Produkte > SAMTEC INC. > Alle Produkte des Herstellers SAMTEC INC. (182299) > Seite 3039 nach 3039
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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|---|---|---|---|---|---|---|---|
| SEAMP-20-02.0-S-06-GP | Samtec Inc. |
 Description: .050" SEARAY HIGH-SPEED HIGH-DENFeatures: Board Guide Packaging: Bulk Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
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SEAMP-20-02.0-L-10 | Samtec Inc. |
Description: CONN HD ARRAY M 200POS PRESS-FIT Packaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
Produkt ist nicht verfügbar |
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| SEAMP-20-02.0-S-08 | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DEN Packaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
Produkt ist nicht verfügbar |
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SEAMP-20-02.0-S-08-GP | Samtec Inc. |
Description: CONN HD ARRAY M 160POS PRESS-FIT Features: Board Guide Packaging: Tube Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
Produkt ist nicht verfügbar |
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| SEAMP-20-02.0-L-10-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DEN Features: Board Guide Packaging: Tube Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
Produkt ist nicht verfügbar |
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| SEAMP-20-02.0-S-10 | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DEN Packaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
Produkt ist nicht verfügbar |
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| SEAMP-20-02.0-S-10-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DEN Features: Board Guide Packaging: Tube Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
Produkt ist nicht verfügbar |
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| MTLW-103-22-G-S-275 | Samtec Inc. |
Description: CONN HEADER VERT 3POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 3 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Square Contact Length - Post: 0.295" (7.49mm) Insulation Height: 0.060" (1.52mm) Shrouding: Unshrouded Overall Contact Length: 0.630" (16.00mm) Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.275" (6.99mm) |
auf Bestellung 1562 Stücke: Lieferzeit 10-14 Tag (e) |
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| TCMD-05-S-03.15-01 | Samtec Inc. |
Description: 2MM DOUBLE ROW MALE IDC ASSEMBLY Packaging: Bulk Connector Type: Plug to Cable Contact Finish: Gold Color: Gray, Ribbon Shielding: Unshielded Number of Positions: 10 Number of Rows: 2 Cable Termination: IDC Pitch - Cable: 0.039" (1.00mm) Pitch - Connector: 0.079" (2.00mm) |
Produkt ist nicht verfügbar |
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| 2SN-BK-G | Samtec Inc. |
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auf Bestellung 8 Stücke: Lieferzeit 14-21 Tag (e) |
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| CES-116-02-T-S | Samtec Inc. |
LOW PROFILE .025" SQUARE STRIPS |
auf Bestellung 59 Stücke: Lieferzeit 14-21 Tag (e) |
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| CLM-105-02-L-D-TR | Samtec Inc. |
CONN RCPT 10POS 0.039 GOLD SMD |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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| CLM-112-02-L-D-BE | Samtec Inc. |
|
auf Bestellung 11 Stücke: Lieferzeit 14-21 Tag (e) |
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| ESQT-130-02-G-Q-368 | Samtec Inc. |
ESQT-130-02-G-Q-368 |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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| TMM-105-02-G-D | Samtec Inc. |
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auf Bestellung 15 Stücke: Lieferzeit 14-21 Tag (e) |
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| TOLC-135-22-L-Q-A | Samtec Inc. |
140 Contacts, 0.635 mm |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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| SMM-110-02-S-S | Samtec Inc. |
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auf Bestellung 21 Stücke: Lieferzeit 14-21 Tag (e) |
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| TS-116-T-AA | Samtec Inc. | CONN HEADER .100" 16POS TIN PCB |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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| TSW-103-14-L-D | Samtec Inc. |
Штыри в плату 2-х рядн 6 конт. шаг 2,54 мм длина контакта 8.13mm |
auf Bestellung 2523 Stücke: Lieferzeit 14-21 Tag (e) |
| SEAMP-20-02.0-S-06-GP |
|
Hersteller: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Features: Board Guide
Packaging: Bulk
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Features: Board Guide
Packaging: Bulk
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Produkt ist nicht verfügbar
| SEAMP-20-02.0-L-10 |
|
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 200POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: CONN HD ARRAY M 200POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Produkt ist nicht verfügbar
| SEAMP-20-02.0-S-08 |
|
Hersteller: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Produkt ist nicht verfügbar
| SEAMP-20-02.0-S-08-GP |
|
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: CONN HD ARRAY M 160POS PRESS-FIT
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Produkt ist nicht verfügbar
| SEAMP-20-02.0-L-10-GP |
|
Hersteller: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Produkt ist nicht verfügbar
| SEAMP-20-02.0-S-10 |
|
Hersteller: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Produkt ist nicht verfügbar
| SEAMP-20-02.0-S-10-GP |
|
Hersteller: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Produkt ist nicht verfügbar
| MTLW-103-22-G-S-275 |
Hersteller: Samtec Inc.
Description: CONN HEADER VERT 3POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 3
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.295" (7.49mm)
Insulation Height: 0.060" (1.52mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.275" (6.99mm)
Description: CONN HEADER VERT 3POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 3
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.295" (7.49mm)
Insulation Height: 0.060" (1.52mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.275" (6.99mm)
auf Bestellung 1562 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.41 EUR |
| TCMD-05-S-03.15-01 |
Hersteller: Samtec Inc.
Description: 2MM DOUBLE ROW MALE IDC ASSEMBLY
Packaging: Bulk
Connector Type: Plug to Cable
Contact Finish: Gold
Color: Gray, Ribbon
Shielding: Unshielded
Number of Positions: 10
Number of Rows: 2
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
Description: 2MM DOUBLE ROW MALE IDC ASSEMBLY
Packaging: Bulk
Connector Type: Plug to Cable
Contact Finish: Gold
Color: Gray, Ribbon
Shielding: Unshielded
Number of Positions: 10
Number of Rows: 2
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
Produkt ist nicht verfügbar
| CES-116-02-T-S |
|
Hersteller: Samtec Inc.
LOW PROFILE .025" SQUARE STRIPS
LOW PROFILE .025" SQUARE STRIPS
auf Bestellung 59 Stücke:
Lieferzeit 14-21 Tag (e)| CLM-105-02-L-D-TR |
|
Hersteller: Samtec Inc.
CONN RCPT 10POS 0.039 GOLD SMD
CONN RCPT 10POS 0.039 GOLD SMD
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)| ESQT-130-02-G-Q-368 |
|
Hersteller: Samtec Inc.
ESQT-130-02-G-Q-368
ESQT-130-02-G-Q-368
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)| TOLC-135-22-L-Q-A |
|
Hersteller: Samtec Inc.
140 Contacts, 0.635 mm
140 Contacts, 0.635 mm
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)| TS-116-T-AA |
Hersteller: Samtec Inc.
CONN HEADER .100" 16POS TIN PCB
CONN HEADER .100" 16POS TIN PCB
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)| TSW-103-14-L-D |
|
Hersteller: Samtec Inc.
Штыри в плату 2-х рядн 6 конт. шаг 2,54 мм длина контакта 8.13mm
Штыри в плату 2-х рядн 6 конт. шаг 2,54 мм длина контакта 8.13mm
auf Bestellung 2523 Stücke:
Lieferzeit 14-21 Tag (e)