Technische Details XC3S2000-4FGG900C Xilinx
Description: IC FPGA 565 I/O 900FBGA, Packaging: Tray, Package / Case: 900-BBGA, Mounting Type: Surface Mount, Number of Gates: 2000000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 46080, Supplier Device Package: 900-FBGA (31x31), Number of LABs/CLBs: 5120, Total RAM Bits: 737280, Number of I/O: 565, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC3S2000-4FGG900C
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XC3S2000-4FGG900C | Hersteller : AMD |
 Description: IC FPGA 565 I/O 900FBGAPackaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 565 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S2000-4FGG900C | Hersteller : AMD / Xilinx |
FPGA - Field Programmable Gate Array XC3S2000-4FGG900C |
Produkt ist nicht verfügbar |