XR2A-1611-N Omron Electronics Inc-EMC Div
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Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
5+ | 4.15 EUR |
10+ | 3.78 EUR |
30+ | 3.58 EUR |
60+ | 3.5 EUR |
120+ | 3.33 EUR |
270+ | 2.92 EUR |
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Technische Details XR2A-1611-N Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2A-1611-N nach Preis ab 2.27 EUR bis 4.22 EUR
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XR2A-1611-N | Hersteller : Omron Electronics |
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auf Bestellung 424 Stücke: Lieferzeit 10-14 Tag (e) |
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