SEAMP-20-02.0-L-10 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HD ARRAY M 200POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
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Technische Details SEAMP-20-02.0-L-10 Samtec Inc.
Description: CONN HD ARRAY M 200POS PRESS-FIT, Packaging: Tray, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Through Hole, Number of Positions: 200, Pitch: 0.050" (1.27mm), Height Above Board: 0.181" (4.60mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 7mm, 8mm, 8.5mm, Number of Rows: 10.
Weitere Produktangebote SEAMP-20-02.0-L-10
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SEAMP-20-02.0-L-10 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit |
Produkt ist nicht verfügbar |