Technische Details XC17S200APDG8I Xilinx
Description: IC PROM SER 200K I-TEMP 8-DIP, Packaging: Tube, Package / Case: 8-DIP (0.300", 7.62mm), Mounting Type: Through Hole, Memory Size: 2MB, Programmable Type: OTP, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3V ~ 3.6V, Supplier Device Package: 8-PDIP, DigiKey Programmable: Verified.
Weitere Produktangebote XC17S200APDG8I
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XC17S200APDG8I | Hersteller : AMD |
Description: IC PROM SER 200K I-TEMP 8-DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Memory Size: 2MB Programmable Type: OTP Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-PDIP DigiKey Programmable: Verified |
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