Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15937) > Seite 4 nach 266
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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08-655-10 | Aries Electronics | Description: CONN COVER HEADER 8POS |
Produkt ist nicht verfügbar |
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10-655-10 | Aries Electronics |
Description: CONN COVER HEADER 10POS Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 10 Accessory Type: Cap (Cover) Part Status: Active |
Produkt ist nicht verfügbar |
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12-655-10 | Aries Electronics |
Description: CONN COVER HEADER 12POS Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 12 Accessory Type: Cap (Cover) |
Produkt ist nicht verfügbar |
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14-655-10 | Aries Electronics | Description: CONN COVER HEADER 14POS |
Produkt ist nicht verfügbar |
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16-655-10 | Aries Electronics | Description: CONN COVER HEADER 16POS |
Produkt ist nicht verfügbar |
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18-655-10 | Aries Electronics | Description: CONN COVER HEADER 18POS |
Produkt ist nicht verfügbar |
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20-655-10 | Aries Electronics |
Description: CONN COVER HEADER 20POS Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 20 Accessory Type: Cap (Cover) |
Produkt ist nicht verfügbar |
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22-655-10 | Aries Electronics |
Description: CONN COVER HEADER 22POS Packaging: Bulk For Use With/Related Products: 680 Series Number of Positions: 22 Accessory Type: Cap (Cover) |
Produkt ist nicht verfügbar |
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24-655-10 | Aries Electronics | Description: CONN COVER HEADER 24POS |
Produkt ist nicht verfügbar |
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T-680 | Aries Electronics | Description: HEADER PROGRAMMING TOOL |
Produkt ist nicht verfügbar |
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04-680-190T | Aries Electronics | Description: CONN HDR MALE PIN 4POS TIN |
Produkt ist nicht verfügbar |
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06-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 6POS |
Produkt ist nicht verfügbar |
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08-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 8POS TIN Features: Programmable Packaging: Tray Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Number of Rows: 2 |
auf Bestellung 1017 Stücke: Lieferzeit 10-14 Tag (e) |
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10-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 10POS |
Produkt ist nicht verfügbar |
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12-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 12POS |
Produkt ist nicht verfügbar |
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14-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 14POS |
Produkt ist nicht verfügbar |
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16-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 16POS |
Produkt ist nicht verfügbar |
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18-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 18POS |
Produkt ist nicht verfügbar |
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20-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 20POS TIN Features: Programmable Packaging: Tray Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 20 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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22-680-190T | Aries Electronics |
Description: CONN HDR MALE PIN 22POS TIN Features: Programmable Packaging: Tray Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 22 Pitch: 0.100" (2.54mm) Contact Type: Male Pin Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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24-680-190T | Aries Electronics | Description: CONN HEADER PROGRAMMABLE 24POS |
Produkt ist nicht verfügbar |
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24-650000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6 Packaging: Bulk Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 835 Stücke: Lieferzeit 10-14 Tag (e) |
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32-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6 Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
auf Bestellung 64 Stücke: Lieferzeit 10-14 Tag (e) |
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97-68340 | Aries Electronics | Description: SOCKET ADAPTER QFP TO 144PGA |
Produkt ist nicht verfügbar |
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08-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3 Packaging: Bulk Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 283 Stücke: Lieferzeit 10-14 Tag (e) |
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14-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3 Packaging: Tube Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 343 Stücke: Lieferzeit 10-14 Tag (e) |
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16-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3 Packaging: Bulk Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 177 Stücke: Lieferzeit 10-14 Tag (e) |
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20-350000-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3 Packaging: Bulk Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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28-354000-20 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 28SOIC Packaging: Tube Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
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28-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3 Packaging: Bulk Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
auf Bestellung 117 Stücke: Lieferzeit 10-14 Tag (e) |
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11-0513-10 | Aries Electronics | Description: CONN SOCKET SIP 11POS GOLD |
Produkt ist nicht verfügbar |
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28-526-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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14-600-11 | Aries Electronics |
Description: CONN HDR DIP FORK 14POS GOLD Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
auf Bestellung 316 Stücke: Lieferzeit 10-14 Tag (e) |
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16-354000-20 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 16SOIC Packaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
Produkt ist nicht verfügbar |
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20-680-191T | Aries Electronics | Description: CONN DIP HEADER 20POS .100 |
Produkt ist nicht verfügbar |
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10-2823-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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10-6810-90TWR | Aries Electronics | Description: CONN IC DIP SOCKET 10POS TIN |
Produkt ist nicht verfügbar |
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14-680-191T | Aries Electronics |
Description: CONN HDR MALE PIN 14POS TIN Features: Programmable Packaging: Bulk Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
auf Bestellung 460 Stücke: Lieferzeit 10-14 Tag (e) |
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60-1518-10 | Aries Electronics | Description: CONN IC DIP SOCKET 60POS GOLD |
Produkt ist nicht verfügbar |
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1110748 | Aries Electronics |
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3 Packaging: Bulk Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT Part Status: Active |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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03-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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06-3518-10T | Aries Electronics |
Description: SOCKET W/SOLDER TAIL PINS TIM Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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06-3513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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6-513-10 | Aries Electronics | Description: CONN SOCKET SIP 6POS GOLD |
Produkt ist nicht verfügbar |
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14-35W000-10 | Aries Electronics | Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3 |
Produkt ist nicht verfügbar |
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16-35W000-10 | Aries Electronics | Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3 |
Produkt ist nicht verfügbar |
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18-35W000-10 | Aries Electronics | Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3 |
Produkt ist nicht verfügbar |
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20-35W000-10 | Aries Electronics | Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3 |
Produkt ist nicht verfügbar |
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24-35W000-10 | Aries Electronics | Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3 |
Produkt ist nicht verfügbar |
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28-450001-10 | Aries Electronics |
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4 Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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28-651000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6 Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
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16-680-191T | Aries Electronics |
Description: CONN HDR MALE PIN 16POS TIN Packaging: Tray Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 50.0µin (1.27µm) Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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95-100I25 | Aries Electronics |
Description: SOCKET ADAPTER QFP TO 100PGA Number of Pins: 100 Mounting Type: Through Hole Convert From (Adapter End): QFP Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Obsolete |
Produkt ist nicht verfügbar |
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12-0513-10 | Aries Electronics | Description: CONN SOCKET SIP 12POS GOLD |
Produkt ist nicht verfügbar |
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1109342 | Aries Electronics |
Description: ADAPTER PLCC TO DIP Packaging: Bulk Number of Pins: 44 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
Produkt ist nicht verfügbar |
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28-35W000-10 | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3 Packaging: Bulk Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 106 Stücke: Lieferzeit 10-14 Tag (e) |
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12-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS TIN Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
Produkt ist nicht verfügbar |
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44-647-10 | Aries Electronics | Description: SOCKET UNIV SOIC TO DIP .600 |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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14-351000-10 | Aries Electronics | Description: SOCKET ADAPTER SSOP TO 14DIP 0.3 |
Produkt ist nicht verfügbar |
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16-351000-10 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3 Packaging: Bulk Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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08-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 8POS
Description: CONN COVER HEADER 8POS
Produkt ist nicht verfügbar
10-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Description: CONN COVER HEADER 10POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 10
Accessory Type: Cap (Cover)
Part Status: Active
Produkt ist nicht verfügbar
12-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 12POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 12
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
14-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 14POS
Description: CONN COVER HEADER 14POS
Produkt ist nicht verfügbar
16-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 16POS
Description: CONN COVER HEADER 16POS
Produkt ist nicht verfügbar
18-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 18POS
Description: CONN COVER HEADER 18POS
Produkt ist nicht verfügbar
20-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 20POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 20
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
22-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Description: CONN COVER HEADER 22POS
Packaging: Bulk
For Use With/Related Products: 680 Series
Number of Positions: 22
Accessory Type: Cap (Cover)
Produkt ist nicht verfügbar
24-655-10 |
Hersteller: Aries Electronics
Description: CONN COVER HEADER 24POS
Description: CONN COVER HEADER 24POS
Produkt ist nicht verfügbar
04-680-190T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 4POS TIN
Description: CONN HDR MALE PIN 4POS TIN
Produkt ist nicht verfügbar
06-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 6POS
Description: CONN HEADER PROGRAMMABLE 6POS
Produkt ist nicht verfügbar
08-680-190T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 8POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Description: CONN HDR MALE PIN 8POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
auf Bestellung 1017 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.27 EUR |
10+ | 1.92 EUR |
80+ | 1.72 EUR |
440+ | 1.41 EUR |
945+ | 1.25 EUR |
10-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 10POS
Description: CONN HEADER PROGRAMMABLE 10POS
Produkt ist nicht verfügbar
12-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 12POS
Description: CONN HEADER PROGRAMMABLE 12POS
Produkt ist nicht verfügbar
14-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 14POS
Description: CONN HEADER PROGRAMMABLE 14POS
Produkt ist nicht verfügbar
16-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 16POS
Description: CONN HEADER PROGRAMMABLE 16POS
Produkt ist nicht verfügbar
18-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 18POS
Description: CONN HEADER PROGRAMMABLE 18POS
Produkt ist nicht verfügbar
20-680-190T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 20POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Description: CONN HDR MALE PIN 20POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Number of Rows: 2
Produkt ist nicht verfügbar
22-680-190T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 22POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 22POS TIN
Features: Programmable
Packaging: Tray
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
24-680-190T |
Hersteller: Aries Electronics
Description: CONN HEADER PROGRAMMABLE 24POS
Description: CONN HEADER PROGRAMMABLE 24POS
Produkt ist nicht verfügbar
24-650000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Packaging: Bulk
Size / Dimension: 2.400" L x 0.480" W (60.96mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 835 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 43.3 EUR |
10+ | 37.92 EUR |
25+ | 36.28 EUR |
98+ | 33.94 EUR |
294+ | 32.07 EUR |
32-653000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 72.23 EUR |
10+ | 66.28 EUR |
25+ | 63.73 EUR |
55+ | 61.61 EUR |
97-68340 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 144PGA
Description: SOCKET ADAPTER QFP TO 144PGA
Produkt ist nicht verfügbar
08-350000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 283 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.68 EUR |
10+ | 15.01 EUR |
25+ | 14.13 EUR |
50+ | 13.77 EUR |
100+ | 13.41 EUR |
250+ | 11.96 EUR |
14-350000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 343 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.71 EUR |
10+ | 25.75 EUR |
25+ | 24.4 EUR |
50+ | 24.05 EUR |
100+ | 21.22 EUR |
264+ | 19.8 EUR |
16-350000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.36 EUR |
24+ | 22.48 EUR |
120+ | 19.6 EUR |
20-350000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.13 EUR |
19+ | 25.25 EUR |
114+ | 20.81 EUR |
28-354000-20 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Tube
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
28-351000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.21 EUR |
10+ | 24.94 EUR |
11-0513-10 |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
28-526-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 39.44 EUR |
15+ | 29.1 EUR |
30+ | 27.01 EUR |
60+ | 25.12 EUR |
14-600-11 |
Hersteller: Aries Electronics
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 14POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 316 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.91 EUR |
26+ | 4.22 EUR |
104+ | 3.93 EUR |
16-354000-20 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-680-191T |
Hersteller: Aries Electronics
Description: CONN DIP HEADER 20POS .100
Description: CONN DIP HEADER 20POS .100
Produkt ist nicht verfügbar
10-2823-90C |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
10-6810-90TWR |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Description: CONN IC DIP SOCKET 10POS TIN
Produkt ist nicht verfügbar
14-680-191T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 14POS TIN
Features: Programmable
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
auf Bestellung 460 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.43 EUR |
10+ | 2.12 EUR |
100+ | 1.9 EUR |
60-1518-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
Produkt ist nicht verfügbar
1110748 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.26 EUR |
10+ | 22.39 EUR |
03-0518-10 |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
06-3518-10T |
Hersteller: Aries Electronics
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: SOCKET W/SOLDER TAIL PINS TIM
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
06-3513-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
6-513-10 |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
Produkt ist nicht verfügbar
14-35W000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Produkt ist nicht verfügbar
16-35W000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Produkt ist nicht verfügbar
18-35W000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Produkt ist nicht verfügbar
20-35W000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Produkt ist nicht verfügbar
24-35W000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Produkt ist nicht verfügbar
28-450001-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-651000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
16-680-191T |
Hersteller: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tray
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 50.0µin (1.27µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
95-100I25 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Description: SOCKET ADAPTER QFP TO 100PGA
Number of Pins: 100
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Obsolete
Produkt ist nicht verfügbar
12-0513-10 |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Description: CONN SOCKET SIP 12POS GOLD
Produkt ist nicht verfügbar
1109342 |
Hersteller: Aries Electronics
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: ADAPTER PLCC TO DIP
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-35W000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Size / Dimension: 2.800" L x 0.500" W (71.12mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.4 EUR |
10+ | 23.74 EUR |
25+ | 22.5 EUR |
50+ | 22.18 EUR |
12-6823-90T |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 12POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
44-647-10 |
Hersteller: Aries Electronics
Description: SOCKET UNIV SOIC TO DIP .600
Description: SOCKET UNIV SOIC TO DIP .600
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)14-351000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Produkt ist nicht verfügbar
16-351000-10 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 43.54 EUR |