Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15937) > Seite 7 nach 266
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
28-3553-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-6551-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-6552-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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28-6553-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 250°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyetheretherketone (PEEK), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Nickel Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Nickel Part Status: Active |
Produkt ist nicht verfügbar |
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44-6553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 44POS |
Produkt ist nicht verfügbar |
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28-3551-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-3551-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-3552-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-3552-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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28-3553-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-3553-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-6551-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-6551-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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28-6552-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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28-6552-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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28-6553-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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28-6553-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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1109927-28 | Aries Electronics | Description: SER X55X UNIV ZIF DIP TST SCKT |
Produkt ist nicht verfügbar |
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28-3554-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 24POS |
Produkt ist nicht verfügbar |
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28-3554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 250°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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32-3551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-3552-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-3553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-6551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-6552-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-6553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-3551-10 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS TIN |
Produkt ist nicht verfügbar |
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32-3551-11 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS GLD |
Produkt ist nicht verfügbar |
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32-3552-10 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS TIN |
Produkt ist nicht verfügbar |
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32-3552-11 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS GLD |
Produkt ist nicht verfügbar |
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32-3553-10 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS TIN |
Produkt ist nicht verfügbar |
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32-3553-11 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS GLD |
Produkt ist nicht verfügbar |
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32-6551-10 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS TIN |
Produkt ist nicht verfügbar |
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32-6551-11 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS GLD |
Produkt ist nicht verfügbar |
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32-6552-10 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS TIN |
Produkt ist nicht verfügbar |
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32-6552-11 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS GLD |
Produkt ist nicht verfügbar |
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32-6553-10 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS GLD |
Produkt ist nicht verfügbar |
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32-6553-11 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-3554-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-6554-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 32POS |
Produkt ist nicht verfügbar |
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32-3554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 32POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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32-3554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 32POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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36-3551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 36POS |
Produkt ist nicht verfügbar |
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36-3553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 36POS |
Produkt ist nicht verfügbar |
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36-6551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 36POS |
Produkt ist nicht verfügbar |
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36-6552-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 36POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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36-6553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 36POS |
Produkt ist nicht verfügbar |
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40-3551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 40POS |
Produkt ist nicht verfügbar |
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40-3552-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 40POS |
Produkt ist nicht verfügbar |
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40-3553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 40POS |
Produkt ist nicht verfügbar |
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40-6551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 40POS |
Produkt ist nicht verfügbar |
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40-6552-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 40POS |
Produkt ist nicht verfügbar |
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40-6553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 40POS |
Produkt ist nicht verfügbar |
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42-3551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 42POS |
Produkt ist nicht verfügbar |
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42-3552-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 42POS |
Produkt ist nicht verfügbar |
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42-3553-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 42POS |
Produkt ist nicht verfügbar |
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42-6551-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 42POS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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42-6552-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 42POS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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42-6553-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 42POS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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44-3551-16 | Aries Electronics | Description: CONN IC DIP SOCKET ZIF 44POS |
Produkt ist nicht verfügbar |
28-3553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
28-6553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Part Status: Active
Produkt ist nicht verfügbar
44-6553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
Description: CONN IC DIP SOCKET ZIF 44POS
Produkt ist nicht verfügbar
28-3551-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-3551-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-3552-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-3552-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
28-3553-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-3553-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6551-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6551-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
28-6552-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
28-6552-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
28-6553-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
28-6553-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
1109927-28 |
Hersteller: Aries Electronics
Description: SER X55X UNIV ZIF DIP TST SCKT
Description: SER X55X UNIV ZIF DIP TST SCKT
Produkt ist nicht verfügbar
28-3554-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Description: CONN IC DIP SOCKET ZIF 24POS
Produkt ist nicht verfügbar
28-3554-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
32-3551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-3552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-3553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-6551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-6552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-6553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-3551-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-3551-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Produkt ist nicht verfügbar
32-3552-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-3552-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Produkt ist nicht verfügbar
32-3553-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-3553-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Produkt ist nicht verfügbar
32-6551-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-6551-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Produkt ist nicht verfügbar
32-6552-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Produkt ist nicht verfügbar
32-6552-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Produkt ist nicht verfügbar
32-6553-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Produkt ist nicht verfügbar
32-6553-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-3554-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-6554-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Description: CONN IC DIP SOCKET ZIF 32POS
Produkt ist nicht verfügbar
32-3554-10 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
32-3554-11 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
36-3551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS
Description: CONN IC DIP SOCKET ZIF 36POS
Produkt ist nicht verfügbar
36-3553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS
Description: CONN IC DIP SOCKET ZIF 36POS
Produkt ist nicht verfügbar
36-6551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS
Description: CONN IC DIP SOCKET ZIF 36POS
Produkt ist nicht verfügbar
36-6552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 36POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
36-6553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS
Description: CONN IC DIP SOCKET ZIF 36POS
Produkt ist nicht verfügbar
40-3551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
40-3552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
40-3553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
40-6551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
40-6552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
40-6553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Description: CONN IC DIP SOCKET ZIF 40POS
Produkt ist nicht verfügbar
42-3551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Description: CONN IC DIP SOCKET ZIF 42POS
Produkt ist nicht verfügbar
42-3552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Description: CONN IC DIP SOCKET ZIF 42POS
Produkt ist nicht verfügbar
42-3553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Description: CONN IC DIP SOCKET ZIF 42POS
Produkt ist nicht verfügbar
42-6551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
42-6552-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
42-6553-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
44-3551-16 |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
Description: CONN IC DIP SOCKET ZIF 44POS
Produkt ist nicht verfügbar