ZSSC3170EA3R IDT, Integrated Device Technology Inc
Hersteller: IDT, Integrated Device Technology Inc
Description: IC INTFACE SPECIALIZED SGNL COND
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I²C, LIN, PWM, ZACwire™ One-Wire Interface
Voltage - Supply: 4.75V ~ 5.25V
Applications: Sensor Signal Conditioner - Resistive
Supplier Device Package: 20-DFN (6x5)
Description: IC INTFACE SPECIALIZED SGNL COND
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I²C, LIN, PWM, ZACwire™ One-Wire Interface
Voltage - Supply: 4.75V ~ 5.25V
Applications: Sensor Signal Conditioner - Resistive
Supplier Device Package: 20-DFN (6x5)
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Technische Details ZSSC3170EA3R IDT, Integrated Device Technology Inc
Description: IC INTFACE SPECIALIZED SGNL COND, Packaging: Tape & Reel (TR), Package / Case: 20-VFDFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Interface: I²C, LIN, PWM, ZACwire™ One-Wire Interface, Voltage - Supply: 4.75V ~ 5.25V, Applications: Sensor Signal Conditioner - Resistive, Supplier Device Package: 20-DFN (6x5).
Weitere Produktangebote ZSSC3170EA3R
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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ZSSC3170EA3R | Hersteller : IDT | Sensor Interface DFN / 20 / 6X5MM S1 - TAPE&REEL - 13" |
Produkt ist nicht verfügbar |