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WLCW1608HQG75NPB

WLCW1608HQG75NPB Walsin Technology


asc_wlcw1608hq-series_v4.0.pdf Hersteller: Walsin Technology
SMD Wire Wound Ceramic Chip Inductor
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Technische Details WLCW1608HQG75NPB Walsin Technology

Description: INDUCTOR WIRE WOUND 75NH 0603, Packaging: Tape & Reel (TR), Tolerance: ±2%, Package / Case: 0603 (1608 Metric), Size / Dimension: 0.067" L x 0.040" W (1.70mm x 1.02mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Drum Core, Wirewound, Operating Temperature: -40°C ~ 125°C, DC Resistance (DCR): 520mOhm Max, Q @ Freq: 46 @ 150MHz, Frequency - Self Resonant: 1.9GHz, Material - Core: Ceramic, Inductance Frequency - Test: 150 MHz, Supplier Device Package: 0603, Height - Seated (Max): 0.039" (1.00mm), Inductance: 75 nH, Current Rating (Amps): 500 mA.

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WLCW1608HQG75NPB Hersteller : Walsin Technology Corporation WLCW1608HQ.pdf Description: INDUCTOR WIRE WOUND 75NH 0603
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: 0603 (1608 Metric)
Size / Dimension: 0.067" L x 0.040" W (1.70mm x 1.02mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 520mOhm Max
Q @ Freq: 46 @ 150MHz
Frequency - Self Resonant: 1.9GHz
Material - Core: Ceramic
Inductance Frequency - Test: 150 MHz
Supplier Device Package: 0603
Height - Seated (Max): 0.039" (1.00mm)
Inductance: 75 nH
Current Rating (Amps): 500 mA
Produkt ist nicht verfügbar