XCZU55DR-2FFVE1156I AMD
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details XCZU55DR-2FFVE1156I AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA, Packaging: Tray, Package / Case: 1156-BBGA, FCBGA, Speed: 533MHz, 1.3GHz, Operating Temperature: -40°C ~ 100°C (TJ), Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, Primary Attributes: Zynq® UltraScale+™ RFSoC, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Peripherals: DDR, DMA, PCIe, WDT, Supplier Device Package: 1156-FCBGA (35x35), Architecture: MPU, FPGA.