UPD70F3529GMA-GBK-G Renesas Electronics Corporation

Description: MCU1 V850E2/D V850E2/DX4-H, Packaging: Tray, Package / Case: 176-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 2MB (2M x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 32K x 8, Core Processor: V850E2M, Data Converters: A/D 12x10b, 12x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB, Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT, Supplier Device Package: 176-HLQFP (24x24), Number of I/O: 127.