Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15942) > Seite 5 nach 266
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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18-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3 Packaging: Bulk Number of Pins: 18 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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20-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3 Packaging: Bulk Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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96-080M80 | Aries Electronics |
Description: SOCKET ADAPTER QFP TO 80PGA Number of Pins: 80 Mounting Type: Through Hole Convert From (Adapter End): QFP Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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36-651000-10 | Aries Electronics |
Description: SOCKET ADAPTER 36POS SSOP/DIP .6 Packaging: Bulk Number of Pins: 36 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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52-505-110 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 52PGA Packaging: Bulk Number of Pins: 52 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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32-9513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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14-036-206 | Aries Electronics |
Description: CABLE DIP MALE/FEMALE 14POS GOLD Packaging: Bulk Connector Type: DIP to DIP, Reversed Contact Finish: Gold Color: Multiple, Ribbon Length: 3.00' (914.40mm) Shielding: Unshielded Number of Positions: 14 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: IDC Pitch - Cable: 0.050" (1.27mm) Pitch - Connector: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
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08-600-11 | Aries Electronics |
Description: CONN HDR DIP FORK 8POS GOLD Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
auf Bestellung 306 Stücke: Lieferzeit 10-14 Tag (e) |
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32-655000-10 | Aries Electronics |
Description: SOCKET ADAPTER TSOP TO 32DIP 0.6 Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Silver Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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18-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3 Packaging: Bulk Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 130 Stücke: Lieferzeit 10-14 Tag (e) |
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14-680-191TC | Aries Electronics | Description: CONN HDR MALE PIN 14POS TIN |
Produkt ist nicht verfügbar |
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08-305984-10 | Aries Electronics |
Description: ADAPTER FOR TX2SA Packaging: Bulk For Use With/Related Products: HB2E Relay Accessory Type: Adapter |
Produkt ist nicht verfügbar |
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18-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 94 Stücke: Lieferzeit 10-14 Tag (e) |
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16-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
Produkt ist nicht verfügbar |
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14-823-90C | Aries Electronics |
Description: IC SOCKET 14PIN VERT SCKT HORIZ Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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97-68340-P | Aries Electronics | Description: ADAPTER/PANEL QFP TO PGA 144POS |
Produkt ist nicht verfügbar |
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97-AQ132D | Aries Electronics | Description: SOCKET ADAPTER PQFP TO 132PGA |
Produkt ist nicht verfügbar |
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40-6554-18 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 250°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyetheretherketone (PEEK), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Nickel Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Nickel |
Produkt ist nicht verfügbar |
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44-305263-20 | Aries Electronics | Description: SOCKET ADAPTER QFP TO 44PLCC |
Produkt ist nicht verfügbar |
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44-547-11E | Aries Electronics |
Description: CONN SOCKET SOIC ZIF 44POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SOIC, ZIF (ZIP) Number of Positions or Pins (Grid): 44 (2 x 22) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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14-823-90CV0 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Obsolete |
Produkt ist nicht verfügbar |
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07-001-152FB | Aries Electronics |
Description: CABLE JUMPER 7POS 2.54MM 1" Packaging: Bulk Length: 1.000" (25.40mm) Pitch: 0.100" (2.54mm) Termination Style: Completely Exposed Wires on Both Sides with Protective Tab Cable Type: Ribbon Length - Exposed Ends: 0.125" (3.18mm) Number of Conductors: 7 |
Produkt ist nicht verfügbar |
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08-4513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 1706 Stücke: Lieferzeit 10-14 Tag (e) |
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25-0625-11 | Aries Electronics |
Description: CONN HDR STRIP FORK 25POS GOLD Packaging: Bulk Connector Type: Header Strip Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 25 Pitch: 0.100" (2.54mm) Contact Type: Forked Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 1 |
auf Bestellung 149 Stücke: Lieferzeit 10-14 Tag (e) |
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14-354W00-10 | Aries Electronics |
Description: CONN ADAPTER 14PIN DIP TO SOWIC Packaging: Tube Number of Pins: 14 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead |
Produkt ist nicht verfügbar |
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16-354W00-10 | Aries Electronics |
Description: CONN ADAPTER 16PIN DIP TO SOWIC Packaging: Tube Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Part Status: Active |
Produkt ist nicht verfügbar |
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20-354W00-10 | Aries Electronics |
Description: CONN ADAPTER 20PIN DIP TO SOWIC Packaging: Tube Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead |
Produkt ist nicht verfügbar |
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24-354W00-10 | Aries Electronics |
Description: CONN ADAPTER 24PIN DIP TO SOWIC Packaging: Tube Number of Pins: 24 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Part Status: Active |
Produkt ist nicht verfügbar |
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144-PRS12001-16 | Aries Electronics | Description: CONN SOCKET PGA ZIF GOLD |
Produkt ist nicht verfügbar |
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04-600-11 | Aries Electronics |
Description: CONN HDR DIP FORK 4POS GOLD Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 4 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Number of Rows: 2 |
auf Bestellung 1053 Stücke: Lieferzeit 10-14 Tag (e) |
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04-650-10 | Aries Electronics |
Description: 4PIN HEADER COVER Packaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 4 Accessory Type: Cap (Cover) |
auf Bestellung 714 Stücke: Lieferzeit 10-14 Tag (e) |
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16-304235-10 | Aries Electronics |
Description: 16-PIN SOCKET TO PIN ADAPTER Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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16-304633-18 | Aries Electronics |
Description: SOCKET ADAPTER 20PLCC TO 16DIP Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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08-350000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3 Packaging: Tube Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 705 Stücke: Lieferzeit 10-14 Tag (e) |
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14-350000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3 Packaging: Tube Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 746 Stücke: Lieferzeit 10-14 Tag (e) |
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14-351000-11-RC | Aries Electronics | Description: SOCKET ADAPTER SSOP TO 14DIP 0.3 |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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16-350000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3 Packaging: Tube Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 412 Stücke: Lieferzeit 10-14 Tag (e) |
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16-351000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3 Packaging: Tube Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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18-351000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3 Packaging: Tube Number of Pins: 18 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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18-350000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3 Packaging: Tube Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 107 Stücke: Lieferzeit 10-14 Tag (e) |
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20-350000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3 Packaging: Tube Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 709 Stücke: Lieferzeit 10-14 Tag (e) |
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20-350001-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3 Packaging: Tube Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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20-351000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3 Packaging: Tube Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm) Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP |
auf Bestellung 502 Stücke: Lieferzeit 10-14 Tag (e) |
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24-650000-11-RC | Aries Electronics | Description: SOCKET ADAPTER SOIC TO 24DIP 0.6 |
Produkt ist nicht verfügbar |
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24-350000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3 Packaging: Tube Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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28-650000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6 Packaging: Tube Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 163 Stücke: Lieferzeit 10-14 Tag (e) |
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28-350002-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3 Packaging: Tube Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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28-351000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3 Packaging: Tube Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
auf Bestellung 134 Stücke: Lieferzeit 10-14 Tag (e) |
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28-651000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6 Packaging: Tube Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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32-650000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6 Packaging: Tube Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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32-450001-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4 Packaging: Tube Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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108-PRS12005-12 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-650000-10-P | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6 Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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42-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 42POS TIN Packaging: Tray Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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56-PRS15057-12 | Aries Electronics |
Description: ZIF PGA SOCKET 56PIN 15X15 Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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16-675-191T | Aries Electronics |
Description: CONN HDR MALE PIN 16POS TIN Packaging: Tube Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Contact Type: Male Pin Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Part Status: Active Number of Rows: 2 |
auf Bestellung 126 Stücke: Lieferzeit 10-14 Tag (e) |
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24-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3 Packaging: Bulk Number of Pins: 24 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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10-2810-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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18-6810-90TWR | Aries Electronics | Description: CONN IC DIP SOCKET 18POS TIN |
Produkt ist nicht verfügbar |
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48-6645-18 | Aries Electronics |
Description: SOCKET ADAPTER TQFP TO 48DIP 0.6 Packaging: Bulk Number of Pins: 48 Mounting Type: Through Hole Convert From (Adapter End): TQFP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
18-351000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Bulk
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Bulk
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
20-351000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
96-080M80 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 80PGA
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER QFP TO 80PGA
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
36-651000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER 36POS SSOP/DIP .6
Packaging: Bulk
Number of Pins: 36
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER 36POS SSOP/DIP .6
Packaging: Bulk
Number of Pins: 36
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
52-505-110 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 52PGA
Packaging: Bulk
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER PLCC TO 52PGA
Packaging: Bulk
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
32-9513-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
14-036-206 |
Hersteller: Aries Electronics
Description: CABLE DIP MALE/FEMALE 14POS GOLD
Packaging: Bulk
Connector Type: DIP to DIP, Reversed
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 3.00' (914.40mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Description: CABLE DIP MALE/FEMALE 14POS GOLD
Packaging: Bulk
Connector Type: DIP to DIP, Reversed
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 3.00' (914.40mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Produkt ist nicht verfügbar
08-600-11 |
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 8POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 8POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.27 EUR |
44+ | 2.67 EUR |
132+ | 2.55 EUR |
32-655000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Silver
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER TSOP TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Silver
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
18-350000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.96 EUR |
10+ | 23.01 EUR |
25+ | 22.12 EUR |
50+ | 21.24 EUR |
14-680-191TC |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Description: CONN HDR MALE PIN 14POS TIN
Produkt ist nicht verfügbar
08-305984-10 |
Hersteller: Aries Electronics
Description: ADAPTER FOR TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
Description: ADAPTER FOR TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
Produkt ist nicht verfügbar
18-6810-90T |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.03 EUR |
10+ | 22.18 EUR |
25+ | 21.33 EUR |
50+ | 20.48 EUR |
16-6810-90T |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
14-823-90C |
Hersteller: Aries Electronics
Description: IC SOCKET 14PIN VERT SCKT HORIZ
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: IC SOCKET 14PIN VERT SCKT HORIZ
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
97-68340-P |
Hersteller: Aries Electronics
Description: ADAPTER/PANEL QFP TO PGA 144POS
Description: ADAPTER/PANEL QFP TO PGA 144POS
Produkt ist nicht verfügbar
97-AQ132D |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PQFP TO 132PGA
Description: SOCKET ADAPTER PQFP TO 132PGA
Produkt ist nicht verfügbar
40-6554-18 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Description: CONN IC DIP SOCKET ZIF 40POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Produkt ist nicht verfügbar
44-305263-20 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 44PLCC
Description: SOCKET ADAPTER QFP TO 44PLCC
Produkt ist nicht verfügbar
44-547-11E |
Hersteller: Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
14-823-90CV0 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
Produkt ist nicht verfügbar
07-001-152FB |
Hersteller: Aries Electronics
Description: CABLE JUMPER 7POS 2.54MM 1"
Packaging: Bulk
Length: 1.000" (25.40mm)
Pitch: 0.100" (2.54mm)
Termination Style: Completely Exposed Wires on Both Sides with Protective Tab
Cable Type: Ribbon
Length - Exposed Ends: 0.125" (3.18mm)
Number of Conductors: 7
Description: CABLE JUMPER 7POS 2.54MM 1"
Packaging: Bulk
Length: 1.000" (25.40mm)
Pitch: 0.100" (2.54mm)
Termination Style: Completely Exposed Wires on Both Sides with Protective Tab
Cable Type: Ribbon
Length - Exposed Ends: 0.125" (3.18mm)
Number of Conductors: 7
Produkt ist nicht verfügbar
08-4513-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 1706 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.64 EUR |
10+ | 2.3 EUR |
100+ | 2.05 EUR |
1000+ | 1.47 EUR |
25-0625-11 |
Hersteller: Aries Electronics
Description: CONN HDR STRIP FORK 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Description: CONN HDR STRIP FORK 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 23.39 EUR |
10+ | 20.74 EUR |
100+ | 18.08 EUR |
14-354W00-10 |
Hersteller: Aries Electronics
Description: CONN ADAPTER 14PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Description: CONN ADAPTER 14PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Produkt ist nicht verfügbar
16-354W00-10 |
Hersteller: Aries Electronics
Description: CONN ADAPTER 16PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Description: CONN ADAPTER 16PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Produkt ist nicht verfügbar
20-354W00-10 |
Hersteller: Aries Electronics
Description: CONN ADAPTER 20PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Description: CONN ADAPTER 20PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Produkt ist nicht verfügbar
24-354W00-10 |
Hersteller: Aries Electronics
Description: CONN ADAPTER 24PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Description: CONN ADAPTER 24PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Produkt ist nicht verfügbar
144-PRS12001-16 |
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
04-600-11 |
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 4POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
Description: CONN HDR DIP FORK 4POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
auf Bestellung 1053 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.62 EUR |
60+ | 2.13 EUR |
120+ | 2.03 EUR |
540+ | 1.69 EUR |
1020+ | 1.45 EUR |
04-650-10 |
Hersteller: Aries Electronics
Description: 4PIN HEADER COVER
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 4
Accessory Type: Cap (Cover)
Description: 4PIN HEADER COVER
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 4
Accessory Type: Cap (Cover)
auf Bestellung 714 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.12 EUR |
10+ | 4.69 EUR |
25+ | 4.23 EUR |
50+ | 3.91 EUR |
100+ | 3.63 EUR |
250+ | 3.29 EUR |
500+ | 3.06 EUR |
16-304235-10 |
Hersteller: Aries Electronics
Description: 16-PIN SOCKET TO PIN ADAPTER
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: 16-PIN SOCKET TO PIN ADAPTER
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
16-304633-18 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER 20PLCC TO 16DIP
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER 20PLCC TO 16DIP
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
08-350000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Tube
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Tube
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 705 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.73 EUR |
10+ | 15.15 EUR |
48+ | 12.76 EUR |
96+ | 11.86 EUR |
144+ | 11.37 EUR |
288+ | 10.6 EUR |
528+ | 9.99 EUR |
14-350000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 746 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 39.86 EUR |
10+ | 30.73 EUR |
25+ | 27.83 EUR |
50+ | 25.87 EUR |
100+ | 24.09 EUR |
308+ | 21.55 EUR |
616+ | 20.19 EUR |
14-351000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)16-350000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 412 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 48.68 EUR |
24+ | 34.2 EUR |
48+ | 31.8 EUR |
72+ | 30.5 EUR |
120+ | 28.97 EUR |
264+ | 26.82 EUR |
16-351000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 47.68 EUR |
18-351000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Tube
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Tube
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
18-350000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Tube
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Tube
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 36.85 EUR |
10+ | 32.28 EUR |
25+ | 30.88 EUR |
50+ | 29.89 EUR |
20-350000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 709 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 52.48 EUR |
19+ | 37.82 EUR |
38+ | 35.16 EUR |
57+ | 33.72 EUR |
114+ | 31.43 EUR |
266+ | 28.94 EUR |
513+ | 27.23 EUR |
20-350001-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
20-351000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 44.02 EUR |
19+ | 38.55 EUR |
38+ | 36.88 EUR |
57+ | 35.69 EUR |
114+ | 34.5 EUR |
266+ | 32.6 EUR |
24-650000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Produkt ist nicht verfügbar
24-350000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Tube
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Tube
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 58.8 EUR |
16+ | 43.2 EUR |
32+ | 40.15 EUR |
64+ | 37.39 EUR |
112+ | 35.34 EUR |
28-650000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 119.19 EUR |
10+ | 92.54 EUR |
25+ | 84.1 EUR |
50+ | 78.41 EUR |
100+ | 73.26 EUR |
28-350002-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
28-351000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 43.58 EUR |
14+ | 38.17 EUR |
28+ | 36.52 EUR |
56+ | 35.34 EUR |
112+ | 34.16 EUR |
28-651000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
32-650000-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-450001-11-RC |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
108-PRS12005-12 |
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-650000-10-P |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
42-6554-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Tray
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Tray
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
56-PRS15057-12 |
Hersteller: Aries Electronics
Description: ZIF PGA SOCKET 56PIN 15X15
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: ZIF PGA SOCKET 56PIN 15X15
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
16-675-191T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tube
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tube
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.51 EUR |
10+ | 3.93 EUR |
100+ | 3.51 EUR |
24-351000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
10-2810-90C |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.59 EUR |
10+ | 12.22 EUR |
25+ | 11.51 EUR |
50+ | 11.22 EUR |
100+ | 10.92 EUR |
18-6810-90TWR |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
48-6645-18 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TQFP TO 48DIP 0.6
Packaging: Bulk
Number of Pins: 48
Mounting Type: Through Hole
Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER TQFP TO 48DIP 0.6
Packaging: Bulk
Number of Pins: 48
Mounting Type: Through Hole
Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar