG-1SBVA484I | AMD | Description: IC ZUP MPSOC CG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1CG-1SBVA484I | Xilinx | SoC FPGA XCZU1CG-1SBVA484I | auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1CG-1SFVA625I | AMD Xilinx | Description: IC ZUP MPSOC CG A53 FPGA 635BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU1CG-1SFVA625I | Xilinx | SoC FPGA XCZU1CG-1SFVA625I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1CG-1SFVA625I4524 | Xilinx | Xilinx XCZU1CG-1SFVA625I4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU1CG-1UBVA494I | AMD | Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1CG-2SBVA484I | AMD | Description: IC ZUP MPSOC CG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1CG-2SFVC784I | AMD | Description: IC ZUP MPSOC CG A53 FPGA 784BGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1CG-2UBVA494I | AMD | Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1EG-1SFVC784IES9819 | Xilinx | Xilinx | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU1EG-2SBVA484I | AMD | Description: IC ZUP MPSOC EG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1EG-2SFVA625I | AMD / Xilinx | SoC FPGA XCZU1EG-2SFVA625I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1EG-2SFVC784I | AMD | Description: IC ZUP MPSOC EG A53 FPGA 784BGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU1EG-2UBVA494I | AMD | Description: IC ZUP MPSOC EG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 126 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU21DR-1FFVD1156I5245 | Xilinx | SoC FPGA XCZU21DR-1FFVD1156I5245 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU21DR-2FFVD1156I4524 | Xilinx | SoC FPGA XCZU21DR-2FFVD1156I4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU21DR-2FSVD1156I4947 | Xilinx | SoC FPGA XCZU21DR-2FSVD1156I4947 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU21DR-L2FFVD1156I5153 | Xilinx | SoC FPGA XCZU21DR-L2FFVD1156I5153 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU21DR-L2FSVD1156E | Xilinx | SoC FPGA XCZU21DR-L2FSVD1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SBVA484E | AMD XILINX | Description: AMD XILINX - XCZU2CG-1SBVA484E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-484 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 484 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SBVA484E | Xilinx | SoC FPGA XCZU2CG-1SBVA484E | auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SBVA484E | AMD / Xilinx | SoC FPGA XCZU2CG-1SBVA484E | auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SBVA484E4524 | Xilinx | SoC FPGA XCZU5EV-1FBVB900E4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SBVA484I | AMD | Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 187 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SBVA484I | AMD / Xilinx | SoC FPGA XCZU2CG-1SBVA484I | auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SBVA484I | AMD XILINX | Description: AMD XILINX - XCZU2CG-1SBVA484I - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-484 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 484 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SBVA484I | Xilinx | SoC FPGA XCZU2CG-1SBVA484I | auf Bestellung 49 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SFVA625E | Xilinx | SoC FPGA XCZU2CG-1SFVA625E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-1SFVA625E | AMD XILINX | Description: AMD XILINX - XCZU2CG-1SFVA625E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-625 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 625 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVA625E | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVA625I | Xilinx | FPGA - Field Programmable Gate Array XCZU2CG-1SFVA625I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-1SFVC784E | Xilinx | SoC FPGA XCZU2CG-1SFVC784E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SFVC784E | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVC784E | AMD XILINX | Description: AMD XILINX - XCZU2CG-1SFVC784E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-784 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 784 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVC784I | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVC784I | AMD XILINX | Description: AMD XILINX - XCZU2CG-1SFVC784I - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-784 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 784 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU2CG-1SFVC784I | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1SFVC784I | Xilinx | SoC FPGA XCZU2CG-1SFVC784I | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-1UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-1UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2SBVA484E | Xilinx | SoC FPGA XCZU2CG-2SBVA484E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-2SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-2SBVA484I | Xilinx | SoC FPGA XCZU2CG-2SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2SBVA484I | AMD | Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2SFVA625E | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-2SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-2SFVA625I | Xilinx | FPGA - Field Programmable Gate Array XCZU2CG-2SFVA625I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-2SFVC784E | AMD / Xilinx | SoC FPGA XCZU2CG-2SFVC784E | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2SFVC784E | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-2SFVC784E | Xilinx | SoC FPGA XCZU2CG-2SFVC784E | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2SFVC784I | Xilinx | SoC FPGA XCZU2CG-2SFVC784I | auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU2CG-2SFVC784I | auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-2UBVA530E | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-2UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-L1SBVA484I | Xilinx | SoC FPGA XCZU2CG-L1SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-L1SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-L1SFVA625I | Xilinx | SoC FPGA XCZU2CG-L1SFVA625I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-L1SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU2CG-L1SFVC784I | Xilinx | SoC FPGA XCZU2CG-L1SFVC784I | auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-L1SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2CG-L1UBVA530I | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-L2SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2CG-L2UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1SBVA484E | Xilinx | SoC FPGA XCZU2EG-1SBVA484E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SBVA484E | AMD / Xilinx | SoC FPGA XCZU2EG-1SBVA484E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1SFVA625E | AMD | Description: IC SOC CORTEX-A53 625FCBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1SFVA625E | AMD / Xilinx | SoC FPGA XCZU2EG-1SFVA625E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1SFVA625I | Xilinx | SoC FPGA XCZU2EG-1SFVA625I | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU2EG-1SFVC784E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SFVC784E | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1SFVC784E | Xilinx | auf Bestellung 30 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU2EG-1SFVC784E | Xilinx | SoC FPGA XCZU2EG-1SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SFVC784I | Xilinx | SoC FPGA XCZU2EG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-1SFVC784I | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-1UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-2SBVA484E | Xilinx | SoC FPGA XCZU2EG-2SBVA484E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2SBVA484I | Xilinx | SoC FPGA XCZU2EG-2SBVA484I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2SFVA625E | Xilinx | SoC FPGA XCZU2EG-2SFVA625E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2SFVC784E | Xilinx | SoC FPGA XCZU2EG-2SFVC784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU2EG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-2SFVC784I | Xilinx | SoC FPGA XCZU2EG-2SFVC784I | auf Bestellung 1 Stücke: Lieferzeit 535-539 Tag (e) |
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| XCZU2EG-2SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-2UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-2UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L1SBVA484I | AMD / Xilinx | SoC FPGA XCZU2EG-L1SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-L1SBVA484I | AMD | Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-L1SBVA484I | Xilinx | SoC FPGA XCZU2EG-L1SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-L1SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L1SFVA625I | Xilinx | SoC FPGA XCZU2EG-L1SFVA625I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L1SFVC784I | AMD / Xilinx | SoC FPGA XCZU2EG-L1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-L1SFVC784I | Xilinx | SoC FPGA XCZU2EG-L1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU2EG-L1SFVC784I | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L1SFVC784I4524 | Xilinx | SoC FPGA XCZU2EG-L1SFVC784I4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L1SFVC784I4560 | Xilinx | FPGA - Field Programmable Gate Array XCZU2EG-L1SFVC784I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L1UBVA530I | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU2EG-L2UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-1SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU3CG-1SBVA484E | AMD / Xilinx | SoC FPGA XCZU3CG-1SBVA484E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1SBVA484I | AMD / Xilinx | SoC FPGA XCZU3CG-1SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1SFVA625E | Xilinx | auf Bestellung 819 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU3CG-1SFVA625E | Xilinx | SoC FPGA XCZU3CG-1SFVA625E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1SFVA625E | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-1SFVA625E | AMD / Xilinx | SoC FPGA XCZU3CG-1SFVA625E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1SFVC784E | AMD XILINX | Description: AMD XILINX - XCZU3CG-1SFVC784E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-784 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 784 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-1SFVC784E | Xilinx | SoC FPGA XCZU3CG-1SFVC784E | auf Bestellung 4 Stücke: Lieferzeit 565-569 Tag (e) |
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| XCZU3CG-1SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 125 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU3CG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1SFVC784I | AMD XILINX | Description: AMD XILINX - XCZU3CG-1SFVC784I - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.3GHz, FCBGA-784 CPU-Geschwindigkeit: 1.3 MPU-Baureihe: UltraScale+ CG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 784 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ CG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-1SFVC784I | Xilinx | SoC FPGA XCZU3CG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-1UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-2SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-2SBVA484E | Xilinx | SoC FPGA XCZU3CG-2SBVA484E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-2SBVA484I | AMD / Xilinx | SoC FPGA XCZU3CG-2SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-2SBVA484I | Xilinx | SoC FPGA XCZU3CG-2SBVA484I | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 63 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SFVC784E | AMD / Xilinx | SoC FPGA XCZU3CG-2SFVC784E | auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SFVC784E | Xilinx | SoC FPGA XCZU3CG-2SFVC784E | auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SFVC784I | Xilinx | SoC FPGA XCZU3CG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU3CG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-2UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3CG-L1UBVA530I | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3CG-L2UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SBVA484E | Xilinx | SoC FPGA XCZU3EG-1SBVA484E | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SBVA484E | AMD XILINX | Description: AMD XILINX - XCZU3EG-1SBVA484E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.5GHz, FCBGA-484 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ EG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 484 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ EG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SBVA484E | AMD / Xilinx | SoC FPGA XCZU3EG-1SBVA484E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SBVA484I | AMD / Xilinx | SoC FPGA XCZU3EG-1SBVA484I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SBVA484I | Xilinx | SoC FPGA XCZU3EG-1SBVA484I | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SBVA484I | AMD XILINX | Description: AMD XILINX - XCZU3EG-1SBVA484I - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.5GHz, FCBGA-484 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ EG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 484 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ EG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVA625E | AMD / Xilinx | SoC FPGA XCZU3EG-1SFVA625E | auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVA625E | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVA625E | AMD XILINX | Description: AMD XILINX - XCZU3EG-1SFVA625E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.5GHz, FCBGA-625 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ EG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 625 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ EG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVA625E | Xilinx | SoC FPGA XCZU3EG-1SFVA625E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVA625I | AMD / Xilinx | SoC FPGA XCZU3EG-1SFVA625I | auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVA625I | Xilinx | SoC FPGA XCZU3EG-1SFVA625I | auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVA625I4863 | Xilinx | SoC FPGA XCZU3EG-1SFVA625I4863 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVC784E | AMD XILINX | Description: AMD XILINX - XCZU3EG-1SFVC784E - Mikroprozessor, PSoC / MPSoC, Baureihe Zynq UltraScale+ MPSoC, ARM Cortex-A53, 1.5GHz, FCBGA-784 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ EG Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53 Anzahl der Pins: 784 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ EG Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU3EG-1SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVC784E | Xilinx | SoC FPGA XCZU3EG-1SFVC784E | auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVC784E5346 | Xilinx | Xilinx XCZU3EG-1SFVC784E5346 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-1SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1SFVC784I | Xilinx | SoC FPGA XCZU3EG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 738-742 Tag (e) |
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| XCZU3EG-1UBVA530E | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-1UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-2SBVA484E | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SBVA484E | Xilinx | SoC FPGA XCZU3EG-2SBVA484E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SBVA484I | Xilinx | SoC FPGA XCZU3EG-2SBVA484I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SFVA625E | Xilinx | SoC FPGA XCZU3EG-2SFVA625E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SFVA625I | Xilinx | SoC FPGA XCZU3EG-2SFVA625I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SFVC784E | Xilinx | SoC FPGA XCZU3EG-2SFVC784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU3EG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-2SFVC784I | Xilinx | SoC FPGA XCZU3EG-2SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-2UBVA530I | AMD | Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active | auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU3EG-L1SBVA484I | Xilinx | SoC FPGA XCZU3EG-L1SBVA484I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SBVA484I | Xilinx Inc. | Description: IC SOC CORTEX-A53 484FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SBVA484I4765 | Xilinx | SoC FPGA XCZU3EG-L1SBVA484I4765 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SFVA625I | Xilinx | SoC FPGA XCZU3EG-L1SFVA625I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SFVA625I | Xilinx Inc. | Description: IC SOC CORTEX-A53 625FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SFVC784I | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SFVC784I | Xilinx | SoC FPGA XCZU3EG-L1SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1SFVC784I4560 | Xilinx | SoC FPGA XCZU3EG-L1SFVC784I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L1UBVA530I | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L2SBVA484E | Xilinx | SoC FPGA XCZU3EG-L2SBVA484E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L2SFVA625E | Xilinx | SoC FPGA XCZU3EG-L2SFVA625E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L2SFVC784E | Xilinx | SoC FPGA XCZU3EG-L2SFVC784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3EG-L2UBVA530E | AMD | Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3TCG-1SFVD784E | AMD / Xilinx | SoC FPGA XCZU3TCG-1SFVD784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3TCG-1SFVD784I | AMD / Xilinx | SoC FPGA XCZU3TCG-1SFVD784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3TCG-2SFVD784E | AMD / Xilinx | SoC FPGA XCZU3TCG-2SFVD784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3TCG-L2SFVD784E | AMD / Xilinx | SoC FPGA XCZU3TCG-L2SFVD784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3TEG-1SFVD784I | AMD / Xilinx | SoC FPGA XCZU3TEG-1SFVD784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU3TEG-2SFVD784I | AMD / Xilinx | SoC FPGA XCZU3TEG-2SFVD784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FFVE1156E | AMD / Xilinx | SoC FPGA XCZU42DR-1FFVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FFVE1156E | Xilinx | SoC FPGA XCZU42DR-1FFVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FFVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-1FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FFVE1156I | Xilinx | SoC FPGA XCZU42DR-1FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FSVE1156E | AMD / Xilinx | SoC FPGA XCZU42DR-1FSVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FSVE1156E | Xilinx | SoC FPGA XCZU42DR-1FSVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FSVE1156I | Xilinx | SoC FPGA XCZU42DR-1FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-1FSVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-1FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FFVE1156E | Xilinx | SoC FPGA XCZU42DR-2FFVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FFVE1156E | AMD / Xilinx | SoC FPGA XCZU42DR-2FFVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FFVE1156I | Xilinx | SoC FPGA XCZU42DR-2FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FFVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-2FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FSVE1156E | AMD / Xilinx | SoC FPGA XCZU42DR-2FSVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FSVE1156E | Xilinx | SoC FPGA XCZU42DR-2FSVE1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FSVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-2FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-2FSVE1156I | Xilinx | SoC FPGA XCZU42DR-2FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L1FFVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-L1FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L1FFVE1156I | Xilinx | SoC FPGA XCZU42DR-L1FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L1FSVE1156I | Xilinx | SoC FPGA XCZU42DR-L1FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L1FSVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-L1FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L2FFVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-L2FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L2FFVE1156I | Xilinx | SoC FPGA XCZU42DR-L2FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L2FSVE1156I | AMD / Xilinx | SoC FPGA XCZU42DR-L2FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L2FSVE1156I | Xilinx | SoC FPGA XCZU42DR-L2FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU42DR-L2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FFVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FSVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-1FSVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FFVE1156I5184 | Xilinx | SoC FPGA XCZU43DR-2FFVE1156I5184 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FFVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FFVG1517I | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FSVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-2FSVG1517I | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-L2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-L2FFVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-L2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU43DR-L2FSVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-1FFVH1760E | AMD | Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-1FFVH1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-1FSVH1760E | AMD | Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-2FSVH1760E | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-L1FFVH1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-L1FSVH1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-L2FFVH1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU46DR-L2FSVH1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FFVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FSVE1156EES9919 | Xilinx | SoC FPGA XCZU47DR-1FSVE1156EES9919 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-1FSVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FFVE1156I5149 | Xilinx | SoC FPGA XCZU47DR-2FFVE1156I5149 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FFVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FFVG1517I | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FSVG1517E | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-2FSVG1517I | AMD | Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-L2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-L2FFVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-L2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU47DR-L2FSVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-1FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-1FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-2FFVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-2FFVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-2FSVE1156E | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-L2FFVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-L2FFVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-L2FSVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU48DR-L2FSVG1517I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1517BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU49DR-1FFVF1760IES9819 | Xilinx | SoC FPGA XCZU49DR-1FFVF1760IES9819 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU49DR-2FFVF1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU49DR-L2FFVF1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU49DR-L2FSVF1760I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1760BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4CG-1FBVB900E | Xilinx | SoC FPGA XCZU4CG-1FBVB900E | auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1FBVB900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1FBVB900E | AMD | Description: AMD - XCZU4CG-1FBVB900E - Mikroprozessor, ARM Cortex-A53, ARM Cortex-R5F, 1.2GHz, Zynq-UltraScale+, FCBGA-900, NCNR tariffCode: 85423190 CPU-Geschwindigkeit: 1.2GHz MPU-Baureihe: UltraScale+ productTraceability: Yes-Date/Lot Code rohsCompliant: YES Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5F Anzahl der Pins: 900Pin(s) euEccn: 5A002.a.4 hazardous: false rohsPhthalatesCompliant: YES MPU-Familie: Zynq usEccn: 5A992.c Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (15-Jan-2018) | auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||
| XCZU4CG-1FBVB900E | AMD / Xilinx | SoC FPGA XCZU4CG-1FBVB900E | auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1FBVB900I | AMD / Xilinx | SoC FPGA XCZU4CG-1FBVB900I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1FBVB900I | Xilinx | SoC FPGA XCZU4CG-1FBVB900I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU4CG-1SFVC784E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1SFVC784E | Xilinx | SoC FPGA XCZU4CG-1SFVC784E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1SFVC784I | AMD XILINX | Description: AMD XILINX - XCZU4CG-1SFVC784I - Mikroprozessor, ARM Cortex-A53, ARM Cortex-R5F, 1.2GHz, Zynq-UltraScale+, FCBGA-784 CPU-Geschwindigkeit: 1.2 MPU-Baureihe: UltraScale+ Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5F Anzahl der Pins: 784 Qualifizierungsstandard der Automobilindustrie: - MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4CG-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU4CG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-1SFVC784I | Xilinx | SoC FPGA XCZU4CG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 687-691 Tag (e) |
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| XCZU4CG-1SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-2FBVB900I | Xilinx | SoC FPGA XCZU4CG-2FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4CG-2SFVC784E | AMD / Xilinx | SoC FPGA XCZU4CG-2SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-2SFVC784E | Xilinx | SoC FPGA XCZU4CG-2SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU4CG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-2SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-2SFVC784I | Xilinx | SoC FPGA XCZU4CG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-L1SFVC784I | AMD / Xilinx | SoC FPGA XCZU4CG-L1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4CG-L1SFVC784I | AMD XILINX | Description: AMD XILINX - XCZU4CG-L1SFVC784I - Mikroprozessor, ARM Cortex-A53, ARM Cortex-R5F, 1.2GHz, Zynq-UltraScale+, FCBGA-784 CPU-Geschwindigkeit: 1.2 MPU-Baureihe: UltraScale+ Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5F Anzahl der Pins: 784 Qualifizierungsstandard der Automobilindustrie: - MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4CG-L1SFVC784I | Xilinx | FPGA - Field Programmable Gate Array XCZU4CG-L1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU4EG | AMD / Xilinx | SoC FPGA XCZU4EG-1SFVC784EES9919 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-1FBVB900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-1FBVB900E | AMD / Xilinx | SoC FPGA XCZU4EG-1FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-1FBVB900I | AMD / Xilinx | SoC FPGA XCZU4EG-1FBVB900I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EG-1FBVB900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-1SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EG-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU4EG-1SFVC784E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EG-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU4EG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EG-1SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2FBVB900E | AMD / Xilinx | SoC FPGA XCZU4EG-2FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2FBVB900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2FBVB900I | AMD / Xilinx | SoC FPGA XCZU4EG-2FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2FBVB900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2SFVC784E | AMD / Xilinx | SoC FPGA XCZU4EG-2SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EG-2SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU4EG-2SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-3SFVC784E | AMD / Xilinx | SoC FPGA XCZU4EG-3SFVC784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-3SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 600MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L1FBVB900I | AMD / Xilinx | SoC FPGA XCZU4EG-L1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L1FBVB900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L1FBVB900I4560 | Xilinx | FPGA - Field Programmable Gate Array XCZU4EG-L1FBVB900I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L1SFVC784I | AMD / Xilinx | SoC FPGA XCZU4EG-L1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EG-L1SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L2FBVB900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L2FBVB900E | Xilinx | SoC FPGA XCZU4EG-L2FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L2SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EG-L2SFVC784E | AMD / Xilinx | SoC FPGA XCZU4EG-L2SFVC784E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-1FBVB900E | Xilinx | SoC FPGA XCZU4EV-1FBVB900E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1FBVB900E | AMD XILINX | Description: AMD XILINX - XCZU4EV-1FBVB900E - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 900 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-1FBVB900E | AMD / Xilinx | SoC FPGA XCZU4EV-1FBVB900E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1FBVB900I | Xilinx | SoC FPGA XCZU4EV-1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-1FBVB900I | AMD / Xilinx | SoC FPGA XCZU4EV-1FBVB900I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU4EV-1SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1SFVC784E | Xilinx | SoC FPGA XCZU4EV-1SFVC784E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1SFVC784E4524 | Xilinx | SoC FPGA XCZU4EV-1SFVC784E4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-1SFVC784I | AMD XILINX | Description: AMD XILINX - XCZU4EV-1SFVC784I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-784 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 784 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-1SFVC784I | Xilinx | SoC FPGA XCZU4EV-1SFVC784I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU4EV-1SFVC784I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-2SFVC784I | Xilinx | SoC FPGA XCZU4EV-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU4EV-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-2SFVC784I4793 | Xilinx | FPGA - Field Programmable Gate Array XCZU4EV-2SFVC784I4793 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-3FBVB900E | Xilinx | SoC FPGA XCZU4EV-3FBVB900E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU4EV-L1FBVB900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-L1FBVB900I | AMD XILINX | Description: AMD XILINX - XCZU4EV-L1FBVB900I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 900 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU4EV-L1SFVC784I | Xilinx | SoC FPGA XCZU4EV-L1SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-L1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-L1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-L2FFVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU55DR-L2FSVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-2FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-2FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-L1FFVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-L1FSVE1156I | AMD | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-L2FFVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU57DR-L2FSVE1156I | AMD Xilinx | Description: IC ZUP RFSOC A53 FPGA LP 1156BGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5CG-1FBVB900E | Xilinx | SoC FPGA XCZU5CG-1FBVB900E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5CG-1FBVB900E | AMD / Xilinx | SoC FPGA XCZU5CG-1FBVB900E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5CG-1FBVB900I | AMD / Xilinx | SoC FPGA XCZU5CG-1FBVB900I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU5CG-1FBVB900I | Xilinx | SoC FPGA XCZU5CG-1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5CG-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU5CG-1SFVC784E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5CG-1SFVC784E | Xilinx | FPGA - Field Programmable Gate Array XCZU5CG-1SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU5CG-1SFVC784I | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5CG-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU5CG-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5CG-1SFVC784I | Xilinx | SoC FPGA XCZU5CG-1SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5CG-2FBVB900E | Xilinx | SoC FPGA XCZU5CG-2FBVB900E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5CG-2FBVB900I | Xilinx | SoC FPGA XCZU5CG-2FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5CG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU5CG-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5EG-1SFVC784E | Xilinx | SoC FPGA XAZU4EV-1SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU5EG-1SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-1SFVC784I | Xilinx | SoC FPGA XCZU5EG-1SFVC784I | auf Bestellung 5 Stücke: Lieferzeit 663-667 Tag (e) |
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| XCZU5EG-2SFVC784E | Xilinx | SoC FPGA XQZU1EG-2SFQA625I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-2SFVC784I | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU5EG-2SFVC784I | Xilinx | SoC FPGA XCZU5EG-2SFVC784I | auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5EG-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU5EG-2SFVC784I | auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5EG-L1FBVB900I | Xilinx | SoC FPGA XCZU5EG-L1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-L1FBVB900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-L1SFVC784I | Xilinx | FPGA - Field Programmable Gate Array XCZU5EG-L1SFVC784I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-L1SFVC784I | Xilinx Inc. | Description: IC SOC CORTEX-A53 784FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-L1SFVC784I4765 | Xilinx | FPGA - Field Programmable Gate Array XCZU5EG-L1SFVC784I4765 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EG-L2SFVC784E | AMD | Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU5EV-1FBVB900I | Xilinx | SoC FPGA XCZU5EV-1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EV-1SFVC784E | AMD / Xilinx | SoC FPGA XCZU5EV-1SFVC784E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5EV-1SFVC784E | Xilinx | FPGA - Field Programmable Gate Array XCZU5EV-1SFVC784E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU5EV-1SFVC784I | Xilinx | SoC FPGA XCZU5EV-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU5EV-1SFVC784I | AMD / Xilinx | SoC FPGA XCZU5EV-1SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU5EV-1SFVC784I4863 | Xilinx | SoC FPGA XCZU5EV-1SFVC784I4863 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EV-2FBVB900I | AMD / Xilinx | SoC FPGA XCZU5EV-2FBVB900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU5EV-2FBVB900I | Xilinx | SoC FPGA XCZU5EV-2FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU5EV-2SFVC784I | AMD / Xilinx | SoC FPGA XCZU5EV-2SFVC784I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU5EV-2SFVC784I | Xilinx | SoC FPGA XCZU5EV-2SFVC784I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU67DR-1FFVE1156I | Xilinx | SoC FPGA XCZU67DR-1FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-1FSVE1156I | Xilinx | SoC FPGA XCZU67DR-1FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-2FFVE1156I | Xilinx | SoC FPGA XCZU67DR-2FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-2FSVE1156I | Xilinx | SoC FPGA XCZU67DR-2FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-2FSVE1156I5405 | Xilinx | SoC FPGA XCZU67DR-2FSVE1156I5405 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-L1FFVE1156I | Xilinx | SoC FPGA XCZU67DR-L1FFVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-L1FFVE1156I5405 | Xilinx | SoC FPGA XCZU67DR-L1FFVE1156I5405 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-L1FSVE1156I | Xilinx | SoC FPGA XCZU67DR-L1FSVE1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU67DR-L1FSVE1156IES9818 | Xilinx | Xilinx XCZU67DR-L1FSVE1156IES9818 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVB1156E | AMD / Xilinx | SoC FPGA XCZU6CG-1FFVB1156E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU6CG-1FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVB1156E | Xilinx | SoC FPGA XCZU6CG-1FFVB1156E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU6CG-1FFVB1156E4825 | Xilinx | SoC FPGA XCZU6CG-1FFVB1156E4825 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVB1156E4979 | Xilinx | SoC FPGA XCZU6CG-1FFVB1156E4979 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVB1156I | Xilinx | SoC FPGA XCZU6CG-1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVB1156I4930 | Xilinx | SoC FPGA XCZU6CG-1FFVB1156I4930 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVC900E | Xilinx | SoC FPGA XCZU6CG-1FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-1FFVC900I | Xilinx | SoC FPGA XCZU6CG-1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVB1156E | Xilinx | SoC FPGA XCZU6CG-2FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVB1156I | Xilinx | SoC FPGA XCZU6CG-2FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVC900E | Xilinx | SoC FPGA XCZU6CG-2FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVC900I | Xilinx | SoC FPGA XCZU6CG-2FFVC900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU6CG-2FFVC900I | AMD / Xilinx | SoC FPGA XCZU6CG-2FFVC900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU6CG-2FFVC900I4895 | Xilinx | SoC FPGA XCZU6CG-2FFVC900I4895 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-2FFVC900I4931 | Xilinx | SoC FPGA XCZU6CG-2FFVC900I4931 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-L1FFVB1156I | Xilinx | SoC FPGA XCZU6CG-L1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-L1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-L1FFVB1156I4560 | Xilinx | SoC FPGA XCZU6CG-L1FFVB1156I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-L1FFVC900I | Xilinx | SoC FPGA XCZU6CG-L1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-L2FFVB1156E | Xilinx | SoC FPGA XCZU6CG-L2FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6CG-L2FFVC900E | Xilinx | SoC FPGA XCZU6CG-L2FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVB1156E | Xilinx | SoC FPGA XCZU6EG-1FFVB1156E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU6EG-1FFVB1156E | AMD / Xilinx | SoC FPGA XCZU6EG-1FFVB1156E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU6EG-1FFVB1156E5113 | Xilinx | SoC FPGA XCZU6EG-1FFVB1156E5113 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVB1156I | Xilinx | SoC FPGA XCZU6EG-1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVB1156I | AMD / Xilinx | SoC FPGA XCZU6EG-1FFVB1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU6EG-1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVB1156I5114 | Xilinx | SoC FPGA XCZU6EG-1FFVB1156I5114 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVC900E | Xilinx | SoC FPGA XCZU6EG-1FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-1FFVC900I | Xilinx | SoC FPGA XCZU6EG-1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVB1156E | Xilinx | SoC FPGA XCZU6EG-2FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVB1156I | Xilinx | SoC FPGA XCZU6EG-2FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVC900E | Xilinx | SoC FPGA XCZU6EG-2FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-2FFVC900I | Xilinx | SoC FPGA XCZU6EG-2FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-3FFVB1156E | Xilinx | SoC FPGA XCZU6EG-3FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-3FFVC900E | Xilinx | SoC FPGA XCZU6EG-3FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L1FFVB1156I | Xilinx | SoC FPGA XCZU6EG-L1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L1FFVB1156I4560 | Xilinx | SoC FPGA XCZU6EG-L1FFVB1156I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L1FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L1FFVC900I | Xilinx | SoC FPGA XCZU6EG-L1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L2FFVB1156E | Xilinx | SoC FPGA XCZU6EG-L2FFVB1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU6EG-L2FFVC900E | Xilinx | SoC FPGA XCZU6EG-L2FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FBVB900E | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FBVB900E | Xilinx | SoC FPGA XCZU7CG-1FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FBVB900I | Xilinx | SoC FPGA XCZU7CG-1FBVB900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
| ||||||||||||||
| XCZU7CG-1FBVB900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FBVB900I | AMD / Xilinx | SoC FPGA XCZU7CG-1FBVB900I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7CG-1FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVC1156E | Xilinx | SoC FPGA XCZU7CG-1FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVC1156I | Xilinx | SoC FPGA XCZU7CG-1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVF1517E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVF1517E | Xilinx | SoC FPGA XCZU7CG-1FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVF1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-1FFVF1517I | Xilinx | SoC FPGA XCZU7CG-1FFVF1517I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7CG-2FBVB900E | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FBVB900E | Xilinx | SoC FPGA XCZU7CG-2FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FBVB900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FBVB900I | Xilinx | SoC FPGA XCZU7CG-2FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVC1156E | Xilinx | SoC FPGA XCZU7CG-2FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVC1156I | Xilinx | SoC FPGA XCZU7CG-2FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVF1517E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVF1517E | Xilinx | SoC FPGA XCZU7CG-2FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVF1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-2FFVF1517I | Xilinx | SoC FPGA XCZU7CG-2FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L1FBVB900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L1FBVB900I | Xilinx | SoC FPGA XCZU7CG-L1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L1FBVB900I | AMD / Xilinx | SoC FPGA XCZU7CG-L1FBVB900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7CG-L1FFVC1156I | Xilinx | SoC FPGA XCZU7CG-L1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L1FFVF1517I | Xilinx | SoC FPGA XCZU7CG-L1FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L1FFVF1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L2FBVB900E | Xilinx | SoC FPGA XCZU7CG-L2FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L2FBVB900E | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L2FFVC1156E | Xilinx | SoC FPGA XCZU7CG-L2FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L2FFVC1156E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1156FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L2FFVF1517E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7CG-L2FFVF1517E | Xilinx | SoC FPGA XCZU7CG-L2FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FBVB900E | Xilinx | SoC FPGA XCZU7EG-1FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FBVB900I | Xilinx | SoC FPGA XCZU4EV-L2FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FFVC1156E | Xilinx | SoC FPGA XCZU7EG-1FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FFVC1156I | Xilinx | SoC FPGA XCZU7EG-1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-1FFVF1517E | AMD / Xilinx | SoC FPGA XCZU7EG-1FFVF1517E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EG-1FFVF1517E | Xilinx | SoC FPGA XCZU7EG-1FFVF1517E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EG-1FFVF1517I | Xilinx | SoC FPGA XCZU7EG-1FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-2FFVC1156E | Xilinx | SoC FPGA XCZU7EG-2FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-2FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-2FFVC1156I | Xilinx | SoC FPGA XCZU7EG-2FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-2FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-2FFVF1517I | Xilinx | FPGA - Field Programmable Gate Array XCZU7EG-2FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-3FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-3FFVC1156E | Xilinx | SoC FPGA XCZU7EG-3FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FBVB900I | Xilinx | FPGA - Field Programmable Gate Array XCZU7EG-L1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FBVB900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FBVB900I4560 | Xilinx | FPGA - Field Programmable Gate Array XCZU7EG-L1FBVB900I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FFVC1156I | Xilinx | SoC FPGA XCZU7EG-L1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FFVC1156I4560 | Xilinx | SoC FPGA XCZU7EG-L1FFVC1156I4560 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FFVF1517I | Xilinx | FPGA - Field Programmable Gate Array XCZU7EG-L1FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L1FFVF1517I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1517FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L2FFVC1156E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1156FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EG-L2FFVF1517E | Xilinx | FPGA - Field Programmable Gate Array XCZU7EG-L2FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FBVB900E | AMD / Xilinx | SoC FPGA XCZU7EV-1FBVB900E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-1FBVB900E | Xilinx | SoC FPGA XCZU7EV-1FBVB900E | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-1FBVB900E4524 | Xilinx | SoC FPGA XCZU7EV-1FBVB900E4524 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FBVB900E4973 | Xilinx | SoC FPGA XCZU7EV-1FBVB900E4973 | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FBVB900EES9 | Xilinx Inc. | Description: XCZU7EV-1FBVB900EES9 | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU7EV-1FBVB900I | Xilinx | SoC FPGA XCZU7EV-1FBVB900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-1FBVB900I | AMD XILINX | Description: AMD XILINX - XCZU7EV-1FBVB900I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 900 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FBVB900I | AMD / Xilinx | SoC FPGA XCZU7EV-1FBVB900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-1FFVC1156E | Xilinx | SoC FPGA XCZU7EV-1FFVC1156E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVC1156I | AMD / Xilinx | SoC FPGA XCZU7EV-1FFVC1156I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-1FFVC1156I | Xilinx | SoC FPGA XCZU7EV-1FFVC1156I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-1FFVC1156I | AMD XILINX | Description: AMD XILINX - XCZU7EV-1FFVC1156I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 1156 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVF1517E | AMD XILINX | Description: AMD XILINX - XCZU7EV-1FFVF1517E - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 1517 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVF1517E | AMD | Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVF1517E | Xilinx | SoC FPGA XCZU7EV-1FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-1FFVF1517I | Xilinx | SoC FPGA XCZU7EV-1FFVF1517I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FBVB900E | AMD XILINX | Description: AMD XILINX - XCZU7EV-2FBVB900E - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 900 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FBVB900E | AMD / Xilinx | SoC FPGA XCZU7EV-2FBVB900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FBVB900I | AMD / Xilinx | SoC FPGA XCZU7EV-2FBVB900I | auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-2FBVB900I | AMD XILINX | Description: AMD XILINX - XCZU7EV-2FBVB900I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 900 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FBVB900I | Xilinx | SoC FPGA XCZU7EV-2FBVB900I | auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-2FFVC1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FFVC1156E | AMD / Xilinx | SoC FPGA XCZU7EV-2FFVC1156E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-2FFVC1156E | Xilinx | SoC FPGA XCZU7EV-2FFVC1156E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-2FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-2FFVC1156I | Xilinx | SoC FPGA XCZU7EV-2FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FFVC1156I | AMD XILINX | Description: AMD XILINX - XCZU7EV-2FFVC1156I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 1156 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FFVF1517E | Xilinx | SoC FPGA XCZU7EV-2FFVF1517E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-2FFVF1517I | Xilinx | SoC FPGA XCZU7EV-2FFVF1517I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-2FFVF1517I | AMD / Xilinx | SoC FPGA XCZU7EV-2FFVF1517I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU7EV-3FFVC1156E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1156FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-L1FBVB900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-L1FBVB900I | Xilinx | SoC FPGA XCZU7EV-L1FBVB900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-L1FFVC1156I | Xilinx | SoC FPGA XCZU7EV-L1FFVC1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-L1FFVC1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-L1FFVF1517I | AMD XILINX | Description: AMD XILINX - XCZU7EV-L1FFVF1517I - Mikroprozessor-PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 1517 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series Microprocessors SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU7EV-L2FFVC1156E | Xilinx Inc. | Description: IC SOC CORTEX-A53 1156FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-1FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-1FFVB1156I | AMD / Xilinx | SoC FPGA XCZU9CG-1FFVB1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-1FFVB1156I | Xilinx | FPGA - Field Programmable Gate Array XCZU9CG-1FFVB1156I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU9CG-1FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-1FFVC900E | AMD / Xilinx | SoC FPGA XCZU9CG-1FFVC900E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-1FFVC900E | Xilinx | SoC FPGA XCZU9CG-1FFVC900E | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-2FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-2FFVB1156I | Xilinx | SoC FPGA XCZU9CG-2FFVB1156I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-2FFVB1156I | Xilinx Inc. | Description: IC FPGA 328 I/O 1156FCBGA | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) | |||||||||||||||
| XCZU9CG-2FFVB1156I | AMD / Xilinx | SoC FPGA XCZU9CG-2FFVB1156I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-2FFVC900I | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-2FFVC900I | Xilinx | SoC FPGA XCZU9CG-2FFVC900I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-2FFVC900I | AMD / Xilinx | SoC FPGA XCZU9CG-2FFVC900I | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9CG-L1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9CG-L1FFVC900I | Xilinx | SoC FPGA XCZU9CG-L1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-1FFVB1156E | AMD / Xilinx | SoC FPGA XCZU9EG-1FFVB1156E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-1FFVB1156I | AMD / Xilinx | SoC FPGA XCZU9EG-1FFVB1156I | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVB1156I | Xilinx | auf Bestellung 24 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU9EG-1FFVB1156I | Xilinx | SoC FPGA XCZU9EG-1FFVB1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-1FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVC900E | AMD / Xilinx | SoC FPGA XCZU9EG-1FFVC900E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVC900E | Xilinx | SoC FPGA XCZU9EG-1FFVC900E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVC900I | Xilinx | SoC FPGA XCZU9EG-1FFVC900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-1FFVC900I | AMD / Xilinx | SoC FPGA XCZU9EG-1FFVC900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVB1156E | Xilinx | auf Bestellung 33 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU9EG-2FFVB1156E | Xilinx | SoC FPGA XCZU9EG-2FFVB1156E | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVB1156E | AMD / Xilinx | SoC FPGA XCZU9EG-2FFVB1156E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVB1156E | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVB1156I | AMD XILINX | Description: AMD XILINX - XCZU9EG-2FFVB1156I - Mikroprozessor, Familie Zynq, Reihe UltraScale+, FPGAs, ARM Cortex-A53, 1.5GHz, FCBGA-1156 CPU-Geschwindigkeit: 1.5 MPU-Baureihe: UltraScale+ MSL: MSL 4 - 72 Stunden Bauform - MPU: FCBGA Prozessorarchitektur: ARM Cortex-A53, ARM Cortex-R5 Anzahl der Pins: 1156 MPU-Familie: Zynq Produktpalette: Zynq Family UltraScale+ Series FPGAs SVHC: No SVHC (08-Jul-2021) | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-2FFVB1156I | Xilinx | SoC FPGA XCZU9EG-2FFVB1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVB1156I | AMD | Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVB1156I | Xilinx | auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU9EG-2FFVB1156I | AMD / Xilinx | SoC FPGA XCZU9EG-2FFVB1156I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVC900E | AMD | Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active | auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVC900E | AMD / Xilinx | SoC FPGA XCZU9EG-2FFVC900E | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVC900E | Xilinx | SoC FPGA XCZU9EG-2FFVC900E | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVC900I | AMD / Xilinx | SoC FPGA XCZU9EG-2FFVC900I | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCZU9EG-2FFVC900I | Xilinx | SoC FPGA XCZU9EG-2FFVC900I | auf Bestellung 4 Stücke: Lieferzeit 641-645 Tag (e) |
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| XCZU9EG-L1FFVB1156I | Xilinx | auf Bestellung 29 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZU9EG-L1FFVB1156I | Xilinx Inc. | Description: IC SOC CORTEX-A53 1156FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-L1FFVB1156I | Xilinx | FPGA - Field Programmable Gate Array XCZU9EG-L1FFVB1156I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-L1FFVC900I | Xilinx Inc. | Description: IC SOC CORTEX-A53 900FCBGA | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-L1FFVC900I | Xilinx | FPGA - Field Programmable Gate Array XCZU9EG-L1FFVC900I | Produkt ist nicht verfügbar | |||||||||||||||
| XCZU9EG-L2FFVB1156I | Xilinx | auf Bestellung 22 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||
| XCZV4000BF975XCZV | auf Bestellung 20 Stücke: Lieferzeit 21-28 Tag (e) |